<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet title="XSL_formatting" type="text/xsl" href="https://news.samsung.com/global/wp-content/plugins/btr_rss/btr_rss.xsl"?><rss version="2.0"
     xmlns:content="http://purl.org/rss/1.0/modules/content/"
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     xmlns:dc="http://purl.org/dc/elements/1.1/"
     xmlns:atom="http://www.w3.org/2005/Atom"
     xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
     xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
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		<title>eUFS &#8211; Samsung Global Newsroom</title>
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            <title>eUFS &#8211; Samsung Global Newsroom</title>
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		<sy:updateFrequency>1</sy:updateFrequency>
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				<title>Samsung Begins Mass Production of  the Fastest Storage for Flagship Smartphones</title>
				<link>https://news.samsung.com/global/samsung-begins-mass-production-of-the-fastest-storage-for-flagship-smartphones</link>
				<pubDate>Tue, 17 Mar 2020 11:00:57 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[512GB eUFS 3.1]]></category>
		<category><![CDATA[5th Generation V-NAND]]></category>
		<category><![CDATA[embedded Universal Flash Storage]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[eUFS 3.1]]></category>
		<category><![CDATA[Fifth-generation V-NAND]]></category>
		<category><![CDATA[Sixth-generation V-NAND]]></category>
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									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512GB eUFS 3.0 mobile memory, Samsung’s new eUFS 3.1 breaks the 1GB/s performance […]]]></description>
																<content:encoded><![CDATA[<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512GB eUFS 3.0 mobile memory, Samsung’s new eUFS 3.1 breaks the 1GB/s performance threshold in smartphone storage.</p>
<p>“With our introduction of the fastest mobile storage, smartphone users will no longer have to worry about the bottleneck they face with conventional storage cards,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “The new eUFS 3.1 reflects our continuing commitment to supporting the rapidly increasing demands from global smartphone makers this year.”</p>
<p>At a sequential write speed of over 1,200MB/s, Samsung 512GB eUFS 3.1 boasts more than twice the speed of a SATA-based PC (540MB/s) and over ten times the speed of a UHS-I microSD card (90MB/s). This means consumers can enjoy the speed of an ultra-slim notebook when storing massive files like 8K videos or several hundred large-size photos in their smartphones, without any buffering. Transferring contents from an old phone to a new device will also require considerably less time. Phones with the new eUFS 3.1 will only take about 1.5 minutes to move 100GB of data whereas UFS 3.0-based phones require more than four minutes.</p>
<p>In terms of random performance, the 512GB eUFS 3.1 processes up to 60 percent faster than the widely used UFS 3.0 version, offering 100,000 input/output operations per second (IOPS) for reads and 70,000 IOPS for writes.</p>
<p>Along with the 512GB option, Samsung will also have 256GB and 128GB capacities available for flagship smartphones.</p>
<p>Samsung began volume production of fifth-generation V-NAND at its new Xi’an, China, line (X2) this month to fully accommodate storage demand throughout the flagship and high-end smartphone market. The company soon plans to shift V-NAND volume production at its Pyeongtaek line (P1) in Korea from fifth-generation to sixth-generation V-NAND to better address the growing demand.</p>
<h3><span style="color: #000080"><strong>Samsung Embedded Storage Memory Lineup</strong></span></h3>
<table width="1000">
<tbody>
<tr>
<td style="text-align: center" width="230"><strong>Product</strong></td>
<td style="text-align: center" width="170"><strong>Sequential Read</strong></td>
<td style="text-align: center" width="200"><strong>Sequential Write</strong></td>
<td style="text-align: center" width="200"><strong>Random Read</strong></td>
<td style="text-align: center" width="200"><strong>Random Write</strong></td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>512GB eUFS 3.1 </strong></p>
<p style="text-align: center">(March 2020)</p>
</td>
<td style="text-align: center" width="102"><strong>2100MB/s</strong></td>
<td width="129">
<p style="text-align: center"><strong>1200MB/s</strong></p>
<p style="text-align: center">(3X enhancement)</p>
</td>
<td width="129">
<p style="text-align: center"><strong>100,000 IOPS</strong></p>
<p style="text-align: center">(1.6X enhancement)</p>
</td>
<td width="130">
<p style="text-align: center"><strong>70,000 IOPS</strong></p>
<p style="text-align: center">(1.03X enhancement)</p>
</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>512GB eUFS 3.0</strong></p>
<p style="text-align: center">(Feb. 2019)</p>
</td>
