Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7^th annual Samsung Foundry Forum (SFF) 2023.

Under the theme “Innovation Beyond Boundaries,” this year’s forum delved into Samsung Foundry’s mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year’s event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

“Samsung Foundry has always met customer needs by being ahead of the technology innovation curve, and today, we are confident that our gate-all-around (GAA)-based advanced node technology will be instrumental in supporting the needs of our customers using AI applications,” said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. “Ensuring the success of our customers is the most central value to our foundry services.”

As part of its business strategy to solidify its competitiveness as a leading foundry service, Samsung Foundry today announced the following:

• Expanded applications of its 2-nanometer (nm) process and specialty process
• Expanded production capacity at its Pyeongtaek fab Line 3 (P3)
• Launched a new “Multi-Die Integration (MDI) Alliance” for next-generation packaging technology
• Continued progress in the foundry ecosystem with Samsung Advanced Foundry Ecosystem (SAFE) partners

Leading the Industry With Expanded 2nm Applications and Specialty Processes

At the event, Samsung announced detailed plans for the mass production of its 2nm process, as well as performance levels.

The company will begin mass production of the 2nm process for mobile applications in 2025, then expand to HPC in 2026 and automotive in 2027. Samsung’s 2nm process (SF2) has shown a 12% increase in performance, a 25% increase in power efficiency and a 5% decrease in area, when compared to its 3nm process (SF3).

Mass production of SF1.4 will begin in 2027 as planned.

From 2025, Samsung will begin foundry services for 8-inch gallium nitride (GaN) power semiconductors targeting consumer, data center and automotive applications.

To secure the most cutting-edge technology in 6G, the 5nm Radio Frequency (RF) is also under development and will be available in the first half of 2025. Samsung’s 5nm RF process shows a 40% increase in power efficiency and a 50% decrease in area compared to the previous 14nm process.

In addition, the company will add automotive applications to its 8nm and 14nm RF, expanding beyond the mobile applications currently under mass production.

Stabilizing the Supply Chain and Meeting Customer Needs With Expanded Capacity

Under the “Shell-First” operation strategy that aims to better respond to customer demands, Samsung Foundry is maintaining its commitment to invest and build capacity by adding new manufacturing lines in Pyeongtaek, South Korea, and Taylor, Texas. Current expansion plans will increase the company’s clean room capacity by 7.3 times by 2027 compared to 2021.

The company plans to begin mass production of foundry products for mobile and other applications at Pyeongtaek Line 3 in the second half of the year. Samsung is also focusing on increasing its manufacturing capacity in the United States. Construction of the new fab in Taylor is proceeding according to initial plans and is expected to finish by the end of the year, beginning operation in the second half of 2024.

Samsung will continue to expand its production base to Yongin, South Korea, to power the next generation of Samsung’s foundry services. Yongin is a nearby city located about 10km east of Samsung’s Hwaseong and Giheung campuses.

Leading the “Beyond Moore” Era With New Multi-Die Integration Alliance

In a bid to address the rapid growth in the chiplet market for mobile and HPC applications, Samsung is launching the MDI Alliance in collaboration with its partner companies as well as major players in memory, substrate packaging and testing.

The MDI Alliance leads innovation in stacking technology by forming a packaging technology ecosystem for 2.5D and 3D Heterogeneous Integration. Together with partners across the ecosystem, Samsung will provide a one-stop turnkey service to better support customers’ technological innovation.

Samsung plans to actively respond to customer and market needs by developing customized packaging solutions that are tailored to the individual needs of various applications including HPC and automotive.

Pushing Boundaries With Partners for Enhanced Fabless Support

Following the Samsung Foundry Forum, Samsung will be hosting the Samsung Advanced Foundry Ecosystem (SAFE) Forum on June 28 under the theme “Accelerating the Speed of Innovation.”

Together with over a hundred partners across electronic design automation (EDA), design solution partners (DSP), outsourced semiconductor assembly and test (OSAT), cloud and IP, Samsung is promoting mutual growth of the foundry ecosystem to power the success of customers.

