Samsung Electronics, a world leader in advanced semiconductor technology, today held the first Samsung Advanced Foundry Ecosystem (SAFE) Forum 2019 in the United States. By sharing the latest technology trends and strengthening cooperation within the foundry ecosystem, Samsung showcased its strong dedication to customers.

SAFE Forum is designed to provide an opportunity for SAFE partner companies to directly meet with customers to discuss comprehensive design technology infrastructure, including electronic design automation (EDA), intellectual property (IP), cloud, design service, and packaging, which is critical to efficiently developing and manufacturing semiconductor products.

While the Samsung Foundry Forum (SFF) has served as a channel to present Samsung’s technology roadmap and leadership to customers, the newly held SAFE Forum is distinctive in that it allows its partners to engage deeper and more efficient collaboration within Samsung’s foundry ecosystem by directly communicating in detail with customers on their own design support solutions proven by Samsung.

“SAFE program has grown in quality over the past two years; it has expanded the number of competitive partnerships and support of flexible product design for customers as well as bolstered the relationship between our partners, customers, and Samsung foundry,” said Jae-hong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “We will continue our efforts in enhancing accessibility to enable customers to more easily utilize Samsung’s excellent foundry solutions.”

As the latest system-on-chip (SoC) product requires more sophisticated features in a smaller surface size than before, the number of considerations in IC design optimization has increased exponentially: performance, power, security, design, density, etc.

To actively respond to these IC design trends and lower the design barrier for developing competitive SoCs, Samsung Electronics launched the SAFE program in early 2018.

Under the slogan “Partnering for a bold silicon future”, details on the latest global IC design trends as well as benefits of the efficient easy-to-use platform design infrastructure were introduced.

With more than 400 industry experts attending the first SAFE Forum, 12 detailed sessions were given by around 30 speakers from 15 partner companies, focusing on emerging high-growth applications, including high-performing computer (HPC), internet-of-things (IoT), and automotive. Attendees also had a chance to discover the optimal solution for implementing their new ideas into chips through 40 partner booths at the venue.

From the first half of 2019, the packaging used currently for Samsung’s products and accessories – ranging from mobile phones and tablets to home appliances – will be substituted with environmentally sustainable materials like recycled/bio-based plastics and paper.

To revamp product packaging, Samsung Electronics has formed a task force involving design and development, purchasing, marketing and quality control for innovative packaging ideas.

For mobile phone, tablet and wearable products, Samsung will replace the plastic used for holder trays with pulp molds, and bags wrapping accessories with eco-friendly materials. Samsung will also alter the phone charger design, swapping the glossy exterior with a matte finish and eliminating plastic protection films, reducing the use of plastics.

The plastic bags used to protect the surface of home appliances such as TVs, refrigerators, air conditioners and washing machines as well as other kitchen appliances will also be replaced with bags containing recycled materials and bioplastics, which are respectively made from plastic wastes and non-fossil fuel materials like starch or sugar cane.

Regarding paper, Samsung will only use fiber materials certified by global environmental organizations like the Forest Stewardship Council, Programme for the Endorsement of Forest Certification Scheme and the Sustainable Forestry Initiative for packaging and manuals by 2020.

“Samsung Electronics is stepping up in addressing society’s environmental issues such as resource depletion and plastic wastes,” said Gyeong-bin Jeon, head of Samsung’s Global Customer Satisfaction Center. “We are committed to recycling resources and minimizing pollution coming from our products. We will adopt more environmentally sustainable materials even if it means an increase in cost.”

Under the company’s circular economy policy, Samsung Electronics has set a mid-term implementation plan to only use paper packaging materials certified by forestry initiatives by next year. By 2030, Samsung aims to use 500 thousand tons of recycled plastics and collect 7.5 million tons of discarded products (both cumulative from 2009).

One may experience irrepressible excitement when opening up the packaging on a shiny new product. In fact, the anticipation felt during an unboxing experience is often just as strong as the emotions felt when one is using a product for the first time.

For the Galaxy S7 and Galaxy S7 edge, Samsung Electronics has taken care to create a memorable unboxing experience. Attention to detail was applied not just in crafting the smartphones – the packaging also got a full makeover.

The new design sees users open the box as if they were opening a book. This means the smartphone is only gradually revealed, delivering a novel, intriguing and somewhat nostalgic experience.

The box, which features a sleek black and blue color scheme, is designed with simplicity and elegance in mind, just like the device inside.

Senior Designer Hyun Jee Lim, creator of the new packaging design, shared the messages Samsung hopes to convey through the new packaging.

Q: What was your principle goal during the design process for the new packaging?

Hyun Jee Lim: Our aim was to create a package that best represents Samsung’s design identity, as well as the elegance the product embodies. Since we redefined the exclusive brand image of the Galaxy series through the Galaxy S7 and Galaxy S7 edge, we attempted to align the package with the same image.

In fact, we strove to apply the brand image throughout the entire experience, from the Galaxy Unpacked invitation and the event itself, to the key visual components of the device and the product packaging. It was all done as part of an effort to deliver a seamless experience to our consumers.

Q: What aspects you most consider when you design the packaging?

Hyun Jee Lim: To represent the completeness of the device, we selected black as the packaging’s main color. We then incorporated blue, Samsung’s heritage color, into the design to improve the overall quality of the package. To enhance the effect, and to boost usability, we also designed the box so that it could be opened like a book.

