The centerpiece of Samsung’s showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform. Samsung’s HBM4 is expected to help accelerate the development of future AI applications, delivering consistent processing speeds of 11.7 gigabits-per-second (Gbps), which exceeds the industry standard of 8Gbps, and can be enhanced to 13Gbps.

By leveraging the most advanced sixth-generation 10-nanometer (nm)-class DRAM process (1c), Samsung has achieved stable yields and industry-leading performance. The company’s next-generation HBM4E, delivering 16Gbps per pin and 4.0 terabytes-per-second (TB/s) bandwidth, will be on display as well for the first time at GTC 2026.

Visitors will also be able to catch a glimpse of Samsung’s hybrid copper bonding (HCB) technology, a new method that will enable next-generation HBM to achieve 16 or more layers while reducing heat resistance by more than 20 percent, compared to thermal compression bonding (TCB).

An Alliance Taking the AI Era to the Next Level

The strong collaboration between Samsung and NVIDIA will be highlighted in the booth’s separate ‘NVIDIA Gallery,’ specifically featuring a broad lineup of Samsung’s cutting-edge technologies, such as HBM4, SOCAMM2 and PM1763 SSD that are designed for NVIDIA AI infrastructure.

Addressing the need for maximum efficiency and scalability in AI systems, Samsung’s SOCAMM2 based on low-power DRAM is an optimum server memory module that offers high bandwidth and flexible system integration for next-generation AI infrastructure. Samsung’s SOCAMM2 is currently in mass production, an industry-first to reach that milestone.

Designed for next-generation AI storage solutions, Samsung’s PM1763 SSD is based on the latest PCIe 6.0 interface offering fast data transfers and high capacities. The industry-leading PM1763 performance will be demonstrated on servers working with the NVIDIA SCADA programming model.

As part of the new NVIDIA BlueField-4 STX reference architecture for accelerated storage infrastructure in NVIDIA’s Vera Rubin platform, Samsung’s PM1753 SSD will show how it helps to enhance energy efficiency and system performance for inference workloads.

Memory Architecture To Scale Intelligent Manufacturing

Samsung will showcase its collaboration with NVIDIA on AI Factory development at GTC 2026, including plans to implement NVIDIA accelerated computing to scale Samsung’s AI Factory and fast-track digital twin manufacturing that leverage NVIDIA Omniverse libraries. This collaboration powers one of the world’s most comprehensive chip manufacturing infrastructures ― spanning memory, logic, foundry and advanced packaging.

Separately, Yong Ho Song, Executive Vice President and Head of AI Center at Samsung Electronics, will illustrate the two companies’ strategic collaboration in further detail through his speaker session on March 17, 2026. Titled ‘Transforming Semiconductor Manufacturing with Agentic AI from Design and Engineering to Production,’ the session will elaborate on the company’s AI Factory and share innovative end-to-end real-life use cases where AI and digital twins are reshaping semiconductor manufacturing with breakthroughs in electronic design automation (EDA) and computational lithography to designing and operating advanced manufacturing facilities powered by NVIDIA.

Efficient Memory for Local Intelligence

Samsung’s memory solutions also offer maximized efficiency for local AI workloads on personal devices. During GTC 2026, Samsung will showcase tailored and efficient solutions for personal AI supercomputers, including the Samsung PM9E3 and PM9E1 NAND for NVIDIA DGX Spark.

Additionally, Samsung will display DRAM solutions, LPDDR5X and LPDDR6, that are designed for seamless integration into premium smartphones, tablets and wearable devices, offering faster data throughput and lower latency. LPDDR5X delivers speeds of up to 25Gbps per pin, while cutting power consumption by up to 15 percent, enabling ultra‑responsive mobile experiences, high‑resolution gaming and AI‑enhanced applications without sacrificing battery life.

Building on that foundation, LPDDR6 pushes bandwidth further to a scalable 30‑35 Gbps per pin and introduces advanced power‑management features such as adaptive voltage scaling and dynamic refresh control, which together provide the performance needed for next‑generation edge‑AI workloads.

Samsung’s AI Factory will integrate every aspect of semiconductor manufacturing, from design and process to equipment, operations and quality control, into a single intelligent network, where AI continuously analyzes, predicts and optimizes production environments in real time.