<td style="text-align: center" width="102">2100MB/s</td>
<td style="text-align: center" width="129">410MB/s</td>
<td style="text-align: center" width="129">63,000 IOPS</td>
<td style="text-align: center" width="130">68,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>1TB eUFS 2.1 </strong></p>
<p style="text-align: center">(Jan. 2019)</p>
</td>
<td style="text-align: center" width="102">1000MB/s</td>
<td style="text-align: center" width="129">260MB/s</td>
<td style="text-align: center" width="129">58,000 IOPS</td>
<td style="text-align: center" width="130">50,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>512GB eUFS 2.1 </strong></p>
<p style="text-align: center">(Nov. 2017)</p>
</td>
<td style="text-align: center" width="102">860MB/s</td>
<td style="text-align: center" width="129">255MB/s</td>
<td style="text-align: center" width="129">42,000 IOPS</td>
<td style="text-align: center" width="130">40,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>Automotive UFS 2.1</strong></p>
<p style="text-align: center">(Sept. 2017)</p>
</td>
<td style="text-align: center" width="102">850MB/s</td>
<td style="text-align: center" width="129">150MB/s</td>
<td style="text-align: center" width="129">45,000 IOPS</td>
<td style="text-align: center" width="130">32,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>256GB UFS Card</strong></p>
<p style="text-align: center">(July 2016)</p>
</td>
<td style="text-align: center" width="102">530MB/s</td>
<td style="text-align: center" width="129">170MB/s</td>
<td style="text-align: center" width="129">40,000 IOPS</td>
<td style="text-align: center" width="130">35,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>256GB eUFS 2.0</strong></p>
<p style="text-align: center">(Feb. 2016)</p>
</td>
<td style="text-align: center" width="102">850MB/s</td>
<td style="text-align: center" width="129">260MB/s</td>
<td style="text-align: center" width="129">45,000 IOPS</td>
<td style="text-align: center" width="130">40,000 IOPS</td>
</tr>
<tr>
<td width="138">
<p style="text-align: center"><strong>128GB eUFS 2.0</strong></p>
<p style="text-align: center">(Jan. 2015)</p>
</td>
<td style="text-align: center" width="102">350MB/s</td>
<td style="text-align: center" width="129">150MB/s</td>
<td style="text-align: center" width="129">19,000 IOPS</td>
<td style="text-align: center" width="130">14,000 IOPS</td>
</tr>
<tr>
<td style="text-align: center" width="138">eMMC 5.1</td>
<td style="text-align: center" width="102">250MB/s</td>
<td style="text-align: center" width="129">125MB/s</td>
<td style="text-align: center" width="129">11,000 IOPS</td>
<td style="text-align: center" width="130">13,000 IOPS</td>
</tr>
<tr>
<td style="text-align: center" width="138">eMMC 5.0</td>
<td style="text-align: center" width="102">250MB/s</td>
<td style="text-align: center" width="129"> 90MB/s</td>
<td style="text-align: center" width="129"> 7,000 IOPS</td>
<td style="text-align: center" width="130">13,000 IOPS</td>
</tr>
<tr>
<td style="text-align: center" width="138">eMMC 4.5</td>
<td style="text-align: center" width="102">140MB/s</td>
<td style="text-align: center" width="129"> 50MB/s</td>
<td style="text-align: center" width="129"> 7,000 IOPS</td>
<td style="text-align: center" width="130"> 2,000 IOPS</td>
</tr>
</tbody>
</table>
]]></content:encoded>
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				<title>[Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions</title>
				<link>https://news.samsung.com/global/video-the-future-of-autonomous-driving-samsungs-memory-component-solutions</link>
				<pubDate>Mon, 18 Mar 2019 18:00:26 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2019/03/Autonomous-memory-solution-video_thumb728.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[AI]]></category>
		<category><![CDATA[autonomous driving]]></category>
		<category><![CDATA[AutoSSD]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[GDDR6 DRAM]]></category>
		<category><![CDATA[LPDDR5 DRAM]]></category>
                <guid isPermaLink="false">http://bit.ly/2TJWuPe</guid>
									<description><![CDATA[The relationship between a car and its driver has always been a unique, interdependent one; a “mystical bond between man and machine”, in the words of the late Bernie Mac from the 2007 hit film, Transformers. But thanks to all the latest technological advances that are leading today’s automobile industry, this relationship is evolving, as […]]]></description>
																<content:encoded><![CDATA[<p><span>The relationship between a car and its driver has always been a unique, interdependent one; a “mystical bond between man and machine”, <a href="https://www.youtube.com/watch?v=bdr_GOutmXI" target="_blank" rel="noopener">in the words of the late Bernie Mac</a> from the 2007 hit film, <em>Transformers</em>. But thanks to all the latest technological advances that are leading today’s automobile industry, this relationship is evolving, as the amount of data processed by a smart vehicle and delivered to the driver increases. With this comes the need for vehicle-driver feedback that is instantaneous to uphold that most paramount of concerns, safety.  </span></p>