Samsung has long supported stronger collaboration between partners across the foundry ecosystem, advancing the boundaries of design infrastructure from 8-inch to the latest GAA process. Samsung and its 23 EDA partners now offer over 80 design tools and is also collaborating with 10 OSAT partners to develop 2.5D/3D packaging design solutions.

Samsung provides product design services to a variety of customers from startups to industry leaders through strong partnerships with nine DSP partners that have extensive expertise in Samsung Foundry processes, as well as nine Cloud partners.

Samsung has also secured a portfolio of over 4,500 key IPs from 50 global IP partners. Samsung plans to secure additional next-generation high-speed interface IPs for SF2, including LPDDR5x, HBM3P, PCIe Gen6 and 112G SerDes. Its long-term partnerships with leading global IP providers in their respective fields will help cater to customer needs in AI, HPC and automotive.

“Through extensive collaboration with our SAFE partners, Samsung Foundry is helping simplify designs that are becoming even more complex amid the application of the most advanced processes and new technologies such as heterogeneous integration,” said Jong-wook Kye, Executive Vice President and Head of Design Platform Development, Foundry Business at Samsung Electronics. “We will continue to strive for consistent growth in the Samsung Foundry ecosystem in terms of both scale and quality.”

Samsung Electronics will be hosting the Samsung Foundry Forum 2023 in South Korea in July, and the event will expand to Europe and Asia later in the year to meet customers in each region.

Samsung Electronics, a world leader in advanced semiconductor technology, held its 3^rd Annual Samsung Advanced Foundry Ecosystem (SAFE^TM) Forum 2021 virtually today.

With the theme of ‘Performance Platform 2.0: Innovation, Intelligence, Integration’, Samsung and its foundry ecosystem partners prepared 7 plenary talks and 76 technology sessions focused on three main topics: Gate-All-Around (GAA, Innovation), Artificial Intelligence (AI, Intelligence) and 2.5D/3D (Integration) technologies and the diverse design infrastructures required for high-performance applications.

“In the rapidly changing data-centric era, Samsung and its foundry partners have made great strides responding to increasing customers demand and to support their success by providing powerful solutions,” said Ryan Lee, Senior Vice President and Head of Foundry Design Platform Development at Samsung Electronics. “With the support of our SAFE program, Samsung will lead the realization of the vision ‘Performance Platform 2.0’.”

Starting with a keynote live streaming on November 17, attendees are able to explore a variety of tech sessions and engage with ecosystem partners through the virtual SAFE Forum platform for a month. To register for SAFE forum, please visit https://www.samsungfoundry.com.

SAFE 2021: Performance Platform 2.0

Samsung has concentrated on expanding its foundry ecosystem by focusing on IP, Electronic Design Automation (EDA), Cloud, Design Solution Partner (DSP) and Package solutions necessary for today’s data-driven era. Samsung introduced today its latest SAFE^TM program including:

• SAFE^TM-IP & EDA: Samsung and its foundry ecosystem have reserved over 3,600 IPs and 80 certified EDA tools respectively. These are developed and verified based on the high-standard certification program run by Samsung and participated in by our partners. In order to respond to the demands of high performance applications, Samsung’s foundry ecosystem has developed not only HPC-specific foundation IPs including standard cell libraries and memory compilers but also key IPs, such as over 100Gbps Serializer-Deserializer (SerDes) interface and 2.5D/3D multi-die integration solutions.
  
  With our EDA partners, Samsung has secured design tools optimized for its unique 3-nanometer (nm) GAA process technology and design methodology for integrating multiple dies in 2.5D/3D. Customers can also utilize AI- and machine learning-based EDA technology to systematically manage and analyze design data. To overcome the increasing difficulties of chip design and analysis, Samsung has strengthened cooperation with partners to develop EDA tools and related technologies, such as incorporating GPUs that can efficiently use computing resources required for chip verification.

• SAFE^TM-OSAT: Samsung plans to lead ‘beyond-Moore’ technologies by strengthening various package line-ups such as 2.5D/3D through the expansion of its SAFE-Outsourced Semiconductor Assembly and Test (OSAT) ecosystem. The recent announcement of the co-development of Hybrid-Substrate Cube (H-Cube) solution, which offers efficient integration of 6 HBMs and cost benefit, is one of the successful examples of Samsung foundry’s collaboration with the OSAT community.

