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		<title>eMMC &#8211; Samsung Global Newsroom</title>
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				<title><![CDATA[Samsung Introduces the Industry’s First 5nm Processor Powering the Next Generation of Wearables]]></title>
				<link>https://news.samsung.com/global/samsung-introduces-the-industrys-first-5nm-processor-powering-the-next-generation-of-wearables</link>
				<pubDate>Tue, 10 Aug 2021 11:00:35 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
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		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[5nm EUV process]]></category>
		<category><![CDATA[eMMC]]></category>
		<category><![CDATA[Exynos]]></category>
		<category><![CDATA[Exynos W920]]></category>
		<category><![CDATA[Google]]></category>
		<category><![CDATA[LPDDR4]]></category>
		<category><![CDATA[Processor]]></category>
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		<category><![CDATA[wearable processor]]></category>
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									<description><![CDATA[Samsung Electronics, a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices. […]]]></description>
																<content:encoded><![CDATA[<p><img class="alignnone size-full wp-image-126148" src="https://img.global.news.samsung.com/global/wp-content/uploads/2021/08/Samsung-Exynos-W920_main1-e1628495485420.jpg" alt="" width="1000" height="682" /></p>
<p>Samsung Electronics, a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices.</p>
<p>“Wearables like smartwatches are no longer just a cool gadget to have. They’re now a growing part of our lifestyles to keep you fit, safe and alert,” said Harry Cho, vice president of System LSI marketing at Samsung Electronics. “With the Exynos W920, future wearables will be able to run applications with visually appealing user interfaces and more responsive user experiences while keeping you connected on the go with fast LTE.”</p>
<p><img class="alignnone size-full wp-image-126147" src="https://img.global.news.samsung.com/global/wp-content/uploads/2021/08/Samsung-Exynos-W920_main2-e1628495344881.jpg" alt="" width="1000" height="360" /></p>
<p>The Exynos W920 packs two Arm<sup>®</sup> Cortex<sup>®</sup>-A55 cores for high-performing yet power-efficient processing and an Arm Mali<img src="https://s.w.org/images/core/emoji/16.0.1/72x72/2122.png" alt="™" class="wp-smiley" style="height: 1em; max-height: 1em;" />-G68 GPU that boasts improved CPU performance around 20-percent and ten times better graphics performance than its predecessor. With upgraded cores and improved performance, the Exynos W920 enables faster application launches and more interactive eye-catching 3D graphical user interface (GUI) on a device’s qHD (960×540) display.</p>
<p>Even with the latest features and enhancements, the Exynos W920 comes in the smallest package currently available in the market for wearables with Fan-Out Panel Level Packaging (FO-PLP). The technology incorporates the Exynos W920, power management IC (PMIC), LPDDR4 and embedded multimedia card (eMMC) in the same package using System-in-Package-embedded Package on Package (SiP-ePoP) configuration. The processor’s compact size allows smartwatches to house larger batteries or don sleeker designs.</p>
<p>Always-on-display (AOD) for wearables, especially for smartwatches, is a widely adopted feature as it makes it effortless to take a quick look at the time, notifications, missed calls and more without the need to wake the watch up from sleep mode. Rather than powering up the main CPU, the W920 activates a dedicated low-power display processor, the Cortex-M55, reducing display power consumption under AOD mode compared to its previous Exynos model.</p>
<p>For seamless connected experiences on the go, the Exynos W920 is embedded with a 4G LTE Cat.4 modem as well as a Global Navigation Satellite System (GNSS) L1 for tracking speed, distance and elevation during outdoor activities.</p>
<p>The Exynos W920 supports a new unified wearable platform Samsung built jointly with Google, and will be first applied to the upcoming Galaxy Watch model.</p>
<p>For more information about Samsung’s Exynos products, please visit <a href="http://www.samsung.com/exynos" target="_blank" rel="noopener">http://www.samsung.com/exynos</a><span>.</span></p>
<p><em><span style="font-size: small">* Editor’s Note: Actual performance may vary depending on device and user environment.</span></em></p>
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				<title><![CDATA[Samsung Begins Mass Production of 256GB  Embedded Universal Flash Storage  for Automotive Applications]]></title>
				<link>https://news.samsung.com/global/samsung-begins-mass-production-of-256gb-embedded-universal-flash-storage-for-automotive-applications</link>
