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		<title>14nm &#8211; Samsung Global Newsroom</title>
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            <title>14nm &#8211; Samsung Global Newsroom</title>
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				<title>Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM</title>
				<link>https://news.samsung.com/global/samsung-starts-mass-production-of-most-advanced-14nm-euv-ddr5-dram</link>
				<pubDate>Tue, 12 Oct 2021 11:00:52 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[14nm]]></category>
		<category><![CDATA[14nm DDR5]]></category>
		<category><![CDATA[14nm DRAM]]></category>
		<category><![CDATA[DDR5]]></category>
		<category><![CDATA[DDR5 DRAM]]></category>
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									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company’s shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver […]]]></description>
																<content:encoded><![CDATA[<p><img class="alignnone size-full wp-image-127654" src="https://img.global.news.samsung.com/global/wp-content/uploads/2021/10/Samsung-14nm-DDR5_main1.jpg" alt="" width="1000" height="708" /></p>
<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company’s shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s finest, most advanced DRAM process for its DDR5 solutions.</p>
<p>“We have led the DRAM market for nearly three decades by pioneering key patterning technology innovations,” said Jooyoung Lee, Senior Vice President and Head of DRAM Product & Technology at Samsung Electronics. “Today, Samsung is setting another technology milestone with multi-layer EUV that has enabled extreme miniaturization at 14nm — a feat not possible with the conventional argon fluoride (ArF) process. Building on this advancement, we will continue to provide the most differentiated memory solutions by fully addressing the need for greater performance and capacity in the data-driven world of 5G, AI and the metaverse.”</p>
<p>As DRAM continues to scale down the 10nm-range, EUV technology becomes increasingly important to improve patterning accuracy for higher performance and greater yields. By applying five EUV layers to its 14nm DRAM, Samsung has achieved the highest bit density while enhancing the overall wafer productivity by approximately 20%. Additionally, the 14nm process can help bring down power consumption by nearly 20% compared to the previous-generation DRAM node.</p>
<p><img class="alignnone size-full wp-image-127668" src="https://img.global.news.samsung.com/global/wp-content/uploads/2021/10/Samsung-14nm-DDR5_main2FFF.jpg" alt="" width="1000" height="550" /></p>
<p>Leveraging the latest DDR5 standard, Samsung’s 14nm DRAM will help unlock unprecedented speeds of up to 7.2 gigabits per second (Gbps), which is more than twice the DDR4 speed of up to 3.2Gbps.</p>
<p><img class="alignnone size-full wp-image-127669" src="https://img.global.news.samsung.com/global/wp-content/uploads/2021/10/Samsung-14nm-DDR5_main3F.jpg" alt="" width="1000" height="400" /></p>
<p>Samsung plans to expand its 14nm DDR5 portfolio to support data center, supercomputer and enterprise server applications. Also, Samsung expects to grow its 14nm DRAM chip density to 24Gb in better meeting the rapidly-growing data demands of global IT systems.</p>
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					<item>
				<title>[Infographic] Samsung’s 14nm FinFET AP Lineup Exynos Series</title>
				<link>https://news.samsung.com/global/infographic-samsungs-14nm-finfet-ap-lineup-exynos-series</link>
				<pubDate>Wed, 12 Oct 2016 17:00:18 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2016/10/Infographic-Samsungs-14nm-FinFET-AP-Lineup-Exynos-Series_Thumb704_F.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Infographics]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[14nm]]></category>
		<category><![CDATA[AP]]></category>
		<category><![CDATA[application processors]]></category>
		<category><![CDATA[Exynos]]></category>
		<category><![CDATA[Exynos APs]]></category>
		<category><![CDATA[FinFET]]></category>
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									<description><![CDATA[Samsung introduced its 14nm FinFET application processors (AP) to the industry in early 2015 and has continued to modify the technology to best meet the needs of today’s consumers. From the powerful Exynos APs for premium mobile devices to a more compact version designed specifically for wearables, Samsung features a strong lineup that brings the benefits […]]]></description>
																<content:encoded><![CDATA[<p>Samsung introduced its 14nm FinFET application processors (AP) to the industry in early 2015 and has continued to modify the technology to best meet the needs of today’s consumers.</p>
<p>From the powerful Exynos APs for premium mobile devices to a more compact version designed specifically for wearables, Samsung features a strong lineup that brings the benefits of cutting-edge technology to the devices people use every day.</p>
<p><a href="https://img.global.news.samsung.com/global/wp-content/uploads/2016/10/Infographic-Samsungs-14nm-FinFET-AP-Lineup-Exynos-Series_Main_F.jpg"><img loading="lazy" class="alignnone size-full wp-image-79115" src="https://img.global.news.samsung.com/global/wp-content/uploads/2016/10/Infographic-Samsungs-14nm-FinFET-AP-Lineup-Exynos-Series_Main_F.jpg" alt="[Infographic] Samsung's 14nm FinFET AP Lineup Exynos Series_Main_F" width="705" height="912" /></a></p>
<p><em><span style="font-size: small">*All functionality features, specifications and other product information provided in this document including, but not limited to, the benefits, design, pricing, components, performance, availability and capabilities of the product are subject to change without notice or obligation.</span></em></p>
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