“It is exciting to see our environmentally sustainable efforts receiving global acknowledgements,” said Seong-dai Jang, Senior Vice President and Head of DS Corporate Sustainability Management Office at Samsung Electronics. “We will continue our path towards a sustainable future with ‘greener’ chips enabled by Samsung’s cutting-edge technology.”

Five Memory Products Achieve the Carbon Trust ‘Reducing CO2’ Certification

Five Samsung memory products – HBM2E (8GB), GDDR6 (8Gb), UFS 3.1 (512GB), Portable SSD T7 (1TB), microSD EVO Select (128GB) – recently earned ‘Reducing CO2’ labels from the Carbon Trust. The previous versions of the five products had received the ‘CO2 Measured’ certification from the Carbon Trust last year. The Carbon Trust recently also certified the product carbon footprints of 20 memory products¹ by giving them the ‘CO2 Measured’ product carbon footprint label.

The Carbon Trust is an independent and expert partner of organizations that advises businesses on their opportunities in a sustainable, low-carbon world. The Carbon Trust also certifies the environmental footprint of organizations, supply chains and products.

The Reducing CO2 label certifies that a product’s carbon emission has decreased. Samsung was able to cut the carbon emission of the five memory products through enhanced production efficiency. This means that less electricity and raw materials were used per chip. For the Portable SSD T7 (1TB), Samsung used environmentally sustainable paper instead of plastic as packaging material to minimize the carbon footprint of the product.

Samsung estimates that the volume of carbon emissions reduced from the five products, after their release until July 2021, amounts to approximately 680,000 metric tons of CO2, which is equivalent to 11.3 million urban tree seedlings grown for ten years or the greenhouse gas emitted from 149,000 cars driven for one year.

Before a product can be certified for carbon reduction, its current carbon footprint must be validated in order to set the starting line for measuring carbon footprint changes. The CO2 Measured label verifies the current carbon emission of the product with a globally recognized specification (PAS 2050). Thus, the 20 Samsung memory products with the CO2 Measured label has now set the benchmark for future carbon reduction.

“We have certified five of Samsung’s memory chip products with the CO2 Reducing label, and are pleased to bring on board 20 more products with the CO2 Measured label,” said Hugh Jones, Managing Director at the Carbon Trust Advisory. “We hope that Samsung’s efforts could spread out to the entire semiconductor industry, so that the industry can continue its journey towards a more sustainable future.”

Carbon Footprint of C-series 3W Automotive LEDs Verified by UL

Four C-series 3W Automotive LED packages manufactured by Samsung – Gen3 (third generation) 3W White, Gen3 3W Amber, Gen2 (second generation) 3W White and Gen2 3W Amber – received verification of their carbon footprint to ISO 14064-3 by UL.

UL, the global safety science leader, provides testing, inspection and certification, advisory and risk management services, decision-making tools, training and business intelligence offerings to help customers based in more than 100 countries solve critical business challenges, achieve sustainability goals and prepare for future opportunities.

Since Samsung’s C-series 3W Automotive LED packages are energy efficient products that draw less power but produces more light output, they reduce carbon emissions of cars by improving energy efficiency and ensure longer driving range for electric vehicles in a single charge.

“UL congratulates Samsung for pursuing carbon footprint verification for their four C-series 3W Automotive LED packages, which will help automotive manufacturers select products with transparent, verified information about their environmental footprint,” said Doug Lockard, Vice President and General Manager of UL’s Retail and Consumer Products group. “By understanding the carbon impact of products, manufacturers like Samsung can work to reduce those impacts and improve the environmental performance of products over time.”

¹ SODIMM (8GB/16GB), LPDDR5 (8GB/12GB/16GB), RDIMM (16GB/32GB), 980 PRO SSD (250GB/500GB/1TB/2TB), HBM2E (16GB), GDDR6 (16Gb), UFS 3.1 (128GB/256GB), microSD EVO Select (64GB/256GB/512GB), Portable SSD T7 (500GB/2TB)

Samsung Electronics, a world leader in advanced digital component solutions, today unveiled its first “human-centric” LED packages, collectively known as LM302N. Engineered with carefully created light spectra, the LM302N family helps human bodies adjust melatonin levels indoors, making people feel more energetic or relaxed depending on their daily life patterns.