• SAFE^TM-Cloud Design Platform: SAFE^TM-CDP, the cloud-based one-stop design platform introduced last year, now supports a hybrid cloud function that can be linked to customers’ conventional design environments.

• SAFE^TM-DSP: Through the SAFE^TM-DSP ecosystem, Samsung and its global partners can actively support global fabless companies to implement their design ideas into custom product by utilizing cutting-edge process technologies as well as high-performance, low-power chip design knowledge.

[Quote from SAFE^TM Partner companies]

• Ansys, Ajei Gopal, CEO

“Today’s chips demand a full multiphysics approach, which requires engineering simulation. Ansys is proud to partner with Samsung to deliver a comprehensive multi-physics analysis flow for Samsung’s multi-die integration initiative. The benefits to joint customers, to the industry – and to the entire world – are tremendous. Semiconductors will drive innovations as varied as autonomous and electric vehicles, artificial intelligence, and mobile technologies, including 5G and beyond.”

• Arm, Simon Segars, CEO

“Our longstanding partnership with Samsung Foundry has been essential for growing business opportunities in many markets for our combined partner ecosystem. This close collaboration continues as we work together to optimize our Armv9 next-generation processors on Samsung Foundry’s leading-edge processes, including GAA, to deliver a best-in-class solution that is optimized for the world of today, and the technologies of tomorrow. Together, we are unlocking new opportunities across HPC, Automotive, AI, and IoT, while also managing rising complexities, enabling faster time to market.”

• Cadence, Lip-Bu Tan, CEO

“The Cadence Intelligent System Design strategy is very well-aligned with Samsung Foundry’s Performance Platform 2.0 with common themes of innovation, pervasive intelligence and integrated solutions. Together, we’re enabling customers to develop and deliver innovative, breakthrough products using Samsung’s most advanced process and packaging technologies, and we look forward to continuing our work with Samsung Foundry to accelerate design successes”

• Siemens EDA, A. J. Incorvaia, Senior Vice President

“The Samsung SAFE event provides an exceptionally valuable venue for the Samsung Foundry ecosystem to meet, share information and identify opportunities to fully leverage Samsung’s cutting-edge process technologies. Siemens EDA looks forward to this year’s Samsung SAFE event and the many opportunities it presents for collaborating with customers and partners to eliminate design obstacles and enhance silicon success.”

• Synopsys, Sassine Ghazi, president and COO

“We see exciting times ahead as software and chip technology come together to create world-changing new products,” said Sassine Ghazi, president and COO of Synopsys. “We have strong programs with Samsung Foundry on 3nm gate-all-around enablement, broad IP certification, AI-assisted chip design and 2.5/3D multi-die design to name just a few. We welcome the strong collaboration opportunities offered by the Samsung SAFE initiative.”

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the launch of ‘Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP)’ for fabless customers, in collaboration with Rescale, a leader in high performance computing (HPC) applications in the cloud.

The key highlight feature of Samsung foundry’s first SAFE Cloud Design Platform is that it provides a virtual environment to design chips in the cloud. By accessing this platform through the cloud, customers can immediately start designing at anytime and anywhere.

To maximize customers’ design convenience, SAFE CDP supports a very secure design condition that has verified with cloud companies. In addition, customers can utilize various Electronic Design Automation (EDA) tools offered by multiple vendors such as Ansys, Cadence, Mentor, a Siemens business and Synopsys.

Gaonchips, one of Samsung Foundry’s Design Solution Partners, has already tested the SAFE CDP on its 14nm automotive project using Cadence’s Innovus Implementation System and has successfully reduced its design run-time by 30 percent compared to current on-premise execution.

“We expect that our innovative design platform co-developed in partnership with Rescale will play a crucial role for the fabless industry as it evolves into efficient cloud-based design environment,” said Jae-hong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “We remain committed to our efforts to bolster the SAFE ecosystem and will continue to collaborate with our SAFE partners on developing innovative programs that will help deliver ease of use and greater design efficiency for customers.”