				<pubDate>Thu, 08 Feb 2018 11:00:33 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[128-Gigabyte Universal Flash Storage]]></category>
		<category><![CDATA[256-Gigabyte]]></category>
		<category><![CDATA[256-Gigabyte Universal Flash Storage]]></category>
		<category><![CDATA[ADAS]]></category>
		<category><![CDATA[AP]]></category>
		<category><![CDATA[eMMC]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[IOPS]]></category>
		<category><![CDATA[JEDEC UFS 2.1 standard]]></category>
		<category><![CDATA[JEDEC UFS 3.0 standard]]></category>
		<category><![CDATA[nand]]></category>
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									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry. Following the memory breakthrough of the automotive industry’s […]]]></description>
																<content:encoded><![CDATA[<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.</p>
<p>Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.</p>
<p>As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode,</p>
<p>“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”</p>
<p><img class="alignnone wp-image-97963 size-full" src="https://img.global.news.samsung.com/global/wp-content/uploads/2018/02/256gb-eufs-for-auto-apps_main_1_FF.jpg" alt="" width="705" height="458" /></p>
<p>Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.</p>
<p>Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.</p>
<p>The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.</p>
<p>Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.</p>
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				<title><![CDATA[Samsung Joins Audi’s Progressive SemiConductor Program to  ‘Create the Drive of Tomorrow’]]></title>
				<link>https://news.samsung.com/global/samsung-joins-audis-progressive-semiconductor-program-to-create-the-drive-of-tomorrow</link>
				<pubDate>Mon, 23 Nov 2015 18:00:55 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
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		<category><![CDATA[Audi]]></category>
		<category><![CDATA[eMMC]]></category>
		<category><![CDATA[Germany]]></category>
		<category><![CDATA[LPDDR4 DRAM]]></category>
		<category><![CDATA[NAND flash memory]]></category>
		<category><![CDATA[Semiconductor]]></category>
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									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, announced its participation in the Audi Progressive SemiConductor Program (PSCP) as the first semiconductor memory supplier. Dr. Kinam Kim, president of Semiconductor Business at Samsung Electronics’ Device Solutions Division and Ricky Hudi, Executive Vice President Electronic Development at Audi agreed to leverage the two companies’ technology […]]]></description>
																<content:encoded><![CDATA[<p>Samsung Electronics, the world leader in advanced memory technology, announced its participation in the <span style="color: #0000ff"><strong>Audi Progressive SemiConductor Program (PSCP)</strong></span> as the first semiconductor memory supplier. Dr. Kinam Kim, president of Semiconductor Business at Samsung Electronics’ Device Solutions Division and Ricky Hudi, Executive Vice President Electronic Development at Audi agreed to leverage the two companies’ technology and ideas to drive innovation for the fast-growing automotive industry at a ceremony held at Audi’s headquarter in Ingolstadt, Bavaria, Germany.</p>
<p>The Audi Progressive SemiConductor Program is designed to make the latest semiconductor technologies available in cars, while increasing reliability, with the aim of intensifying the role and engagement of semiconductor companies in the process. Based on the strategic partnership, Samsung will provide its latest leading-edge memory products including 20-nanometer LPDDR4 DRAM and 10-nanometer class eMMC (embedded multimedia card) 5.1 to Audi’s future infotainment, dashboard and ADAS (Advanced Driver Assistance Systems) automotive applications.</p>
<p>“It is an exciting moment to offer our industry leading memory solutions to embrace the rapidly growing automotive industry,” said Dr. Kinam Kim, president of Semiconductor Business at Samsung Electronics’ Device Solutions Division. “Based on this partnership, Samsung will bring various benefits and advanced user experience to the global automotive market while providing high quality memory products with excellent performance and enhanced reliability.”</p>
<p>“Samsung is leading memory technology development with its high-performance, high-density DRAM and NAND flash memory solutions based on the industry’s most advanced process technology”, said Ricky Hudi, Executive Vice President Electronic Development at Audi. “Through the PSCP strategic partnership with Samsung, Audi will utilize Samsung’s high speed memory products to provide the best user experience to our customers. Both parties are committed to achieving the quality levels that people expect from the Audi brand”.</p>