“The benefits of using Samsung’s LM302N reach beyond the basic lighting function of visual recognition, by improving the non-visual biological effects of lighting on people,” said Un Soo Kim, senior vice president of LED Business Team at Samsung Electronics. “Our LED solutions are ushering in a whole new human-oriented approach of using artificial lighting to enhance productivity and relaxation, benefitting modern-day indoor lifestyles.”

Melatonin, a hormone which regulates the sleep-wake cycle, responds to the cyan wavelength range of light. Brighter cyan-concentrated lighting suppresses the body’s production of melatonin, increasing concentration and enabling a greater overall sense of alertness. Similarly, a lower cyan light intensity minimizes disturbances to the natural onset of the body’s melatonin production, helping to promote sleep quality.

Samsung’s LM302N utilizes precisely designed light spectra with optimized amounts of cyan to accommodate lighting needs to the extent desired at any given point in time: the LM302N DAY improves alertness and the LM302N NITE enhances relaxation. Standardized at 3.0×3.0mm, these offerings can fit in a wide range of lighting fixtures and are protected against humidity and heat.

The LM302N DAY can suppress the body’s melatonin level more than 18 percent below that of conventional LED lighting. Available in a variety of color temperatures from 3000K to 6500K, the DAY package can be used in a diverse range of indoor applications, such as schools, offices, libraries and industrial sites, to enhance an individual’s sense of awakeness and energy level.

The LM302N NITE can provide a proper level of brightness without hindering the release of melatonin, helping people to maintain the hormone level as if they were in a calm natural atmosphere at night. The body releases about five percent more melatonin under lights with the LM302N NITE packages than conventional LED packages, increasing relaxation. By comparison, spending a lot of time under conventional nighttime lighting can cause excessive alertness that makes it harder to fall asleep. Additionally, the LM302N NITE is offered in color temperatures between 1800K and 4000K, providing design flexibility to bring the benefits of relaxing light to a variety of lighting spaces.

The DAY and NITE packages can also be combined into a single luminaire to help people maintain their natural circadian rhythm 24 hours a day. This duo-lighting option is optimal for those who spend most of their time indoors and struggle with confused body clocks.

The newly launched LM302N family is now in mass production.

LM302N Lineup

* CRI (Color rendering index): a standard method of measuring the quality of light by quantifying how the colors of surfaces appear when illuminated by a specific light source. The higher the CRI number, the more accurately a light source will render the color of an object.

** CCT (Correlated color temperature): a general indication of the “warmth” or “coolness” of light. Light sources with a CCT below 3200K are usually considered warm (more red), whereas those with a CCT above 4000K are usually considered cool (more blue) in appearance.

*** M/P Ratio (Melanopic/photopic ratio): a measure of how efficiently a light source triggers suppression of melatonin

**** MDER (Melanopic daylight efficacy ratio): a measure of how bright standard light (Illuminant D65, defined by International Commission on Illumination) should be for a level of melatonin suppression comparable to the tested light source

Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.

Samsung’s CSP technology significantly scales down the size of a conventional LED package by combining advanced flip chip** technology with phosphor coating technology, thereby eliminating any need for metal wires and plastic molds. This shift enables more flexible and compact designs when manufacturing LED lighting modules or fixtures, and lowers the production and operational costs of LED lighting systems. Samsung’s CSP products also allow for flexibility in adjusting the size of the light-emitting surface and its associated luminance level, to meet the diverse requirements of a wide variety of lighting applications including bulbs, spot lighting, downlighting and street lighting.

“Our new CSP products overcome what had been significant performance limitations of conventional LED packages. By expanding our CSP line-up, we expect to provide greater value to the LED lighting market, enabling new possibilities in LED lighting and giving our customers greater design flexibility,” said Jacob Tarn, Executive Vice President, LED Business Team, Samsung Electronics. “We are aggressively innovating through the introduction of well-differentiated LED components, while further strengthening our presence in the LED marketplace in terms of technology and cost.”