As designs move to advanced nodes and as transistor scaling occurs at each node, chip designs become more complex and computing power required for these designs have increased significantly, resulting in greater overhead time and cost to customers.

By adopting CDP, customers can reduce the burden of building their own server infrastructure, while flexibly utilizing additional computing power required for chip design and verification. Furthermore, they can take full advantage of Samsung’s diverse foundry ecosystem which includes EDA, intellectual property (IP), cloud, and design services offered by reputable partners.

“We are excited to be a partner of Samsung Foundry SAFE ecosystem,” said Joris Poort, founder and CEO of Rescale. “We share a common vision of a global design cloud platform that efficiently supports a broad ecosystem of technologies and services for EDA customers worldwide.”

To actively respond to the latest technology trends and lower the design barrier for developing competitive SoCs, Samsung launched the SAFE program in early 2018 and held the first SAFE Forum in the United States last year. More information on SAFE can be found here.

About Rescale
Rescale is the leader in enterprise big compute in the cloud. Rescale’s ScaleX^® multi-cloud platform, built on the most powerful high-performance computing infrastructure, seamlessly matches software applications with the best architecture in the cloud to run complex data processing and simulations. Rescale partners with the largest cloud service providers such as Amazon Web Service, Microsoft Azure, Google Cloud Platform, IBM, and Oracle Cloud Infrastructure, providing services enterprise in automotive, aerospace, defense, and semiconductor industry. For more information on Rescale, visit www.rescale.com.

Samsung Electronics, a world leader in advanced semiconductor technology, today held the first Samsung Advanced Foundry Ecosystem (SAFE) Forum 2019 in the United States. By sharing the latest technology trends and strengthening cooperation within the foundry ecosystem, Samsung showcased its strong dedication to customers.

SAFE Forum is designed to provide an opportunity for SAFE partner companies to directly meet with customers to discuss comprehensive design technology infrastructure, including electronic design automation (EDA), intellectual property (IP), cloud, design service, and packaging, which is critical to efficiently developing and manufacturing semiconductor products.

While the Samsung Foundry Forum (SFF) has served as a channel to present Samsung’s technology roadmap and leadership to customers, the newly held SAFE Forum is distinctive in that it allows its partners to engage deeper and more efficient collaboration within Samsung’s foundry ecosystem by directly communicating in detail with customers on their own design support solutions proven by Samsung.

“SAFE program has grown in quality over the past two years; it has expanded the number of competitive partnerships and support of flexible product design for customers as well as bolstered the relationship between our partners, customers, and Samsung foundry,” said Jae-hong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “We will continue our efforts in enhancing accessibility to enable customers to more easily utilize Samsung’s excellent foundry solutions.”

As the latest system-on-chip (SoC) product requires more sophisticated features in a smaller surface size than before, the number of considerations in IC design optimization has increased exponentially: performance, power, security, design, density, etc.

To actively respond to these IC design trends and lower the design barrier for developing competitive SoCs, Samsung Electronics launched the SAFE program in early 2018.

Under the slogan “Partnering for a bold silicon future”, details on the latest global IC design trends as well as benefits of the efficient easy-to-use platform design infrastructure were introduced.

With more than 400 industry experts attending the first SAFE Forum, 12 detailed sessions were given by around 30 speakers from 15 partner companies, focusing on emerging high-growth applications, including high-performing computer (HPC), internet-of-things (IoT), and automotive. Attendees also had a chance to discover the optimal solution for implementing their new ideas into chips through 40 partner booths at the venue.

Samsung Electronics, a world leader in advanced semiconductor technology, has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFE^TM) program.

The SAFE^TM program ensures deep collaboration between the Samsung Foundry, ecosystem partners, and customers to deliver competitive and robust System on Chip (SoC) designs based on certified key design components including Process Design Kit (PDK), reference flows with Design Methodologies(DM), Intellectual Property (IP), and ASIC design support.

