Samsung Electronics, a world leader in advanced digital component solutions, today announced that it has achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B, LH181B and LH231B.

Initially chip-scale package (CSP) LEDs had not been widely used in mainstream LED lighting markets due to relatively lower efficacy levels compared to conventional LED packages. However, the newly upgraded, efficacy-leading FECs can be applied to most mainstream LED lighting environments, including ambient, downlight, spotlight, high bay, canopy and street lighting applications.

“Since introducing CSP technology to the industry in 2014, we have put extensive effort into advancing the performance levels and design flexibility of every one of our CSP LEDs,” said Yoonjoon Choi, Vice President of the LED Business Team at Samsung Electronics. “Samsung will continue to bolster its competitive edge in CSP technology, enabling the widest variety of luminaire designs with exceptional performance, reliability and cost benefits for lighting manufacturers worldwide.”

The enhanced FEC LEDs are based on Samsung’s most up-to-date CSP technology which builds TiO₂ (Titanium dioxide) walls around the side surfaces of the chip to direct light output upwards. The technology provides considerably higher light efficacy than conventional CSP LEDs while offering greater flexibility for luminaire designers. Moreover, dramatically reduced cross-talk between neighboring packages allows each package to be placed in close proximity to one another.

Building on these advancements, the revamped FEC LED packages achieve the industry’s highest light efficacy levels, to suit an even wider range of lighting applications. The mid-power CSP, LM101B, features an increased efficacy of 205 lm/W (65mA, CRI 80+, 5000K), which is the highest among 1W-class, mid-power CSP LEDs. The 3W-class LH181B provides the highest light efficacy in its class with 190lm/W (350mA, CRI 70+, 5000K) which represents a more than 10-percent enhancement over the previous version. The 5W-class LH231B package continues to offer 170lm/W (700mA, CRI 70+, 5000K), the industry’s highest efficacy for the 5W class.

With Samsung FEC’s small form factor and reduced cross-talk, the LM101B is particularly well suited for spotlighting applications where packages can be densely placed within a small light-emitting surface area. Samsung also made the LM101B much simpler to mount compared to other mid-power CSP LEDs, by modifying the electrode pad.

In addition, the LH181B operates at a maximum current of 1.4A (Amps), making it an ideal component for high-power LED luminaires requiring superior lumen density.

The Samsung FEC lineup, now in mass production, is available in a full range of color temperature (CCT) and color rendering index (CRI) options. Samsung will be showcasing its complete lineup at Light + Building 2018 in Frankfurt, Germany, March 18-23. Please visit Booth B04, Hall 6.2 to learn more about these state-of-the-art LED component solutions and dozens more.

Samsung Electronics, a world leader in advanced component solutions, today announced a new line-up of chip scale package (CSP) LED modules for spotlights and downlights that features color tunability and increased design compatibility.

“Our new CSP LED modules provide an optimal solution for lighting manufacturers who seek highly compatible and reliable LED components,” said Jacob Tarn, Executive Vice President, LED Business Team at Samsung Electronics. “Samsung will continue to strengthen its CSP technology leadership and spearhead new innovations in LED component technology to bring greater value to our customers.”

The new LED modules are Samsung’s first to incorporate CSP technology, which bring a wide range of lighting benefits such as significantly reducing the size of a conventional LED package. The combination of advanced flip chip and phosphor coating technology eliminates metal wires and plastic molds to enable more compact designs when manufacturing LED modules and fixtures.

In addition to their size advantage, Samsung’s new CSP LED modules deliver further characteristics that furnish seamless tunable color. A color-tunable LED module requires twice the number of LED packages in cool and warm temperature, which work in combination on the same board to create a range of tunable colors. In contrast to conventional plastic-molded LED packages that inevitably increase the size of the modules, Samsung’s ultra-compact chip scale LED packages allow the module size to remain unchanged.

Samsung’s new CSP LED modules are available in two form factors (19x19mm or 28x28mm) and are designed following Zhaga specifications, making them highly convenient in assembling. The modules also provide high-quality lighting in diverse beam angle options – spot, medium, wide – for improved compatibility with the optical solutions of Samsung’s partners. The new modules are based on CSP LED packages that have successfully completed 9,000 hours of LM-80 testing, a level of proven performance that reduces the time to market for lighting manufacturers.

Samsung is now sampling six models of the new CSP LED module in CRI 80 and 90 with varying lumen output, size and CCT specifications. The full line-up includes:

*Based on CRI 80