Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has begun mass production of Exynos 7 Quad 7570, the company’s newest mobile application processor (AP) built on 14-nanometer (nm) process technology for the budget smartphone market as well as other IoT devices. Being the first mobile AP in its class designed with the advanced process node, Exynos 7570 is also the first Exynos processor to fully integrate a Cat.4 LTE 2CA modem and connectivity solutions including WiFi, Bluetooth, frequency modulation (FM) and global navigation satellite system (GNSS) in one chip.

“With Exynos 7570, more consumers will be able to experience the performance benefits of the advanced 14nm FinFET process in affordable devices,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics. “By successfully integrating various connectivity solutions, Samsung is strengthening its competitiveness in the single chip market”

Last year, Samsung was the first in the industry to adopt advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. As part of such efforts, Exynos 7570 is the first in its class with 14nm FinFET, making it highly power-efficient while enabling outstanding performance.

Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 percent improvements in CPU performance and 30 percent improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS.

Additionally, with design optimization and feature consolidation for components such as PMICs (power management IC) and RF (radio frequency) functionalities, Exynos 7570 reduces the total chipset size by up to 20 percent, giving manufacturers better ability to craft slimmer smartphones.

By supporting screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras, Exynos 7570 presents a wide array of benefits for smartphone users.

For more information about Samsung’s Exynos products, please visit www.samsung.com/exynos

In leading mass production of advanced FinFET logic process, Samsung announced in Q1 of 2015 the launch of the Exynos 7 Octa processor built on the industry’s first 14nm LPE (Low-Power Early) process. With the new 14nm LPP process, Samsung continues to demonstrate its process technology leadership, and unparalleled performance and power efficiency for its Exynos 8 Octa processor and its many foundry customers including Qualcomm Technologies, Inc.. The Qualcomm® Snapdragon 820 processor uses Samsung’s new 14nm LPP process and is expected to be in devices in the first half of this year.

“We are pleased to start production of our industry-leading, 2nd generation 14nm FinFET process technology that delivers the highest level of performance and power efficiency” said Charlie Bae, Executive Vice President of Sales & Marketing, System LSI Business, Samsung Electronics. “Samsung will continue to offer derivative processes of its advanced 14nm FinFET technology to maintain our technology leadership.”

Incorporating three-dimensional (3D) FinFET structure on transistors enables significant performance boost and low power consumption. Samsung’s new 14nm LPP process delivers up to 15 percent higher speed and 15 percent less power consumption over the previous 14nm LPE process through improvements in transistor structure and process optimization. In addition, use of fully-depleted FinFET transistors brings enhanced manufacturing capabilities to overcome scaling limitations.

With its superb characteristics, 14nm FinFET process is considered to be one of the most optimized solutions for mobile and IoT applications and is expected to meet growing market demand for a wide range of high performance and power efficient applications from network to automotive.

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“Samsung’s advanced 14nm FinFET process technology is undoubtedly the most advanced logic process technology in the industry,” said Gabsoo Han, Executive Vice President of Sales & Marketing, System LSI Business, Samsung Electronics. “We expect the production of our 14nm mobile application processor to positively impact the growth of the mobile industry by enabling further performance improvements for cutting-edge smartphones.”

As the most advanced technology available today, 14nm FinFET process is able to achieve the highest levels of efficiency, performance and productivity. When compared to Samsung’s 20nm process technology, this newest process enables up to 20 percent faster speed, 35 percent less power consumption and 30 percent productivity gain.

By successfully incorporating three-dimensional (3D) FinFET structure on transistors, Samsung has overcome performance and scaling limitations of the planar structure used in previous 20nm and older processes and gained a significant competitive edge in advanced semiconductors for the mobile industry.

This ground-breaking accomplishment is a result of Samsung’s unparalleled R&D efforts in FinFET technology since the early 2000s. Starting with a research article presented at IEDM (International Electron Devices Meeting) in 2003, Samsung has continuously made progress and announced its technological achievements in FinFET research and has also filed a pool of key patents in the field.

As for memory, Samsung has been successfully mass producing its proprietary 3D V-NAND products since 2013. Together with its 3D transistor based FinFET process technology, Samsung has strengthened its leadership in 3D semiconductors in both memory and logic semiconductors that addresses the current scaling limitations with planar designs.

Samsung’s leading-edge14nm FinFET process will be adopted by its Exynos 7 Octa, then expanded to other products throughout the year.