Samsung Electronics, a global leader in technology, announced today that 43 of its new product and service innovations received CES^® 2022 Innovation Awards honors, including four Best of Innovations accolades, from the Consumer Technology Association (CTA). The annual awards program spotlights standout design and engineering across multiple consumer technology product categories.

Samsung’s presence across multiple categories exemplifies its deep heritage developing cross-category innovations that propel the industry and society forward. This year, CTA recognized Samsung Honorees in a range of categories, including Computer Peripherals & Accessories, Computer Hardware & Components, Digital Imaging/Photography, Embedded Technologies, Gaming, Headphones & Personal Audio, Health & Wellness, Home Appliances, Home AV Components & Accessories, Mobile Devices and Accessories, Smart Home, Software and Mobile Apps, Sustainability, Wearable Technologies and Video Displays.

The CES Innovation Awards are sponsored by the CTA, the owner and organizer of CES – the world’s largest and most influential technology event. CES 2022 returns to Las Vegas next year, after a digital-only version of the event in 2021. Jong-Hee (JH) Han, President and Head of Visual Display Business at Samsung Electronics, will deliver the pre-show keynote address on Tuesday, Jan. 4 at 6:30 PM PST in the Venetian’s Palazzo Ballroom in Las Vegas, NV.

Some of Samsung’s award-winning products that earned accolades this year include the following:

Best of Innovation Award winner:

Samsung Galaxy Z Flip3 Bespoke Edition – The Galaxy Z Flip3 Bespoke Edition empowers people to express themselves by creating a device that’s truly their own. Choose the Galaxy Z Flip3’s frame options of Black or Silver, and front and back colors of Blue, Yellow, Pink, White or Black to build a phone to your style. With over 49 possible styles, Samsung brings the ultimate in customization. And it can go anywhere thanks to groundbreaking durability improvements, like IPX8 water resistance — the highest water resistance standard on any foldable phone — and its new Armor Aluminum frame, the strongest aluminum ever used on a Galaxy smartphone.

The Galaxy Z Flip3 5G also secured honoree wins in the Digital Imaging/Photography and Mobile Devices & Accessories categories.

Innovation Honorees:

Samsung Galaxy Z Fold3 5G – The Galaxy Z Fold3 brings Samsung’s leading smartphone camera technology to the groundbreaking foldable form factor — gaining recognition in both the Digital Imaging/Photography and Mobile Devices & Accessories categories. The Galaxy Z Fold3 continues Samsung’s pioneering legacy in foldable smartphones. It brings together innovations like IPX8 water resistance, and the first ever Under Display Camera and S Pen support on a foldable, all on a 7.6” screen that folds to fit in your pocket. With its impeccable craftsmanship and groundbreaking form factor, the Z Fold3 creates truly unique experiences — the ideal combination of productivity, performance and portability.

Samsung Galaxy Watch4 – Recognized in the categories of Health & Fitness and Wearable Technologies, the Galaxy Watch4 series is Samsung’s most innovative smartwatches yet, with a reimagined OS and UX, sophisticated design, and cutting-edge fitness features. The new BioActive Sensor — Samsung’s most advanced to date — empowers you to calculate your blood oxygen levels,¹ or track your heart rate. In fifteen seconds, the new Body Composition tool² offers insights to key measurements like skeletal muscle and body fat percentage. Plus, an all-new OS and UX make Watch4 act provide the most intuitive experience yet. The Watch4 series marks a new era of smartwatch innovation.

Samsung Galaxy A Series – Also winning in Mobile Devices & Accessories category is the Galaxy A series, a family of five smartphone devices packed with impressive features at a price that works for everyone. You can take stunning shots with powerful multi-camera systems, see immersive content on vivid displays and enjoy peace of mind with long-lasting, fast-charging batteries. Galaxy A series devices are versatile and accessible with leading features, from the A52 5G’s 120Hz refresh rate and IP67 dust and water resistance, to Samsung’s first-ever 5G device under $300: the A32 5G. No matter what you’re looking for, the Galaxy A series makes some of the most popular Galaxy innovations available to all.