The new CSP line-up has been fortified with a wide range of operating current options from 0.6W to 3W and even 10W LED packages. The new packages complete Samsung’s CSP technology roadmap, which was announced at LIGHTFAIR International 2015 when the company’s CSP technology commercialization plan was unveiled.

Mid-power, 0.6W-class CSP LED packages – LM101A & LM102A

The LM101A and LM102 are Samsung’s new mid-power CSP packages for LED lighting. Based on advanced flip chip technology, the LM101A and LM102A feature ultra-slim form factors and simple package structures that enhance their cost competitiveness. Each offers two voltage options – 3V and 6V, which make the packages applicable to numerous applications including bulb, high bay lighting, downlighting and spot lighting.

Along with enticingly small form factors, the mid-power CSP LED packages also provide wide beam angles, therefore delivering even greater design flexibility. Samsung’s LM101A and LM102A packages are available in full color temperatures with three color rendering index options from CRI 70 to CRI 80 and CRI 90.

High-power, 3W-class CSP LED package – LH181A

The LH181A is a high-power CSP package that features approximately 12 percent higher luminous flux*** at a maximum current of 1.5A, compared to Samsung’s 3W-class ceramic-based high-power LED package. The LH181A offers a high luminous flux, typically at around 162lm/W (@350mA, Ra70, 5000K).

Each LH181A measures 1.91×1.91mm, which is about 30 percent smaller than Samsung’s ceramic-based LED solution. The package’s ultra-small size enables much smaller lighting designs and better lm/$ (lumens per dollar) value that can be especially useful in outdoor and spot lighting applications.

The LH181A provides a wide beam angle of 140 degrees making it also applicable to street lighting by adding a lens as a secondary optic solution.

CSP Arrays – LH204A & LH309A

Samsung’s CSP arrays, the LH204A and the LH309A, are high-power LED solutions with an operating wattage range from 5W to 10W. The LH204A is a 2×2 array of CSP LED chips that delivers 12V at a 5W-class operating wattage, while the LH309A is a 3×3 chip array offering 26V at a 10W-class operating wattage.

The CSP arrays provide high light quality by adhering a single phosphor to the FX (flexible) circuit board on which tiny CSP LED chips with low thermal resistance are arranged. The use of a thin flexible-film FX circuit board accentuates the thin design of the arranged CSP LED chips. The CSP arrays are suitable for spotlighting applications where high light quality is required from a single light source.

Next-generation CSP solution – PoW (Phosphor-on-Wafer) LED package

Samsung’s Phosphor-on-Wafer (PoW) LED package technology embraces the advantages of CSP LED packaging, while overcoming limitations of cost reduction by upgrading the chip manufacturing process through the use of 8-inch GaN-on-Si wafers instead of 4-inch sapphire wafers. This transition will enable a higher quality CSP LED package by eliminating the chip rearrangement process. The reason for this is that the phosphors can be directly coated on the surface of the GaN-on-Si wafers before being diced, while sapphire wafers have to be cut into chips first and then rearranged to be coated with phosphor.

By simplifying the LED component manufacturing process and improving LED package quality, the PoW LED package technology is expected to contribute significantly to the growth of the LED lighting industry.

Samsung has already applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices since several years ago. Samsung also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of this year.

Samsung will showcase the new CSP products and technologies at the Light + Building 2016 event under the theme “Lighting & Beyond” in Frankfurt, Germany, March 13th – 18th. Visit Booth B04, Hall6.2 to learn more about Samsung’s differentiated LED technologies and innovative component solutions.

The full line-up of Samsung’s CSP includes:

* Samsung’s chip-scale package (CSP) is combination of advanced flip chip technology and phosphor dispensing technology. A CSP chip can be created by flipping over blue LED chips and then immediately coating them with a phosphor substance.

** Flip chip technology is a technology that mounts the LED dies upside down so that its top side faces down, in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to electric boards.

*** Luminous flux is the measured parameter of the perceived power of light on human eye, and uses lumen (lm) as unit in LED industry. One lumen is defined as the luminous flux of light produced by a light source that emits one candela of luminous intensity over a solid angle of one square radian.