Q: The book concept is an interesting one. How did you come up with it?

Hyun Jee Lim: We wanted to create a truly unique and classic package—one with which our consumers can encounter an intriguing experience from the moment they first interact with our product. The book-like design not only does this, it also adds an emotional element.

Q: Considering the box contains such a high-tech product, why did you decide to include such seemingly analog packaging designs?

Hyun Jee Lim: The juxtaposition between digital and analog might seem unusual, considering we live in a highly digitized society. However, as much as we rely on cutting-edge technology to get through the day, we are also sentimental beings filled with a longing for the past.

The package satisfies this desire by conveying a sense of familiarity and aesthetic sensibility, even though it contains a high-tech device. The design also represents Samsung as a transformational business, one that is continuously evolving.

Q: What materials were used in the packaging and why did you choose them?

Hyun Jee Lim: The packaging is carefully crafted, with black paper embellished with textured micro-patterns. This sleek, modern design helps the brand experience become tangible in consumers’ hands.

Q: The inner packaging is also different to that used in previous Galaxy models. Why is that?

Hyun Jee Lim: We aspired to create the best possible design, right down to the very smallest of details. We wanted consumers to be able to fully perceive the efforts that went into the birth of the product as a whole.

Q: What value did you, as a designer, want to personally communicate to consumers through the package design?

Hyun Jee Lim: A product’s packaging conveys a very important first impression to the customer. I wanted not to just satisfy people’s expectations, I actually wanted to surpass them. I tried to add a touch of ardor and confidence. I was hoping to use the packaging to convey the essence of the Galaxy S series and Samsung’s unique design identity.

The latest Galaxy devices are now available in select markets. Experience the unboxing of the Galaxy S7 for yourself in the video below in advance.

Plugs with Pins and Protection from Dings

Semiconductor packaging involves enclosing integrated circuits (IC) in a form factor that can fit into a specific device. Since a semiconductor chip, or IC, is mounted on a circuit board or used in an electronic device, it needs to go through an electrical packaging process to be molded into the appropriate design and form.

If the IC were the human brain, its packaging would be the nervous system and skeletal structure.

In other words, semiconductor packaging serves a variety of purposes: ensuring the inter-terminal connection, supplying electricity, and providing heat resistance and protection for the IC. The packaging also ensures protection from external factors, including humidity, chemicals, impact and vibration.

Now, let’s take a look at how the packaging process works.

First, wafers are cut into individual chips with a diamond cutter. Faulty chips marked during the inking process are left behind while functional chips are placed on a lead frame or PCB (Printed Circuit Board), which are then attached with balls that provide an electrical connection.

The lead frame delivers electrical signals between the semiconductor chip and the board while offering structural support to protect the chip from external humidity or impact. Chips are connected to the lead frame with fine gold wires in a process called wire bonding.

After the chips are attached to the lead frames, they undergo the molding process, which gives them their exterior shells. At this stage, intense heat is applied to an epoxy molding compound (EMC) made of resin, which is liquefied and shaped into the desired form.

At last, the semiconductor chips resemble the ones we see inside our electronic devices.

The Last Stretch: Package Testing

Once the packaging process is complete, we have to determine if the package works properly. So, it’s time to move on to the last stage, the package test, in which our packaged semiconductor goes through the final quality assurance procedures.

The semiconductor chips are put in a device where they are tested under various conditions of voltage, electrical signals and temperature. In doing so, we can measure their electrical and functional characteristics as well as their performance to detect any defects.

We also collect and analyze the data accumulated during the test and give feedback to the teams overseeing the manufacturing and assembly processes to further improve the quality of our products.

Below is an example of the test procedures for DRAM (Dynamic Random Access Memory).

1. Assembly Out

A “lot card” is filled out with all the information related to the product, such as type, quantity, number of I/O (bits), process details and owner. The lot card follows the product from beginning to end, and is even kept for a period of time after the product’s release.

2. DC Test & Loading/ Burn-in (& Unloading)

Completed chips go through a DC test where defective units are sorted and removed, while potentially faulty chips are identified in high-stress environments, such as high voltage, high temperature and electric signals, during the burn-in process. The selected functional chips will go through another round of subsequent tests to ensure the level of reliability required for our products is met.

3. MBT (Monitoring Burn-in Tester)

The monitoring burn-in tester (MBT) process is an advanced version of the burn-in test previously mentioned, with the added advantages of a shorter test time and more rigorous testing criteria.

4. Post Burn-in Test

The products that have made it this far are now subject to the post burn-in test, where we test their electrical characteristics and functions at room temperature and below.

5. Final Test

We’re almost there! The final test examines the products’ electrical characteristics and functions at high temperatures.

After going through the strenuous process of the package test, the semiconductor chip finally gets its own identification; the name of the IC, date and origin of manufacture, product characteristics and serial number are printed on the product surfaces.

As we ship the completed products to our customers, we go the extra mile to ensure quality assurance by only sending the products that pass our pre-shipment testing.

Well, there you have it. If you look around, you will realize that semiconductors are everywhere– not just inside the IT devices you’re holding, but also in almost every kind of electronic device imaginable. Each and every one of these semiconductor chips goes through the extensive, complex and delicate process you’ve just learned about.

Amazing, huh? We think so, too.

In Korean, http://samsungsemiconstory.com/225.