Samsung Galaxy Buds2 – In the category of Headphones & Personal Audio, Galaxy Buds2 are recognized for continuing Samsung’s audio legacy with an innovative, ultra-comfortable fit and the essential features consumers love most — at the most accessible price in our Buds line-up. With an updated design that’s our smallest and lightest yet, Galaxy Buds2 provide all-day comfort. Plus, they deliver stunning sound and immersive audio with Active Noise Cancellation, dynamic two-way speakers and an enhanced Ambient sound mode. Buds2 deliver premium but accessible earbuds — bringing you an advanced sound experience wherever you are, while still looking stylish.

Samsung Galaxy Book Pro 360 – Samsung’s Galaxy Book Pro 360 reimagines the PC to meet the needs of mobile-first users, scoring it a win in the category of Computer Hardware & Components. Embedded with the mobile DNA of a Galaxy smartphone, it was designed to make your day-to-day experience more intuitive than ever. Enjoy powerful performance and smartphone-like connectivity — because the Book Pro 360 is our first 5G PC offered in the U.S. The Book Pro 360 also comes with an upgraded S Pen, so you can use your PC as a creative canvas. With a Super AMOLED display and fast charging all-day battery, this PC will help you conquer your day, at home and on-the-go.

Samsung SmartTag+ – Another Mobile Devices & Accessories winner, SmartTag+ helps you easily keep track of the important things in your life. Equipped with ultra-wideband (UWB) technology, SmartTag+ pinpoints the exact location of your misplaced items with best-in-class accuracy and range. Simply attach the Galaxy SmartTag+ to keys, purses, or even a pet’s collar, and you’ll never lose them again. Whether the item is in your room or across the neighborhood, just use your compatible Galaxy smartphone’s camera and AR arrows in the SmartThings Find service will point you to exactly where you left it. Turn anything into a trackable item with SmartTag+.

Samsung 30” Smart Induction Built-In Cooktop – Samsung’s Smart Induction Cooktop is recognized in the Home Appliance category. The Cooktop is first in the industry to be recognized for its ability to reduce energy use and lower emissions as you cook — all while maintaining outstanding performance. It’s received a 2021-2022 ENERGY STAR^® Emerging Technology Award in the Residential Induction Cooking Tops category. The Cooktop features four burners and innovative cooking modes, which offers precise temperature control, much like a gas burner.

Samsung Top Load Washer (WA7700A) – Samsung’s Top Load Washer with Auto Dispense also wins in the Home Appliance category. Samsung’s bringing its popular Auto Dispense feature to the top load category, making laundry more intuitive with premium features and design. The Washer includes other essential features to deliver an efficient and powerful clean, from a built-in water faucet to pretreat tough stains, to its Super Speed wash cycle that finishes a full load in as little as 28 minutes.

Samsung 512GB DDR5 RDIMM – The industry’s first 512GB DDR5 registered dual in-line memory module (RDIMM) for next-generation consumer electronics applications spanning artificial intelligence in high-performance computing, cloud and data center servers. The 512GB module features 40 integrated DRAM packages, each consisting of eight 16Gb DDR5 dies. The large-capacity, high-speed chips embrace a highly advanced low-voltage process, and use through-silicon via (TSV) technology to fully overcome substantial performance degradation in wire bonding connectivity. It is recognized in the Computer Hardware & Components category.

Samsung U.2 ZNS NVMe SSD (PM1731a 2/4TB) – The PM1731a is a state-of-the-art Solid State Drive (SSD) for enterprise and large data centers that supports long-awaited Zoned Namespace (ZNS) technology for the first time in the industry, earning another win in the category of Computer Hardware & Components. Extending the life of an SSD by three to four times compared to existing SSDs, and substantially increasing user storage space, the PM1731a will contribute greatly to the efficiency of large server/storage systems as the use of big data and AI in consumer electronics’ data applications continues to explode worldwide.