The Samsung AI Factory goes beyond traditional automation, serving as an intelligent manufacturing platform that connects and interprets the immense data generated across chip design, production and equipment operations.

From 25+ Year Collaboration to a Stronger AI Chip Alliance

Samsung and NVIDIA celebrate a collaboration that spans more than 25 years, beginning with Samsung’s DRAM powering NVIDIA’s early graphics cards and extending through foundry partnership.

In addition to their ongoing collaborations, Samsung and NVIDIA are also working together on HBM4. With incredibly high bandwidth and energy efficiency, Samsung’s advanced HBM solutions are expected to help accelerate the development of future AI applications and form a critical foundation for manufacturing infrastructure driven by these technologies.

Built with the company’s 6th-generation 10-nanometer (nm)-class DRAM and a 4nm logic base die, Samsung HBM4’s processing speeds can reach 11 gigabits-per-second (Gbps), far exceeding the JEDEC standard of 8Gbps.

Samsung will also continue to deliver next-generation memory solutions, including HBM, GDDR, and SOCAMM, as well as foundry services, driving innovation and scalability across the global AI value chain.

Accelerating the Transition to Intelligence-Driven Manufacturing

Over the next several years, Samsung plans to implement NVIDIA accelerated computing to scale its AI Factory and accelerate digital twin manufacturing powered by NVIDIA Omniverse libraries across one of the world’s most comprehensive chip manufacturing infrastructures ― spanning memory, logic, foundry and advanced packaging.

Leveraging NVIDIA cuLitho and CUDA-X libraries for its optical proximity correction (OPC) process, Samsung has achieved a 20x gain in computational lithography performance. As a critical step in accurate wafer patterning, the enhanced OPC enables AI to predict and correct circuit pattern variations with far greater speed and precision, reducing development cycles.

For electronic design automation (EDA), the companies are collaborating with EDA partners to develop next-generation GPU-accelerated EDA tools and design technologies.

Using NVIDIA Omniverse libraries, Samsung is building digital twins that can visualize entire fab operations virtually. These virtual environments identify anomalies, perform predictive maintenance and optimize production before changes are applied in the physical world.

Samsung plans to extend its AI Factory infrastructure to its global manufacturing hubs, including Taylor, U.S., bringing greater intelligence and agility to its worldwide semiconductor operations.

Building Out the AI Ecosystem Across Generative AI and Robotics

Samsung has been developing proprietary AI models that power more than 400 million of its devices. These models are also integrated into the company’s internal manufacturing systems, driving intelligence and innovation across its production processes.

Built on NVIDIA accelerated computing and the Megatron framework, Samsung’s AI models demonstrate advanced reasoning capabilities that deliver exceptional performance in real-time translation, multilingual conversations and intelligent summarization.

In intelligent robotics, Samsung is leveraging the NVIDIA RTX PRO 6000 Blackwell Server Edition platform to advance manufacturing automation and humanoid robotics, accelerating adoption and enhancing autonomy in next-generation physical AI applications.

Samsung is also working with a range of NVIDIA AI platforms to connect virtual simulation and real-world robot data, enabling robots to understand their surroundings, make decisions and operate intelligently in real-life settings. Using the NVIDIA Jetson Thor robotic platform, Samsung is accelerating real-time AI reasoning, task execution and safety controls in intelligent robots.

Samsung plans to extend the use of these technologies into its AI Factory infrastructure and across its broader business areas, building out an intelligent manufacturing ecosystem that brings together AI and robotics.

Connecting Consumers and Industries Through AI

Samsung is also working with NVIDIA, Korean telecom operators, academia and research institutions to foster collaboration on AI-RAN development.

AI-RAN is a key next-generation communication technology that integrates AI computing power into mobile network capabilities. It allows agentic and physical AI ― such as robots, drones and industrial automation equipment ― to intelligently operate, sense, process data and perform inferences in real-time at the network edge, closer to the points where physical AI connect to the network. This AI-powered mobile network will play a crucial role as a neural network essential in widespread adoption of physical AI.

This new initiative builds upon Samsung and NVIDIA’s collaboration last year, which successfully completed the proof-of-concept of AI-RAN through combining Samsung’s software-based network and NVIDIA GPU. The companies will continue to strengthen their ongoing collaboration on AI-RAN.