Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its Exynos Auto 8890 processor will be powering German automobile manufacturer Audi’s third generation high-spec modular infotainment platform (MIB). The advanced in-vehicle infotainment (IVI) system will be equipped as standard in the new A4 and upcoming models.

The MIB is Audi’s technology that anticipates the drivers’ needs by keeping up with the latest advancements in information and entertainment equipment of its premium vehicles. Introduced in the reworked A4 and upcoming in further models, the latest generation of the MIB will incorporate Samsung’s Exynos Auto 8890, which had been selected for Audi’s next-generation IVI system in 2017 through Audi’s Progressive SemiConductor Program (PSCP). 

The Exynos Auto 8890 is a powerful processor with an octa-core CPU and twelve-core GPU designed to seamlessly run Audi’s Multi Media Interface (MMI) and its features such as audio, vehicle status control and navigation display on the IVI system. With powerful performance along with multi-OS and multi-display support, the Exynos Auto 8890 delivers a highly interactive user experience on up to four different domains.

“To Audi, mobility isn’t just about getting to the destination, it’s about getting there safely and delightfully,” said Alfons Pfaller, head of Architecture & Platform Development E/E at Audi. “We have worked closely with Samsung over the past few years to provide our customers with an in-vehicle infotainment (IVI) system that includes the newly upgraded Multi Media Interface that responds instantly and accurately to the user’s controls for a premium driving experience.”

“With a premium automobile brand like Audi, the driving experience is expected to be not only high performing and safe but also exhilarating,” said Kenny Han, vice president of Device Solutions Division at Samsung Electronics. “Through close-collaboration with Audi, we are excited that Samsung’s Exynos Auto 8890 will be powering their new in-vehicle infotainment system that will open new possibilities for smarter and more enjoyable driving experiences.”

The new Audi A4 with Exynos Auto 8890-powered IVI system will be available in Europe starting in the fall.

For more information about Samsung’s Exynos products, please visit http://www.samsung.com/exynos.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its first automotive-branded processor, Exynos Auto V9, has been selected to power Audi’s next-generation in-vehicle infotainment (IVI) system, which is expected to make its debut by 2021.

Exynos Auto V9 is a powerful automotive processor designed for advanced IVI systems that display content on multiple displays, providing information that assists drivers and passengers for a safer and more enjoyable in-vehicle experience. Based on cutting-edge 8-nanometer (nm) process technology, the V9 packs ARM’s latest Cortex-A76 CPU cores, ARM Mali G76 GPU, premium HiFi 4 audio digital signal processor (DSP), intelligent neural processing unit (NPU), and a safety island core that supports Automotive Safety Integrity Level (ASIL)-B standards. The processor also supports fast and power-efficient LPDDR4 and LPDDR5 DRAM.

“Audi thrives to bring the most exciting, yet the safest automobiles when we vision the drive of tomorrow,” said Alfons Pfaller, head of Architecture & Platform Development E/E at Audi. “Samsung has been a valued technology partner over the past few years and we are extremely pleased to have the Exynos Auto V9 power our next-generation platform that will shape the future in-vehicle infotainment experiences.”

“Samsung is fully committed to bringing top-of-the-line automotive processors for safer and more pleasant driving experiences,” said Kenny Han, vice president of Device Solutions Division at Samsung Electronics. “We are thrilled to introduce the new Exynos Auto line of products, starting with the Exynos Auto V9, which brings powerful processing performance to the next generation of automotive in-vehicle infotainment systems while meeting the industry’s strict reliability requirements.”

To deliver highly immersive driving experiences, Exynos Auto V9 supports up to six displays and twelve camera connections for various sub-system content in premium IVI systems. The V9 is powered by eight Cortex-A76 cores at speeds up to 2.1 gigahertz (GHz). The GPU is arranged in three separate dedicated sets of Mali G76 GPU cores that are able to seamlessly support multiple systems such as the cluster display, central information display (CID) and rear-seat entertainment (RSE) simultaneously. For premium audio quality, the chip comes with four HiFi 4 audio processors that provide captivating audio experiences with vivid and realistic sounds.

