Samsung Electronics announced that it will demonstrate for the first time, the company’s new open, secure and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.

Samsung’s smart lighting platform is designed for integration with LED lighting systems in order to easily transform luminaires into smart, digital nodes. This Internet of Things (IoT) platform incorporates processing capabilities, firmware, connectivity and an open architecture connected to sensors for collecting data and creating new applications. Information created by the smart lighting platform can then be aggregated for analysis in order to create new services for cities, communities, building operators and ultimately all individuals, while further improving energy efficiency, safety and productivity.

Samsung is inviting industry partners to join the company in the on-going development of the smart lighting platform to encourage and accelerate innovation in smart lighting. The aim is to harness the energy, enthusiasm and creativity of many entrepreneurs and creative minds in order to quickly usher in the benefits of smart lighting. Samsung Electronics’ Strategy and Innovation Center (SSIC) and LED Business unit are collaborating to bring advanced technology to lighting solutions.

“The convergence of IoT and LED technologies is adding intelligence to lighting systems and enabling the digital lighting industry,” said Young Sohn, President and Chief Strategy Officer, Samsung Electronics. “Using data analytics, we can transform big data into valuable services and benefits, such as energy management, maintenance, safety and security, and improved comfort. Samsung’s smart lighting platform will enable our luminaire OEM customers and our ecosystem partners, including sensor providers, analytics specialists, apps and services developers, to simplify and accelerate their ability to go-to-market.”

Indoors or outdoors, lighting is one of the most ubiquitous technologies people interact with every day. As smart lighting systems become integrated into cities, offices and homes, it’s expected that people will realize immediate improvements in energy efficiency, increased quality of life and personal safety.

“One company alone can’t create the world of smart lighting, and industry collaboration is essential to making smart lighting a reality,” said Dr. Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “We have been a leader in LED industry innovation for years and now we are very happy to announce our commitment to the smart lighting platform as a critical initial stage of IoT fusion and convergence. We are especially excited about the new possibilities for LED lighting that can be enabled by serving our customers on a smart-lighting-platform basis as we fully utilize Samsung’s core competencies in expanding our business landscape.”

At LIGHTFAIR International 2015, Samsung will demonstrate its new smart lighting platform and showcase the majority of its LED component product lineups at booth #521 in the Jacob Javits Convention Center.

Samsung’s new CSP technology significantly scales down the size of an LED package, which enables more flexible and compact designs when manufacturing consumer LED lighting modules or fixtures, and lowers the manufacturing and operational costs of a LED lighting system. Samsung’s CSP also provides flexibility in adjusting the size of the light-emitting surface and the luminance level, to meet the differing requirements of various lighting fixture applications.

“Our LED chip scale packaging technology will contribute to providing innovative LED component solutions that can overcome the limitations of today’s LED lighting market,” said Dr. Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “We will incorporate the new technology in future Samsung LED products and continue to introduce more advanced LED technology, while strengthening our presence in the global LED market.”

The newly introduced CSP technology is actually Samsung’s second generation. Last year, Samsung introduced LED package products using its first chip scale packaging technology which featured a versatile new type of flip chip packaging. The first generation CSP was created by flipping over blue LED chips and then adhering a phosphor film to each of them. Unlike conventional LED packages that require a packaging process following the actual chip manufacturing, this allowed chip-scale packages to be created without a mold, enabling more compact LED lighting designs.

Samsung’s new, second generation CSP takes the advancements even further. In the second generation CSP, blue LED chips are flipped over and immediately coated with a phosphor substance. The second generation CSP has inherited the advantages of the first generation CSPs, such as freedom from metal wires and plastic molds, which lead to smaller packages, more compact lighting designs, lower thermal resistance and high current availability, resulting in high flux and greater reliability. In addition, using the second generation CSP process makes new Samsung LED packages even more competitive in raw costs, and achieves higher robustness and reliability with a longer life span, as well as higher operating temperatures and current.

Based on the new advancements, Samsung’s second generation CSP technology enables LED packages with an ultra-compact form factor: 1.2mm by 1.2mm. These dimensions are approximately 30 percent smaller than the 1.4mm by 1.4mm measure of the first generation CSP, while offering a 10 percent improvement in light performance. It also provides higher light quality with advanced multifaceted phosphor coating technology, which covers the top and four sides of an LED package with phosphor. Because of the small form factor that it allows, the new CSP technology can be used in a wide variety of LED packages for applications that range from ambient light and spotlight, to downlight and bulb lighting.

Moreover, the second generation CSP LED packages can bring even greater design flexibility by offering added delivery options. In the manufacturing process, 2 by 2 and 3 by 3 CSP arrays can be easily created and offered to customers, depending on a diversity of market needs. The availability of CSP arrays provides not only more design flexibility, but also better light quality in each LED luminaire through their one-lens design, in which the CSP arrays share a single lens instead of having to use individual lenses for multiple conventional packages.

Samsung’s ultra-compact, second generation CSP technology is expected to be applied to new LED packages slated to be introduced in the fourth quarter of this year, and will support a wide range of Correlated Color Temperature (CCT) specifications.

At LIGHTFAIR International 2015, Samsung will showcase the vast majority of its LED component product lineups at booth #521 in the Jacob Javits Convention Center.

Samsung Electronics introduced the LM301A, a flip-chip-based mid-power LED package that can operate at anywhere from 0.2 watts to 1 watt — providing a wide range of current options, resulting in much improved light efficacy. The package was announced at a press conference, in conjunction with LIGHTFAIR International 2015, being held in New York, May 5-7.

Coming in a 3.0mm by 3.0mm form factor that is increasingly popular in LED lighting applications today, the new LM301A’s lower and wider current alternatives are a result of Samsung flip chip technology, which allows the LED chip to have the shortest distance from the junction to the base of a package, and eliminates the need for metal wire bonding in the packaging process. These changes enable much lower heat resistance compared to conventional epi-up chip technology – an approximate five percent temperature drop per watt within a more desirable 25°C to 85°C temperature range.

“Designed with advanced flip chip technology, the new LM301A overcomes what had been significant performance and power limitations of conventional mid-power lighting LED packages,” said Dr. Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “We will continue to strengthen our technology leadership in the market by launching highly competitive, next generation LED products based on Samsung’s most innovative, market-proven LED technologies.”

Samsung’s new LM301A LED package offers the following light efficacy alternatives:

• 170lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C and 65mA)
• 160lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 65mA)
• 155lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 150mA)
• 145lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 150mA)
• 130lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 350mA)
• 120lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 350mA)

The light efficacy levels make the LM301A package well suited for diverse lighting applications ranging from ambient to high intensity lighting, such as high bays and outdoor lighting. In addition, the performance and cost-competiveness of the new mid-power package should also be well regarded by lighting fixture manufacturers.

The LM301A features Epoxy Mold Compound (EMC) packaging, which makes it more reliable and extends its lifespan. Compared to existing Polyphthalamide (PPA) and PCT materials now extensively used in LED packaging, Samsung’s EMC packaging offers more protection against heat and UV rays, making it suitable for high-luminance LED applications requiring higher wattage.

The new package also will support CCT (Correlated Color Temperature) specifications ranging from 2700K to 6500K.

The LM301A will be available beginning in July.