<p><span>Samsung Electronics, the world leader in advanced memory technology, is dedicated to developing the future of safe autonomous driving with components and solutions that prioritize safety above all else. In order to enable effective, high-speed driver feedback, Samsung’s automotive memory solutions for processing, storing and accessing information are paving the way for seamless and safe autonomous driving experiences. </span></p>
<p><span>The video below introduces some of the automotive memory solutions Samsung has integrated to ensure the most effective automobile-driver feedback loop possible. The eUFS harnesses its exceptional speed capability to power on in-car systems in 2 seconds with instant data access. The AutoSSD stores map data for autonomous driving at the highest bandwidth. The LPDDR5 DRAM component makes use of a highly advanced, speed-optimized and energy-efficient circuit architecture to transfer data from automobile sensors instantaneously, and the GDDR6 DRAM allows for AI deep learning thanks to its ultra-high bandwidth. </span></p>
<p><span>Take a look at the video below for more information on how these powerful components are enabling the future of autonomous driving, putting safety above all else. This latest development forms part of <a href="https://news.samsung.com/global/samsung-steps-up-investment-for-future-growth-takes-initiative-to-build-innovation-ecosystem" target="_blank" rel="noopener">Samsung’s commitment to investing in four key growth areas: AI, 5G technology, bio-pharmaceuticals and auto-technology components for future smart cars</a>. </span></p>
<p><span>Find out more: <a href="https://www.samsung.com/semiconductor/" target="_blank" rel="noopener">smsng.co/semiconductor</a>.<br />
</span></p>
<div class="youtube_wrap"><iframe src="https://www.youtube.com/embed/o-05clmF9Lw?rel=0" width="300" height="150" frameborder="0" allowfullscreen="allowfullscreen"><span style="width: 0px;overflow: hidden;line-height: 0" data-mce-type="bookmark" class="mce_SELRES_start"></span></iframe></div>
]]></content:encoded>
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					<item>
				<title>Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage</title>
				<link>https://news.samsung.com/global/samsung-breaks-terabyte-threshold-for-smartphone-storage-with-industrys-first-1tb-embedded-universal-flash-storage</link>
				<pubDate>Wed, 30 Jan 2019 11:00:27 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/eUFS-1TB_thumb728.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[128-Gigabyte Universal Flash Storage]]></category>
		<category><![CDATA[1TB eUFS]]></category>
		<category><![CDATA[256GB eUFS]]></category>
		<category><![CDATA[512GB eUFS package]]></category>
		<category><![CDATA[512Gb V-NAND]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[IOPS]]></category>
                <guid isPermaLink="false">http://bit.ly/2DDuToU</guid>
									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in […]]]></description>
																<content:encoded><![CDATA[<p><img class="alignnone size-full wp-image-107948" src="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/eUFS-1TB_main.jpg" alt="" width="1000" height="500" /></p>
<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.</p>
<p>“The 1TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “What’s more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market.”</p>
<p>Within the same package size (11.5mm x 13.0mm), the 1TB eUFS solution doubles the capacity of the previous 512GB version by combining 16 stacked layers of Samsung’s most advanced 512-gigabit (Gb) V-NAND flash memory and a newly developed proprietary controller. Smartphone users will now be able to store 260 10-minute videos in 4K UHD (3840×2160) format, whereas the 64GB eUFS widely used in many current high-end smartphones is capable of storing 13 videos of the same size.</p>
<p>The 1TB eUFS also possesses exceptional speed, allowing users to transfer large amounts of multimedia content in significantly reduced time. At up to 1,000 megabytes per second (MB/s), the new eUFS features approximately twice the sequential read speed of a typical 2.5-inch SATA solid state drive (SSD). This means that 5GB-sized full HD videos can be offloaded to an NVMe SSD in as fast as five seconds, which is 10 times the speed of a typical microSD card. Furthermore, the random read speed has increased by up to 38 percent over the 512GB version, clocking in at up to 58,000 IOPS. Random writes are 500 times faster than a high-performance microSD card (100 IOPS), coming in at up to 50,000 IOPS. The random speeds allow for high-speed continuous shooting at 960 frames per second and will enable smartphone users to take full advantage of the multi-camera capabilities in today and tomorrow’s flagship models.</p>