Functional safety is especially critical when it comes to automotive components. Exynos Auto V9’s embedded safety island allows real-time protection for system operations, facilitating ASIL-B requirements.

In addition, the V9 is equipped with an NPU for a digital concierge service that can intelligently manage a safe and personalized driving environment. With incredibly fast operations, the NPU can process visual and audio data for features such as face, speech or gesture recognition.

For more information about Samsung’s Exynos products, please visit http://www.samsung.com/exynos.

TTTech has been active in the automotive space for years, providing technology to a variety of manufacturers. Samsung’s future investment complements TTTech’s longstanding partnership with AUDI AG and their combined efforts in highly automated piloted driving systems for Volkswagen Group. TTTech’s safety technologies power the zFAS piloted control platform in the 2017 Audi A8.

Beyond automotive, TTTech has improved the safety and reliability of networked computer systems in the aerospace and industrial sectors, with its technologies found in the Boeing 787 Dreamliner and NASA’s Orion spacecraft.

“Automotive advances like autonomous controls and advanced driver assistance systems will have a profound impact on society—from transforming urban spaces to bringing mobility to aging populations.   At Samsung, we see it as our responsibility to invest in the technologies that will revolutionize the way we live, work, and connect with one another,” said Young Sohn, President and Chief Strategy Officer of Samsung Electronics and Chairman of the Board for HARMAN. “TTTech has demonstrated a remarkable ability to innovate and build world-class technologies and platforms. This is a seminal moment for Samsung and our Automotive Innovation Fund, and we look forward to working with leading OEMs like Audi and the entire TTTech team to set a new standard for automotive-safety technology.”

“We’re excited about Samsung’s commitment to TTTech and the joint creation of new architecture for open autonomous and ADAS technologies, involving multiple key automotive players and suppliers,” said Alejandro Vukotich, Vice President Autonomous Driving of AUDI AG.

“We are very proud to have Samsung as an investor and partner in TTTech to create solutions for the next generation of highly integrated and data-intensive safety systems” said Georg Kopetz, Member of the Board at TTTech. “Samsung brings a breadth and a depth of technologies as well as an ecosystem of partners to accelerate development for level 2 to level 5 autonomous platforms.”

“Together we will build products to support new NCAP requirements, solutions for in-vehicle infotainment systems, and new scalable architectures to support fully autonomous vehicles across various industries,” stated Stefan Poledna, Member of the Board at TTTech.

At a transformative moment for the auto industry, TTTech plans to use Samsung’s investment to accelerate the growth of its safety technology for autonomous driving and operations. The company’s collaborative and flexible technology—like its new open safety platform, MotionWise—enables OEMs and Tier-1 suppliers to accelerate the development, integration, and validation of new capabilities in their vehicles.

Together, Samsung and HARMAN are fostering the development of cutting-edge automotive safety technologies like those from TTTech, which will raise the bar for automotive safety controls and ADAS throughout the industry.  HARMAN, a Tier 1 supplier, now makes TTTech’s open safety solutions available to the leading global automotive OEMs.

President Young Sohn will join Ricky Hudi, founder and managing director of Future Mobility Technologies, and other industry experts on TTTech Auto division’s new supervisory board.

About TTTech

TTTech is a global leader in the field of robust networking and safety controls. TTTech solutions improve the safety and reliability of electronic systems in the industrial and transportation sectors, with a portfolio of products that are helping to make the Industrial Internet of Things and autonomous driving a reality.

Thanks to the platform-based architecture, TTTech Auto’s production proven solutions enable simple system integration with shorter time-to-market and significant cost reductions for customers. TTTech solutions support highly scalable and modular open real-time control architectures based on Deterministic Ethernet and operates within a rich ecosystem of technology partners.