“We are very excited to provide the comprehensive, collaborative, and qualified Samsung Advanced Foundry Ecosystem to our customers to enable faster and more reliable SoC design success”, said Jong Shik Yoon, executive vice president of Foundry Technology Development at Samsung Electronics. “Together with our SAFE^TM partners, Samsung Foundry will provide certified design enablement solutions to existing strategic customers as well as innovative, new start-up customers. We welcome all current and future Ecosystem partners to join the new SAFE^TM program.”

The SAFE^TM program is based on three pillars :

• EDA/DM : Provides extensively tested PDKs and reference flows (with design methodologies) that are backed by Samsung Foundry’s certification.
• IP : Provides a full set of silicon qualified, application specific IP offerings from the early stage of process technology development. Customers can view a full list of IP solutions offered through SAFE^TM by accessing Samsung Foundry’s B2B site, CONNECT(https://www.samsungfoundry.com).
• Design Services : Connects mid- to small-sized companies with qualified ASIC design services and support. Using design service partners of SAFE^TM, customers will benefit from easy access to process technology information, competitive price conditions, and committed resources for their SoC design success.

For more information about Samsung Foundry, please visit https://www.samsungfoundry.com

Quotes from SAFE^TM  Partner Companies

• Arm, Gus Yeung, vice president and general manager of Physical Design Group

“The Samsung Advanced Foundry Ecosystem creates significant opportunities for the industry. Through our ongoing collaboration with the Samsung Foundry, we are enabling the ecosystem with access to leadership co-optimized physical IP solutions for enhancing next-generation SoC designs.”

• AlphaHoldings, Donggi Kim, CEO

“It’s honor to be one of the initial member of SAFE. As a Korean design service partner, we are ready to support Samsung Foundry’s ASIC customers more effective way based on long-term collaboration with Samsung Foundry and competencies – leading edge process experiences, customer specific IP, high quality manpower, error free design capabilities, etc.”

• Cadence, KT Moore, vice president, product management

“We’ve collaborated with Samsung Foundry for many years to enable our joint customers to achieve their aggressive design goals. We believe that the new SAFE foundry design program will facilitate innovation and help customers deliver designs to market even faster. Our support for Samsung Foundry’s process technologies continues to expand with our broadened IP portfolio and full EDA tool enablement with comprehensive reference flows.”

• eSilicon, Hugh Durdan, vice president, strategy and products

“Through our Tier 1 ASIC work with Samsung Foundry, we understand Samsung Foundry’s advanced process technologies well. This allows us to offer differentiating IP targeted at the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets using these advanced process technologies.”

• Faraday, Steve Wang, President

“Samsung Foundry provides the most competitive grand ecosystem for the leading edge technologies. Since our establishment in 1993, Faraday has successfully delivered more than 2,200 ASIC mass production projects. Thus we are confident in our ability to leverage the SAFE program, targeting next-generation applications now and beyond.”

• Mentor, Joe Sawicki, vice president, Design to Silicon

“Mentor is proud that it has been the signoff solution for Samsung’s own design efforts over the last two decades and Samsung Foundry since the foundry was launched in 2005. We are pleased to be continuing our close partnership with Samsung as it expands its ecosystem interactions via the Samsung SAFE initiative.”

• Rambus, Luc Seraphin, senior vice president and general manager, Memory and Interfaces Division

“As ASIC and SoC designs continue to increase in complexity, high-speed interfaces are integral to successful design. This strong partnership between Rambus and Samsung across multiple nodes, ensures that we are providing a broad portfolio of high-quality solutions to our end customers. We are pleased to collaborate with Samsung Foundry to provide designers with leading high-speed SerDes and memory PHY IP solutions for easy integration into their chip designs.”

• Synopsys, Deirdre Hanford, co-general manager, Design Group

“Our collaboration with Samsung Foundry since 2005 has enabled mutual customers to deliver state-of-the-art designs across a wide range of Samsung’s process technologies. The SAFE program will help accelerate adoption of Synopsys’ high-quality IP, market-leading tools, and comprehensive design services supporting Samsung Foundry for development of their differentiated SoCs.”