<p>Samsung plans to expand the production of its fifth-generation 512Gb V-NAND at its Pyeongtaek plant in Korea throughout the first half of 2019 to fully address the anticipated strong demand for the 1TB eUFS from mobile device manufacturers around the world.</p>
<p><strong>* Reference: Comparison of Internal Memory Performance</strong></p>
<table width="1000">
<tbody>
<tr>
<td style="text-align: left" width="200">Memory</td>
<td style="text-align: center" width="200">Sequential<br />
Read Speed</td>
<td style="text-align: center" width="200">Sequential<br />
Write Speed</td>
<td style="text-align: center" width="200">Random<br />
Read Speed</td>
<td style="text-align: center" width="200">Random<br />
Write Speed</td>
</tr>
<tr>
<td style="text-align: left" width="200"><strong>Samsung<br />
</strong><strong>1TB eUFS 2.1<br />
</strong><strong>(Jan. 2019)</strong></td>
<td style="text-align: center" width="200"><strong>1000 MB/s</strong></td>
<td style="text-align: center" width="200"><strong>260 MB/s</strong></td>
<td style="text-align: center" width="200"><strong>58,000 IOPS</strong></td>
<td style="text-align: center" width="200"><strong>50,000 IOPS</strong></td>
</tr>
<tr>
<td width="200">Samsung<br />
512GB eUFS 2.1<br />
(Nov. 2017)</td>
<td style="text-align: center" width="200">860 MB/s</td>
<td style="text-align: center" width="200">255 MB/s</td>
<td style="text-align: center" width="200">42,000 IOPS</td>
<td style="text-align: center" width="200">40,000 IOPS</td>
</tr>
<tr>
<td width="200">Samsung<br />
eUFS 2.1 for automotive<br />
(Sept. 2017)</td>
<td style="text-align: center" width="200">850 MB/s</td>
<td style="text-align: center" width="200">150 MB/s</td>
<td style="text-align: center" width="200">45,000 IOPS</td>
<td style="text-align: center" width="200">32,000 IOPS</td>
</tr>
<tr>
<td width="200">Samsung<br />
256GB UFS Card<br />
(July 2016)</td>
<td style="text-align: center" width="200">530 MB/s</td>
<td style="text-align: center" width="200">170 MB/s</td>
<td style="text-align: center" width="200">40,000 IOPS</td>
<td style="text-align: center" width="200">35,000 IOPS</td>
</tr>
<tr>
<td width="200">Samsung<br />
256GB eUFS 2.0<br />
(Feb. 2016)</td>
<td style="text-align: center" width="200">850 MB/s</td>
<td style="text-align: center" width="200">260 MB/s</td>
<td style="text-align: center" width="200">45,000 IOPS</td>
<td style="text-align: center" width="200">40,000 IOPS</td>
</tr>
<tr>
<td width="200">Samsung<br />
128GB eUFS 2.0<br />
(Jan. 2015)</td>
<td style="text-align: center" width="200">350 MB/s</td>
<td style="text-align: center" width="200">150 MB/s</td>
<td style="text-align: center" width="200">19,000 IOPS</td>
<td style="text-align: center" width="200">14,000 IOPS</td>
</tr>
<tr>
<td width="200">eMMC 5.1</td>
<td style="text-align: center" width="200">250 MB/s</td>
<td style="text-align: center" width="200">125 MB/s</td>
<td style="text-align: center" width="200">11,000 IOPS</td>
<td style="text-align: center" width="200">13,000 IOPS</td>
</tr>
<tr>
<td width="200">eMMC 5.0</td>
<td style="text-align: center" width="200">250 MB/s</td>
<td style="text-align: center" width="200">90 MB/s</td>
<td style="text-align: center" width="200">7,000 IOPS</td>
<td style="text-align: center" width="200">13,000 IOPS</td>
</tr>
<tr>
<td width="200">eMMC 4.5</td>
<td style="text-align: center" width="200">140 MB/s</td>
<td style="text-align: center" width="200">50 MB/s</td>
<td style="text-align: center" width="200">7,000 IOPS</td>
<td style="text-align: center" width="200">2,000 IOPS</td>
</tr>
</tbody>
</table>
]]></content:encoded>
																				</item>
					<item>
				<title>Samsung Showcases Latest Award-Winning Semiconductor and Automotive Solutions at Specialized CES Exhibit</title>
				<link>https://news.samsung.com/global/samsung-showcases-latest-award-winning-semiconductor-and-automotive-solutions-at-specialized-ces-exhibit</link>
				<pubDate>Fri, 11 Jan 2019 15:30:11 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/ExynosAutoV9-CES2019_thumb728.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[ADAS]]></category>
		<category><![CDATA[CES 2019]]></category>
		<category><![CDATA[DRVLINE™ Platform]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[Exynos Auto T]]></category>
		<category><![CDATA[Exynos Auto V9]]></category>
		<category><![CDATA[Exynos Modem 5100]]></category>
		<category><![CDATA[Semiconductor]]></category>
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									<description><![CDATA[At CES 2019, Samsung Electronics introduced its vision for the future of Connected Living and exhibited its most up-to-date solutions at the Las Vegas Convention Center. As exciting as this public exhibition was, it was at the company’s nearby specialized exhibition event where Samsung exclusively showcased its cutting-edge semiconductor and automotive technologies to key customers […]]]></description>