Samsung PCIe Gen5 NVMe SSD PM1743 (2/4/8/16TB) – Another winner in the category of Computer Hardware & Components, PM1743 is the industry’s fastest, largest capacity and most reliable U.2 SSD. Based on the PCIe Gen5 interface, it’s aimed at supporting the enterprise-server requirements of multicore processing systems to access, manipulate and save data in the widest range of consumer-facing enterprise environments with incredible efficiency.

Samsung ISOCELL HP1 – The ISOCELL HP1 scores a win in the category of Embedded Technologies, as the industry’s first 200MP 0.64μm mobile image sensor. The HP1 provides 16,384 x 12,288 effective pixels that match a 1/1.22” optical format. With a 4×4 pixel-binning technology, the sensor can merge 16 pixels into one large 2.56μm-sized pixel to produce bright 12.5MP images with less noise in low-light environments. The sensor can also capture crystal-clear videos at ultra-high definition of up to 8K 30fps.

¹ The Blood Oxygen (SpO2) feature is not intended for use in the diagnosis of disease or other conditions, or in the cure, mitigation, treatment or prevention of disease. It is currently not available in Algeria, Angola, Canada, France, Iran, Libya, Japan, South Africa and Thailand.

² Intended for general wellness and fitness purposes only. Not intended for use in detection, diagnosis or treatment of any medical condition or disease. The measurements are for the user’s personal reference only. Do not measure your body composition if you have an implanted pacemaker or other implanted medical devices. Do not measure your body composition if you are pregnant. Measurement results may not be accurate if you are under 20 years old. Availability of this feature may vary by country or region.

“AMD has listened to the needs of its customers in developing the 2^nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products,” said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. “With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter.”

“We’re excited and thankful to have partners like Samsung supporting the launch of our 2^nd Gen AMD EPYC processors,” said Scott Aylor, corporate vice president and general manager, Datacenter Solutions Group, AMD. “With twice the cores, breakthrough performance and embedded security features, all optimized by leadership architecture, customers can now transform their datacenter operations at the pace of their business growth.”

The AMD EPYC 7002 Generation Processors are expected to deliver up to 2X the performance per socket³ and up to 4X peak FLOPS per socket⁴ over the previous generation.  The new processors deliver a consistent, comprehensive set of I/O, memory and security features across 8-64 ‘Zen 2’ cores.

Samsung’s PCIe Gen 4-enabled PM1733 SSD will have double the throughput capabilities of current Gen 3 SSDs, giving it the highest performance of any SSD on the market today. It reads sequentially at 8.0GB/s and randomly at 1500K IOPS, while offering capacities up to 30.72TB for U.2 (Gen 4 x4) configurations and 15.36TB for the HHHL (Gen 4 x8) form factor. The drive is produced with Gen5 512Gb TLC V-NAND.

The PM1733 drive will be available industry-wide this quarter in both U.2 and HHHL variants, and will be backward compatible with PCIe Gen 3 architectures, providing exceptional flexibility for existing and future server applications.  The drive also features Dual Port capabilities to support storage as well as server applications.

In addition to Samsung’s PM1733 SSD, Samsung has provided its full lineup of RDIMM and LRDIMM DRAM products for AMD EPYC 7002 Series Processors. Using component architectures of 8Gb and 16Gb DDR4, Samsung is able to offer DIMM capacities ranging from 8GB to 256GB. With Samsung high density DIMMs, users can tap into as much as 4TB of memory per CPU.

¹ Registered dual in-line memory module

² Load-reduced dual in-line memory module

³ Projections as of July 3, 2019 for AMD EPYC processors using computer modeling of preproduction parts and SPECrate^®2017_int_base internal testing results. Results may vary with production silicon testing. EPYC 7601 results as of June 2019 http://spec.org/cpu2017/results/res2019q2/cpu2017-20190411-11817.pdf. SPEC^®, SPECrate^® and SPEC CPU^® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.