More information about TTTech and TTTech Auto is available at www.tttech.com

Forward Looking Statement

This press release contains certain “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995, as amended, including but are not limited to, statements regarding the benefits of the strategic partnership between Samsung and TTTech Auto;  the development of next-generation solutions for auto safety systems; and the ability of TTTech technology to enable OEMs and other customers to build advance auto safety solutions. These and any other forward-looking statements in this release are based on the parties’ current expectations of future events and are subject to a number of risks and uncertainties that could cause actual results to differ materially and adversely from those set forth in or implied by such forward-looking statements. These risks and uncertainties include, but are not limited to, changes in the markets and the regulatory environment of automobile technology industries, difficulties in integrating technologies of the parties in the partnership, the inability of the new solutions to achieve wide market acceptance, and the ability to compete with other products in the market. The companies are providing the information in this release as of this date and do not undertake any obligation to update any forward-looking statements contained in this release as a result of new information, future events or otherwise.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its participation in the Audi Progressive SemiConductor Program (PSCP) as a partner supplier of Exynos processors, its own System-on-Chip (SoC) solution, for Audi’s In Vehicle Infotainment (IVI) system.

Audi’s PSCP was first initiated in 2010 to quickly implement the latest technologies that satisfy its highest standard in robustness, performance and quality for automobiles. As a key partner, Samsung will be supplying its flagship Exynos processors for Audi’s next-generation IVI system.

“With Exynos processors, Samsung has proven its technology leadership in performance, reliability and innovative packaging solutions, ” said Alfons Pfaller, Head of Infotainment Development at Audi. “Through the PSCP, Samsung and Audi will work together to bring the best in-vehicle infotainment experience at the automotive quality level expected from the Audi brand.”

“We are very thrilled to be a part of the rapidly advancing automobile technology,” said Charlie Bae, Executive Vice President of Sales and Marketing, System LSI Business at Samsung Electronics. “Samsung is fully dedicated to delivering robust and reliable yet high-performing solution to Audi for the next level of driving enjoyment.”

With multiple OS and multi-display support, flagship Exynos processors can operate up to four different domains and displays stationed in the vehicle at once. Exynos processors’ powerful computing and graphic processing performance delivers highly graphical user interface on displays for deeper user engagement.

Since 2010, Samsung’s Exynos processors have powered the highest performing smart devices ranging from smartphones and laptops to navigation systems, delivering the ultimate experiences to consumers. Through the adoption of advanced technology and optimization for automobiles, Samsung is committed to bringing top-of-the-line performance for safer and more pleasant driving experience.

The Audi Progressive SemiConductor Program is designed to make the latest semiconductor technologies available in cars, while increasing reliability, with the aim of intensifying the role and engagement of semiconductor companies in the process. Based on the strategic partnership, Samsung will provide its latest leading-edge memory products including 20-nanometer LPDDR4 DRAM and 10-nanometer class eMMC (embedded multimedia card) 5.1 to Audi’s future infotainment, dashboard and ADAS (Advanced Driver Assistance Systems) automotive applications.

“It is an exciting moment to offer our industry leading memory solutions to embrace the rapidly growing automotive industry,” said Dr. Kinam Kim, president of Semiconductor Business at Samsung Electronics’ Device Solutions Division. “Based on this partnership, Samsung will bring various benefits and advanced user experience to the global automotive market while providing high quality memory products with excellent performance and enhanced reliability.”

“Samsung is leading memory technology development with its high-performance, high-density DRAM and NAND flash memory solutions based on the industry’s most advanced process technology”, said Ricky Hudi, Executive Vice President Electronic Development at Audi. “Through the PSCP strategic partnership with Samsung, Audi will utilize Samsung’s high speed memory products to provide the best user experience to our customers. Both parties are committed to achieving the quality levels that people expect from the Audi brand”.

According to a recent report by Gartner, the global automotive semiconductor market is expected to grow from US $31.2 billion in revenue to US $32.7 billion in 2016 approximately, while the automotive memory market portion will reach a 4.6% percent share or about US $1.5 billion in 2016. The PSCP collaboration will illustrate next generation car applications at the highest safety and comfort level with enhanced reliability as well as improved performance, and will strengthen Samsung and Audi’s competitiveness in the global automotive industry.