• VeriSilicon, Wayne Dai, President and CEO

“Our experience in shipping high volume SoCs using Samsung 14nm and 10nm FinFET, as well as 28nm FD-SOI process demonstrates that Samsung Foundry has excellent potential for the China market. Now as a charter member of SAFE, we will expand our partnership to a new level enabling us to better support our mutual customers.”

Research published by Samsung, in partnership with Mindlab International, reveals that watching television content on an UHD TV is 38 percent more immersive than watching on Full HD.

The neuropsychological study – ‘Screen Sensation: The Ultra HD Effect’ – examined the physiological affects of watching UHD TV versus Full HD TV, in order to highlight the technological advancements of the Samsung SUHD TV range. Full HD (also known as 1080p), has over five times as much picture information as standard definition TV, and Ultra high definition (UHD) televisions are capable of displaying pictures with four times the detail of Full HD. The participants, aged 18-65, had electrodes attached to their scalps and were monitored via electroencephalography (EEG), electrodermal activity (EDA) and heart rate. The subjects watched footage from leading content streaming service Netflix and a European high profile football match, all in UHD and HD. To ensure impartiality, the brand of TV was concealed during the study.

[Samsung compares the body’s physiological response to watching Netflix (Chef’s Table) on a Samsung SUHD television, in comparison to Full High Definition TV.]

The results proved overwhelmingly that UHD TV was more ‘immersive’ than Full HD TV due to a combination of increased approach motivation (a measure associated with being attracted towards something), visual processing and beta power (a measure associated with active thinking or concentration). Immersion is highly increased during experiences like riding a roller coaster, buying a new product or going out on a good date. The fact that watching Samsung SUHD TV increases immersion suggests that it offers a more positive and rich viewer engagement than watching content on a Full HD screen.

The results will also please armchair football commentators, who will be able to feel more like a referee on the pitch, never missing an offside position again. Participants experienced 62 percent higher levels of visual processing when watching football on UHD TV, meaning that the brain is using more of its capacity to process visual information. In turn this mental function delivers a more detailed and richer representation of what’s really happening on the pitch.

During the study, subjects felt 25 percent more ‘in the moment’ when watching something for the first time on the Samsung SUHD TV. Subjects felt more ready to react to what was on the screen, more focused, attentive and concentrated – perfect for action film fans, who want their viewing experience heightened.

[Subjects watch Netflix (Sense8 and Chef’s Table) while being tested by Mindlab International for Samsung’s ‘Screen Sensation: The Ultra HD Effect’ study to examine the body’s physiological response to watching TV in Ultra HD, compared to Full HD.]

Neuropsychologist Dr. David Lewis, Chairman of Mindlab International says: “Ultra High Definition TV is a quantum leap in terms of viewing experience – this has been proved by the research we carried out for Samsung. It’s incredible how advancements in technology can create these significant physiological responses and is changing the way we experience content and entertainment.”

Other findings include:

• Participants were significantly more drawn towards content on UHD screens compared to Full HD screens (20 percent difference) – creating a positive emotional reaction
• When watching clips for the second or third time, people watching on UHD screens were more drawn to them than those watching them on HD screens (29 percent difference)

Michael Zoeller, Vice President, European Head of Visual Display at Samsung said: “From global sporting events, to highly anticipated TV series, to blockbuster films, people want to experience the huge variety of premium TV content available on bigger, brighter, crystal clear screens. Samsung is at the very forefront of evolving TV technology, offering the most breath-taking viewing experience possible, in the comfort of people’s homes. This research underlines the power of watching premium quality content on a technologically advanced television, like a Samsung SUHD TV.”

Neil Hunt, Chief Product Officer at Netflix said: “Ultra High Definition is challenging people’s expectations on the quality of television and our own programming is reflecting the leaps forward in picture quality, depth, detail and colour. The reality of TV is becoming sharper, making entertainment more immersive and enjoyable.”

Samsung’s revolutionary Curved SUHD TVs offer the finest UHD picture quality, depth and detail a UHD screen can offer. Ground breaking Nano Crystal Technology creates outstandingly precise, rich colours and brightness, and flat images come to life making entertainment more immersive and enjoyable.