⁴ A “Zen2” based processor has a theoretical peak of ~4X Floating Point Per Socket (FLOPS) more than a “Zen1” based processor

Current technology trends, including the ever-growing mobile traffic, high-quality content, data analyses and IoT platforms all add to the workload of today’s data centers and servers. As such, faster and more reliable memory solutions with heavy-duty capacities are a necessity.

Chip stacking for larger capacities does have clear benefits. However, with conventional packaging techniques that use wire bonding, chip stacks are prone to lag in speed—speed that is especially essential for enterprise servers that handle massive amounts of data. In turn, dies can only be stacked so high, further limiting the chip package capacity.

Through silicon via (TSV) is an advanced chip packaging technology that vertically connects DRAM chip dies using electrodes that penetrate the microns-thick dies through microscopic holes.
The technology marks a breakthrough from traditional wire bonding as it allows for all of the dies in a chip package to maintain their optimum performance which makes higher die stacks possible. A smaller footprint of the physical chip package is an additional bonus.

Samsung announced its TSV DDR4 DRAM in 128GB RDIMM modules for the first time in the industry, which will bring new heights to memory solutions for servers and data centers.

The three most important benefits of this new technology include:

1. Largest Capacity: Samsung’s 128GB TSV DDR4 module doubles the largest capacity of previous DRAM for enterprise servers while continuing to meet the requirements for high speed and reliability.
2. Faster Speeds: By combining TSV technology with 8Gb DRAM die, Samsung’s new TSV DDR4 RDIMM is able to pack in 128GB, meeting the needs of today’s enterprise servers with speeds of up to 2,667 megabits per second (Mbps) and 3,200Mbps. This suggests the possibility of accelerated adoption of TSV in the market, with opportunities for expanded applications in high bandwidth memory (HBM) and consumer products in the future.
3. Better Efficiency: The design of the 128GB TSV DDR4 module is also incredibly innovative. Traditional wire-bond dies are packaged together with a data buffer chip, which regulate the input/output information passing through each DRAM. Samsung’s new 128GB TSV DDR4 module embeds data buffer functions within the master chip in each chip package, producing better performance in a more energy-efficient product. Being manufactured with Samsung’s state-of-the-art 20-nanometer process technology adds to improved performance and energy efficiency, as well. As a result, the 128GB TSV DDR4 reduces the power consumption by half when compared to the previous highest capacity DRAM modules (64GB LRDIMM).

Read more:

Samsung Starts Mass Producing Industry’s First 128-Gigabyte DDR4 Modules for Enterprise Servers

Samsung Electronics announced that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers.

Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung’s new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.

“We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment,” said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. “We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience.”

The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20-nanometer (nm)-based 8-gigabit (Gb) chips assembled with cutting-edge TSV packaging technology.

Conventional chip packages interconnect die stacks using wire bonding, whereas in TSV packages, the chip dies are ground down to a few dozen micrometers, pierced with hundreds of fine holes and vertically connected by electrodes passing through the holes, allowing for a significant boost in signal transmission. In addition to capitalizing on the industry’s highest capacity and TSV’s advanced circuitry, Samsung’s 128GB TSV DDR4 module has a special design through which the master chip of each 4GB package embeds the data buffer function to optimize module performance and power consumption.

As a result, Samsung’s advanced 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400 megabits per second (Mbps), achieving nearly twice the performance, while cutting power usage by 50 percent, compared to using the previous highest capacity DRAM modules ─ 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding.

Samsung is responding to growing demand for ultra-high capacity DRAM by accelerating production of TSV technology in the market and quickly ramping up 20nm 8Gb DRAM chips to improve manufacturing productivity. In solidifying its technology leadership and expanding the market for premium memory solutions, the company plans to provide a complete lineup of its new high-performance TSV DRAM modules within the next several weeks including 128GB load reduced DIMMs (LRDIMMs).

In addition, Samsung will continue to maintain its technology leadership by introducing TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.

To learn more about TSV, read more here.