																<content:encoded><![CDATA[<p>At CES 2019, Samsung Electronics introduced its vision for the future of Connected Living and exhibited its most up-to-date solutions at the Las Vegas Convention Center. As exciting as this public exhibition was, it was at the company’s nearby specialized exhibition event where Samsung exclusively showcased its cutting-edge semiconductor and automotive technologies to key customers and partners. Between January 8 and 10, leading industry figures visited the Encore Ballroom at the Encore at Wynn Hotel, Las Vegas, to learn about the very latest in automotive and memory solutions from Samsung Semiconductor and discuss potential collaborations.</p>
<h3><span style="color: #000080"><strong>Pioneering Automotive Solutions</strong></span></h3>
<p>Samsung’s automotive solution offering has been one of the highlights of this year’s CES, and at the Encore Hotel showcase, key components and technologies for in-vehicle infotainment, telematics and the advanced driving assistance system (ADAS) were on display to invited customers and partners.</p>
<p><strong>Exynos Auto V9</strong> is Samsung’s first dedicated automotive system-on chip for next-generation IVI (In-Vehicle Infotainment) systems. The Exynos Auto V9 can support up to six high resolution displays through powerful processing from eight core CPUs and a tri-cluster GPU, an advanced GPU arranged in three separated sets of GPU cores able to seamlessly support multiple systems simultaneously. The Exynos Auto V9 is also equipped with a neural processing unit (NPU) that processes visual and audio data to accurately recognize face, speech and gesture patterns for intelligent driving experiences. The showcase demo presented diverse concurrent driving assistant and entertainment experiences – for example, the running of navigation in the central information display (CID) at the same time as a movie plays in rear-seat displays.</p>
<p><img class="alignnone wp-image-107699 size-full" src="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/ExynosAutoV9-e1547187043126.jpg" alt="Exynos Auto V9" width="1000" height="667" /></p>
<p><strong>Exynos Auto T</strong> is a telematics solution that empowers safe driving experiences through the integrated use of telecommunications and informatics technologies. The industry’s first cellular modem to support multi-mode from 2G to 5G NR, the <strong>Exynos Modem 5100</strong>, was also showcased.</p>
<p><img loading="lazy" class="alignnone wp-image-107700 size-full" src="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/ExynosModem5100-e1547187068446.jpg" alt="Exynos Modem 5100" width="1000" height="627" /></p>
<p><strong>ADAS </strong>is leading the way in in-drive visual perception capabilities. The demonstration showcased how the ADAS system can recognize and detecting all manner of objects such as cars, pedestrians and traffic signs. Furthermore, the <strong>DRVLINE</strong>, an open, modular and scalable platform for building ADAS with a faster time to market, was introduced at the showcase.</p>
<p><strong>ISOCELL Auto </strong>image sensor is an advanced new solution capable of bringing about a wholly new driving experience thanks to its high performance in detecting objects in a variety of lighting conditions. The ISOCELL Auto image sensor technology provides unrivalled object recognition in a diverse range of driving environments, as the sensor’s high resolution and fast frame rate enables the accurate detection of any moving objects, while its high light sensitivity assists in object recognition even in dark lighting conditions. Furthermore, a wide dynamic range permits the sensor to respond quickly and effectively to sudden changes in brightness, as one might experience when driving in or out of dimly-lit tunnels.</p>
<p><strong>Innovative Pixel Solution</strong> for Smart ADB(Adaptive Driving Beam) is the next-generation one-chip LED solution for headlamps that helps prevent glare affecting preceding and oncoming vehicles or pedestrians by automatically controlling the light distribution of a headlamp. Samsung presented this highly-specialized LED solution by demonstrating different driving situations including when a driver starts the engine, needs high or low beam, and faces preceding or oncoming vehicle.</p>
<h3><span style="color: #000080"><strong>Next-Generation</strong><strong> Semiconductor Technologies</strong></span></h3>
<p>This year, five of Samsung’s latest semiconductor products have received recognition from the coveted <span><a href="https://news.samsung.com/global/samsung-wins-30-ces-2019-innovation-awards-for-outstanding-design-and-engineering" target="_blank" rel="noopener">CES 2019 Best of Innovation Awards</a></span> – the Samsung 256GB 3DS DDR4 RDIMM, 512GB Universal Flash Storage, 3.84TB NVMe Z-SSD SZ1733, LM302S and the SSM-U Series.</p>
<p><img loading="lazy" class="alignnone size-full wp-image-107685" src="https://img.global.news.samsung.com/global/wp-content/uploads/2019/01/semiconductor-at-ces2019_main.jpg" alt="" width="1000" height="533" /></p>
