Samsung Electronics, a world leader in advanced digital component solutions, today announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-leading efficacy and reliability for spotlights and high-bay lighting applications.

The LM101B and the LH231B packages are based on Samsung’s state-of-the-art, fillet-enhanced CSP (FEC) technology, which forms TiO2 walls around the chip surface to reflect its light output toward the top, acting as a plastic mold in conventional EMC-based LEDs.

With their FEC design, the packages provide a higher light efficacy level compared to Samsung’s previous generation of CSP LEDs*. The more focused beam also helps to eliminate cross-talk between neighboring packages and enables the new packages to be placed in close proximity to one another, offering greater flexibility to luminaire designers.

“Our FEC line-up represents an outstanding set of highly advanced LED component solutions that accommodates a variety of luminaire designs from below 1,000lm to well over 10,000lm,” said Jacob Tarn, executive vice president of LED Business Team at Samsung Electronics. “Samsung will continue to pave the way for widespread adoption of CSP technology in the mainstream lighting market, bringing greater performance and cost benefits to a growing number of lighting manufacturers.”

LM101B: 1W-class mid-power FEC

The LM101B features the highest efficacy among currently available mid-power CSP LEDs with 200lm/W (Ra80 5000K, 65mA, 25˚C). Furthermore, with low thermal resistance (2K/W) and high reliability (0.5W, 105˚C, L90>50000 hours), the LM101B has been optimized for spotlights and high-bay applications where high efficacy and long lifespan are required.

LH231B: 5W-class high-power FEC

With an operating current of 2A (max. 6W), the LH231B offers an efficacy of 170lm/W (Ra70 5000K, 700mA, 85˚C). This is the same high efficacy level offered by ceramic-based high-power LEDs, one that can bring a high degree of cost-effectiveness when applied to high-bay applications that require an output between 5,000 and 10,000lm. Thanks to Samsung’s FEC structure, the 120-degree beam angle allows for simple optic designs, making it also suitable for outdoor applications, such as street and parking lot lighting.

The LM101B and LH231B complement the currently available 3W-class high-power LH181B CSP LED, and the entire FEC lineup is now in mass production.

*Editorial Note: Previous-generation CSP LEDs create a wider beam angle by emitting light through the top and side surfaces of a package that has been coated in phosphor film.

Samsung Electronics, a world leader in advanced component solutions, today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.

“Our new CSP LED modules provide an optimal solution for lighting manufacturers who seek highly compatible and reliable LED components,” said Jacob Tarn, Executive Vice President, LED Business Team at Samsung Electronics. “Samsung will continue to strengthen its CSP technology leadership and spearhead new innovations in LED component technology to bring greater value to our customers.”

The new LED modules are Samsung’s first to incorporate CSP technology, which bring a wide range of lighting benefits such as significantly reducing the size of a conventional LED package. The combination of advanced flip chip and phosphor coating technology eliminates metal wires and plastic molds to enable more compact designs when manufacturing LED modules and fixtures.

In addition to their size advantage, Samsung’s new CSP LED modules deliver further characteristics that furnish seamless tunable color. A color-tunable LED module requires twice the number of LED packages in cool and warm temperature, which work in combination on the same board to create a range of tunable colors. In contrast to conventional plastic-molded LED packages that inevitably increase the size of the modules, Samsung’s ultra-compact chip scale LED packages allow the module size to remain unchanged.

Samsung’s new CSP LED modules are available in two form factors (19x19mm or 28x28mm) and are designed following Zhaga specifications, making them highly convenient in assembling. The modules also provide high-quality lighting in diverse beam angle options – spot, medium, wide – for improved compatibility with the optical solutions of Samsung’s partners. The new modules are based on CSP LED packages that have successfully completed 9,000 hours of LM-80 testing, a level of proven performance that reduces the time to market for lighting manufacturers.

Samsung is now sampling six models of the new CSP LED module in CRI 80 and 90 with varying lumen output, size and CCT specifications. The full line-up includes:

*Based on CRI 80

Samsung Electronics, a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP”, a line-up of LED packages which features chip-scale packaging* and flexible circuit board technology, for use in automotive lighting applications.

“Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team, Samsung Electronics. He added that, “We will continue to introduce innovative LED products and technologies, such as multi-chip array technology, that can play a key role in the growth of the automotive LED lighting industry.”

Samsung’s new Fx-CSP provides an advanced combination of chip-scale packaging and flexible circuit board technology, which together enable more compact chip sizing and a higher degree of reliability. The use of a flexible circuit board also enables more heat to dissipate, which leads to lower resistance and brings about a greater degree of lumen-per-watt efficiency than using a ceramic board.

In addition, the new Samsung automotive LED line-up allows car designers to use a variety of chip arrangements such as a single chip, a 1 by 4, or a 2 by 6 multi-chip arrangement to suit different lighting configurations. The Fx-CSP line-up can be widely used in automotive lighting applications that include position lamps** and daytime** running lamps as well as headlamps** that require higher luminous flux and reliability than other automotive lamps.

The Fx-CSP line-up consists of single packages, Fx1M and Fx1L, with 1-3 watts each, as well as packages with a 14W high voltage array, Fx4 and a 40W high voltage array, Fx2x6. The variation in wattage levels allows Samsung LED lighting packages to work well with a wide range of exterior automotive lighting.

By adding the new Fx-CSP line-up to its existing mid-power and high-power automotive LED component line-ups, Samsung now provides a highly competitive family of automotive lighting components.

Samsung’s new Fx-CSP LED line-up was recently selected for a compact car headlamp project from one of the major global automotive manufacturers.

Samsung plans to introduce more CSP technology-based LED components such as the new Fx-CSP line-up for automotive lighting, later this year.

*Note 1: Samsung’s chip-scale package (CSP) is combination of advanced flip chip technology and phosphor coating technology. A CSP chip can be created by flipping over blue LED chips and then immediately coating them with a phosphor substance.

**Note 2:
Position Lamp: A lamp used to make a car conspicuous and indicate the width of a vehicle at nighttime.
Daytime Running Lamp: A lamp facing forward, used to make the vehicle more easily visible when driving during the day.
Headlamp: A lamp used to illuminate the road over a long distance ahead of the vehicle under low light conditions.