<p>According to a recent report by Gartner, the global automotive semiconductor market is expected to grow from US $31.2 billion in revenue to US $32.7 billion in 2016 approximately, while the automotive memory market portion will reach a 4.6% percent share or about US $1.5 billion in 2016. The PSCP collaboration will illustrate next generation car applications at the highest safety and comfort level with enhanced reliability as well as improved performance, and will strengthen Samsung and Audi’s competitiveness in the global automotive industry.</p>
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				<title><![CDATA[eMMC to UFS: How NAND Memory for Mobile Products Is Evolving]]></title>
				<link>https://news.samsung.com/global/emmc-to-ufs-how-nand-memory-for-mobile-products-is-evolving</link>
				<pubDate>Thu, 26 Feb 2015 08:01:41 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2015/02/samsung-ufs-700x424.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[eMMC]]></category>
		<category><![CDATA[NAND Memory]]></category>
		<category><![CDATA[UFS]]></category>
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									<description><![CDATA[8GB? 16GB? 32GB? 64GB? 128GB?!! We just can’t seem to get enough. With better cameras and displays – which mean more selfies, bigger pictures and more videos – memory has been a growing priority when consumers shop for new mobile and tablet devices. Naturally Samsung, the world leader in advanced memory technology, has been working […]]]></description>
																<content:encoded><![CDATA[<p><a href="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/samsung-ufs.jpg"><img loading="lazy" class="aligncenter size-medium wp-image-49126" src="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/samsung-ufs-688x424.jpg" alt="eMMC to UFS: How NAND Memory for Mobile Products Is Evolving" width="688" height="424" /></a></p>
<p>8GB? 16GB? 32GB? 64GB? 128GB?!! We just can’t seem to get enough. With better cameras and displays – which mean more selfies, bigger pictures and more videos – memory has been a growing priority when consumers shop for new mobile and tablet devices.</p>
<p>Naturally Samsung, the world leader in advanced memory technology, has been working vigorously to develop solutions to equip users with the ability to store as many images, videos and other media, as well as the capability to multitask on the device without jeopardizing the integrity of basic functionality is imperative.</p>
<p>Typically, smartphone and tablets have been using eMMCs (embedded multi-media cards) to store information. And today, we announced the mass production of the industry’s first 128GB embedded memory solution based on Universal Flash Storage (UFS) 2.0 standard.</p>
<p><span style="color: #000080"><strong>First, what is eMMC?</strong></span></p>
<p>eMMC, or embedded multimedia card, is an advanced, managed NAND flash memory for mobile applications and still is the dominant go-to memory solution for many consumer electronics, including tablets, smartphones, GPS systems, eReaders, and other mobile computing devices.</p>
<p>(“Managed” here means that it’s a solution consisting not only of NAND flash memory, but also controller/interface circuits to help sort out processes and improve performance.)</p>
<p>Samsung eMMC memory is extremely compact, typically smaller than a postage stamp, allowing for smaller and thinner devices. Leading manufacturers have favorited Samsung’s eMMC memory because it allows for a smooth pathway to elegant and advanced mobile designs with a short time to market. The latest standard, eMMC 5.1, even furthered the performance and power efficiency.</p>
<p style="text-align: center"><a href="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/table5.jpg"><img loading="lazy" class="aligncenter size-full wp-image-49155" src="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/table5.jpg" alt="table5" width="1307" height="483" /></a></p>
<p style="text-align: center"><Speed comparison between standards></p>
<p><span style="color: #000080"><strong>Then what is UFS?</strong></span></p>
<p>UFS is the future of Flash memory. UFS 2.0, the most advanced JEDEC standard, offers sequential read/write speeds fast enough to rival SSDs while combining it with the low power consumption of eMMC.</p>
<p>With Samsung’s highly intelligent controller and firmware that provide the highest level of performance and quality, consumers will now have access to a better overall user experience. Along with faster booting, the next generation of flash storage offers a faster data input/output response, three times faster file copy, and three times the multitasking capability. To the average consumer, this means watching high-quality videos, playing high bandwidth games and other entertainment, along with running multiple applications, and downloading or uploading files, all without interruption in functionality.</p>