<p><strong>Samsung 256GB 3DS DDR4 RDIMM</strong> is the industry’s fastest DDR4 and highest density memory module for next-generation enterprise server platforms, providing the finest high-density, high-performance consumer infrastructure solutions with extremely low-power consumption (15 watts at 1.2V).</p>
<p><strong>Samsung 512GB Universal Flash Storage</strong> is the industry’s first 512-gigabyte embedded Universal Flash Storage (eUFS) for automotive A/V systems and next-gen flagship mobile devices, using Samsung’s new 64-layer 512-gigabit V-NAND chips. The 512GB eUFS package transfers a 5GB-equivalent full HD video clip to an SSD in about six seconds, over 8 times faster than a typical microSD card.</p>
<p><strong>Samsung 3.84TB NVMe Z-SSD SZ1733</strong> offers a new level of storage for supercomputing targeted for AI analysis, big data and IoT applications, using Samsung’s new Z-NAND chips which provide 10 times higher cell read performance than 3-bit V-NAND chips.</p>
<p><strong>Samsung LM302S </strong>is the most user-oriented next-generation lighting platform to date, designed to improve work efficiency by helping users achieve a better circadian rhythm and healthier sleep. Its human-centric LED solution can improve a person’s concentration level for greater work efficiency by as much as 10% and improve sleep quality by repressing melatonin during the day.</p>
<p><strong>Samsung SSM-U Series</strong> is a new type of smart module made up of tiny radar-based sensors with higher detecting sensitivity than conventional sensors. The SSM-U series features invisible and intelligent motion detection-based transmission for greater flexibility and reactivity in smart residential lighting.</p>
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				<title>[Infographic] Semiconductor Technology: The Essential Building Blocks of Mobile Innovation</title>
				<link>https://news.samsung.com/global/infographic-semiconductor-technology-the-essential-building-blocks-of-mobile-innovation</link>
				<pubDate>Tue, 27 Mar 2018 11:00:05 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Infographics]]></category>
		<category><![CDATA[Mobile]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[Exynos 9]]></category>
		<category><![CDATA[Iris Recognition]]></category>
		<category><![CDATA[ISOCELL]]></category>
		<category><![CDATA[LED Solutions]]></category>
		<category><![CDATA[LPDDR4X]]></category>
		<category><![CDATA[OLED]]></category>
		<category><![CDATA[V-NAND]]></category>
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									<description><![CDATA[Hidden under the cover of today’s advanced mobile devices, there are innovative semiconductor and LED solutions built in to enable new features and technologies consumers are continuously seeking. With its decades-long technology innovation and expertise, Samsung Electronics’ Device Solutions Division provides an extensive range of semiconductor and LED solutions to meet the ever-increasing requirements of […]]]></description>
																<content:encoded><![CDATA[<p>Hidden under the cover of today’s advanced mobile devices, there are innovative semiconductor and LED solutions built in to enable new features and technologies consumers are continuously seeking.</p>
<p>With its decades-long technology innovation and expertise, Samsung Electronics’ Device Solutions Division provides an extensive range of semiconductor and LED solutions to meet the ever-increasing requirements of the mobile industry. While not always visible to end users, Samsung’s component solutions have been utilized comprehensively to raise the level of what’s possible for mobile devices, and help enable a world of difference in performance and user experience.</p>
<p>Here, we go under the hood, to take a look at some of these solutions.</p>
<p><img loading="lazy" class="alignnone size-full wp-image-99551" src="https://img.global.news.samsung.com/global/wp-content/uploads/2018/03/semi-solution-for-mobile-inno_main_1.jpg" alt="" width="705" height="904" /></p>
<h3><span style="color: #000080"><strong>Leading-edge Processor and Memory Solutions for a Seamless User Experience</strong></span></h3>
<p>One prime example of Samsung’s component innovation is the Exynos 9 Series 9810 processor, built upon the company’s latest 2<sup>nd</sup> generation 10-nanometer LPP process technology. The processor delivers powerful mobile computing performance with its 3<sup>rd</sup> generation CPU and seamless connectivity with a 6-mode/all network supporting 1.2Gbps DL 6CA Cat.18 LTE modem.</p>
<p>Working in tandem with the Exynos processor is the LPDDR4X memory chip, the industry’s most up-to-date mobile DRAM solution that provides breakthrough RAM performance and energy efficiency. Available in a compact package offering up to 8-gigabyte (GB) capacity, the LPDDR4X enables prompt multitasking and data processing for advanced mobile applications such as 4K UHD video recording and virtual computing.</p>
<p>Also, under today’s heavy multimedia and content use environment, users can safely store their valuable data on Samsung eUFS, an embedded high-speed mobile storage solution for flagship devices. Based on Samsung’s proprietary V-NAND technology, the eUFS features ultrafast data read and download speeds as well as abundant storage capacity as high as 512GB.</p>
<h3><strong><span style="color: #000080">Enhanced Imaging and Video Features</span> </strong></h3>
<p>The Samsung ISOCELL Fast 2L3, a 3-stack fast readout image sensor with an embedded 2Gb LPDDR4 memory, enables significantly enhanced mobile imaging and video functionality with the ability to record at 960fps for brand new features like stunning slow-motion video shooting. Also among Samsung’s broad image sensor lineup is a front-facing ISOCELL Bright image sensor, which enables high-quality selfies on mobile devices even in very low light settings, using leading-edge pixel technologies.</p>
<p>In addition, Samsung’s Patterned Lens-Integrated Flash LED component, positioned next to the rear camera, enhances the quality of images even further with its high luminous intensity and uniformity.</p>
<h3></h3>
<h3><strong><span style="color: #000080">Reinforced Security, Power and Touch Command Management </span> </strong></h3>
<p>Samsung continues to reinforce security, power, and touch command management on mobile devices through an array of component solutions. For example, its new iris sensor enables a fast yet highly secure option to unlock or authorize application access, and the touch controller enables instant feedback at the tap of one’s finger. Last but not the least, Samsung’s power management IC delivers a stable supply of power, supporting devices to perform with optimal energy efficiency.</p>
<p>As mobile devices continue to evolve, Samsung Electronics’ Device Solutions Division will remain committed to developing and providing its customers with semiconductor and LED technology with distinct value, and providing the best in performance, capacity, functionality and energy efficiency.</p>
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				<title>Samsung Begins Mass Production of 256GB  Embedded Universal Flash Storage  for Automotive Applications</title>
				<link>https://news.samsung.com/global/samsung-begins-mass-production-of-256gb-embedded-universal-flash-storage-for-automotive-applications</link>
				<pubDate>Thu, 08 Feb 2018 11:00:33 +0000</pubDate>
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				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[128-Gigabyte Universal Flash Storage]]></category>
		<category><![CDATA[256-Gigabyte]]></category>
		<category><![CDATA[256-Gigabyte Universal Flash Storage]]></category>
		<category><![CDATA[ADAS]]></category>
		<category><![CDATA[AP]]></category>
		<category><![CDATA[eMMC]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[IOPS]]></category>
		<category><![CDATA[JEDEC UFS 2.1 standard]]></category>
		<category><![CDATA[JEDEC UFS 3.0 standard]]></category>
		<category><![CDATA[nand]]></category>
                <guid isPermaLink="false">http://bit.ly/2ErSTwM</guid>
									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry. Following the memory breakthrough of the automotive industry’s […]]]></description>
																<content:encoded><![CDATA[<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.</p>
<p>Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.</p>
<p>As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode,</p>
<p>“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”</p>
<p><img loading="lazy" class="alignnone wp-image-97963 size-full" src="https://img.global.news.samsung.com/global/wp-content/uploads/2018/02/256gb-eufs-for-auto-apps_main_1_FF.jpg" alt="" width="705" height="458" /></p>
<p>Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.</p>
<p>Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.</p>
<p>The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.</p>
<p>Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.</p>
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				<title>Samsung Starts Producing Industry’s First Universal Flash Storage For Next-Generation Automotive Applications</title>
				<link>https://news.samsung.com/global/samsung-starts-producing-industrys-first-universal-flash-storage-for-next-generation-automotive-applications</link>
				<pubDate>Tue, 26 Sep 2017 11:00:36 +0000</pubDate>
								<media:content url="https://img.global.news.samsung.com/global/wp-content/uploads/2017/09/eUFS_thumb704.jpg" medium="image" />
				<dc:creator><![CDATA[Samsung Newsroom]]></dc:creator>
						<category><![CDATA[Press Release]]></category>
		<category><![CDATA[Semiconductors]]></category>
		<category><![CDATA[ADAS]]></category>
		<category><![CDATA[Automobile]]></category>
		<category><![CDATA[Embedded UFS]]></category>
		<category><![CDATA[eUFS]]></category>
		<category><![CDATA[Memory Technology]]></category>
		<category><![CDATA[next-generation automotive applications]]></category>