<p><span style="color: #000080"><strong>eMMC vs UFS</strong></span></p>
<p>UFS boasts a substantial improvement in performance. There are two main factors that contribute to this.</p>
<p><a href="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/eMMC-UFS.jpg"><img loading="lazy" class="aligncenter size-full wp-image-49157" src="http://img.global.news.samsung.com/global/wp-content/uploads/2015/02/eMMC-UFS.jpg" alt="eMMC-UFS" width="896" height="347" /></a></p>
<p>First, UFS has a LVDS(Low-Voltage Differential Signaling) serial interface which has separately dedicated read/write paths. This allows full duplex(two-way interaction) – in other words UFS can read and write simultaneously. eMMC, on the other hand, has a parallel interface which can only send data in one direction at a time – it can either read or write, not at the same time.</p>
<p>Second, UFS has a Command Queue(CQ), which sorts out the commands that needs to be carried out. Thus, multiple commands can be addressed at the same time and the order of tasks can be changed accordingly. eMMC, without CQ***, needs to wait for a process to be completed before moving on to the next one.</p>
<p>The combination of these two, along with Samsung’s engineering feats allows Samsung’s UFS 2.0 solution have a sequential read speed, sequential write speed, random read speed and random write speed each 1.40, 1.66, 2.71, 1.07 times faster, respectively, than eMMC 5.0.</p>
<p><span style="color: #000080"><strong>The Evolution of Flash Memory</strong></span></p>
<p>Ever since its first introduction in 1984, flash memory has come a long way – from the humble thumb drive that so many of us still use, to SD and micro SD cards that have become a vital part of our digital imaging and mobile experiences, to the smart and sleek SSDs that are quickly replacing HDDs, to eMMCs that virtually define how much we can store in our pockets. Samsung has been shaping this industry, topping the NAND flash memory market since 2002 and producing many firsts thereafter.</p>
<p>20-plus years of constant leadership in semiconductor technology now enabled Samsung to be the first and currently only manufacturer to mass produce UFS solutions, and these UFS solutions are expected to bring about a dramatic change in the industry.</p>
<p>Samsung is constantly innovating NAND Flash technology, and is working to build industry-leading products that provide the highest level of performance and quality. What kind of solution would you want on your device? What would you like to see in the future? Share your thoughts in the comments below.</p>
<p>Related posts: <a href="http://global.samsungtomorrow.com/ufs-press-release/%20" target="_blank">Samsung Electronics Introduces Industry’s First 128-Gigabyte Universal Flash Storage for Smartphones</a></p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/introducing-emmc-5-1-next-step-relentless-flash-innovation/" target="_blank">Introducing eMMC 5.1: The Next Step in Relentless Flash Innovation</a> (Voices at Samsung Semiconductor)</p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/emmc-speed-demon-for-the-mobile-market/" target="_blank">eMMC: Speed Demon for the Mobile Market</a> (Voices at Samsung Semiconductor)</p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/managing-the-evolution-of-flash-from-storage-visions-2011/" target="_blank">Managing the Evolution of Flash from Storage Visions</a> (Voices at Samsung Semiconductor)</p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/playing-critical-role-growing-market-wearables/" target="_blank">Playing a Critical Role in Growing the Market for Wearables</a> (Voices at Samsung Semiconductor)</p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/3d-v-nand-ushering-in-the-next-chapter-of-flash-memory/" target="_blank">3D V-NAND: Ushering in the Next Chapter of Flash Memory</a> (Voices at Samsung Semiconductor)</p>
<p><a href="http://www.samsungsemiblog.com/memoryandssd/get-ready-to-see-samsung-memory-highlights-at-jedec-mobile-forum-2014/" target="_blank">Get Ready to See Samsung Memory Highlights at JEDEC Mobile Forum 2014</a> (Voices at Samsung Semiconductor)</p>
<h5>* Speed refers to those of Samsung products based on respective standards</h5>
<h5>** Based on typically used micro SD cards. Actual performance may vary by speed class and maker.</h5>
<h5>*** Samsung’s eMMC5.1 also features CQ(Command Queue), which contributes to the improvement from eMMC5.0</h5>
<h5>**** Maria Yoon (Global Communications, Device Solutions, Samsung Electronics) contributed to this article.</h5>
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