		<category><![CDATA[Universal Flash Storage solution]]></category>
                <guid isPermaLink="false">http://bit.ly/2wNf9Ok</guid>
									<description><![CDATA[Samsung Electronics, the world leader in advanced memory technology, today announced that it is introducing the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128-gigabyte (GB) and 64GB versions, the new eUFS solution has been designed for advanced driver-assistance systems (ADAS), next-generation dashboards and infotainment systems that […]]]></description>
																<content:encoded><![CDATA[<p><img loading="lazy" class="alignnone size-full wp-image-94139" src="https://img.global.news.samsung.com/global/wp-content/uploads/2017/09/eUFS_main1.jpg" alt="" width="705" height="495" /></p>
<p>Samsung Electronics, the world leader in advanced memory technology, today announced that it is introducing the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128-gigabyte (GB) and 64GB versions, the new eUFS solution has been designed for advanced driver-assistance systems (ADAS), next-generation dashboards and infotainment systems that provide comprehensive connected features for drivers and passengers worldwide.</p>
<p>“We are taking a major step in accelerating the introduction of next-generation ADAS and automotive infotainment systems by offering the industry’s first eUFS solution for the market much earlier than expected,” said Jinman Han, Senior Vice President of Memory Product Planning & Application Engineering at Samsung Electronics. “Samsung is taking the lead in the growth of the memory market for sophisticated automotive applications, while continuing to deliver leading-edge UFS solutions with higher performance, density and reliability.”</p>
<p>Embedded UFS solutions have been used in a variety of mobile applications since early 2015, when Samsung introduced 128GB embedded memory based on the JEDEC UFS 2.0 standard, for the first time in the industry. Since then, the high performance and proven quality of UFS has led to its wide adoption in large numbers of mobile devices from flagship smartphones initially, to also now in mid-market smartphones.</p>
<p>Configured on the most up-to-date UFS standard (JEDEC UFS 2.1), the new Samsung eUFSwill provide advanced data transfer speeds and robust data reliability. For example, the new Samsung 128GB eUFS can read data at up to 850 megabytes per second (MB/s), which is approximately 3.4 times faster than the 250MB/s read speed of today’s eMMC 5.0 solutions. It also offers about 6.3 times faster random reading than eMMC at 45,000 IOPS. This will contribute to significantly enhanced performance in upcoming automotive infotainment systems for better managing audio content, increasing navigation responsiveness, accessing Internet-enabled traffic and weather reports, improving handling of hands-free voice commands, and speeding up rear-seat social media interplay.</p>
<p>The new eUFS solution also features an efficient and reliable error-handling process, which is essential for next-generation in-vehicle infotainment. Based on the MIPI UniPro<sup>®*</sup> protocol, the eUFS enables detecting and recovering from I/O error on hardware layers, without having to involve the host software or restarting tasks.</p>
<p>In addition, the Samsung eUFS supports advanced data refresh and temperature notification features for superior system reliability. The advanced data refresh operation allows a choice of refresh methods, and provides information on the refresh unit, frequency and progress for the host device’s control. This enables optimal data reliability, an essential element of automotive applications.</p>
<p>When it comes to thermal management, the Samsung eUFS equips the temperature sensor inside the controller to enable highly reliable device temperature control. This prevents the eUFS from crossing well-defined upper and lower temperature boundaries, thereby allowing its NAND cells to flawlessly function within a tough automotive temperature environment.</p>
<p>In light of the eUFS’ high performance and reliability, Samsung expects rapid adoption in the automotive market. Samsung will continue to satisfy the growing storage needs of leading automotive manufacturers by offering a variety of advanced eUFS lineups, while more thoroughly addressing the ever-increasing demand for leading-edge memory solutions in other market segments, too.</p>
<p><strong> </strong></p>
<p><span style="font-size: small"><em>* Editor’s Note:</em> MIPI UniPro<sup>®</sup> is a general purpose, unified protocol that services a wide range of interface needs in mobile and connected devices. The interface was developed by the MIPI Alliance UniPro Working Group and has been available since 2007. Its current version, v1.61, was released in 2015. For more information, please visit <a href="https://mipi.org" target="_blank" rel="noopener">https://mipi.org</a>.</span></p>
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