Samsung Electronics, the world leader in advanced memory technology, and NAVER Corporation, a global internet company with top-notch AI technology, today announced a wide-reaching collaboration to develop semiconductor solutions tailored for hyperscale artificial intelligence (AI) models. Leveraging Samsung’s next-generation memory technologies like computational storage, processing-in-memory (PIM) and processing-near-memory (PNM), as well as Compute Express Link (CXL), the companies intend to pool their hardware and software resources to dramatically accelerate the handling of massive AI workloads.

Recent advances in hyperscale AI have led to an exponential growth in data volumes that need to be processed. However, the performance and efficiency limitations of current computing systems pose significant challenges in meeting these heavy computational requirements, fueling the need for new AI-optimized semiconductor solutions.

Developing such solutions requires an extensive convergence of semiconductor and AI disciplines. Samsung is combining its semiconductor design and manufacturing expertise with NAVER’s experience in the development and verification of AI algorithms and AI-driven services, to create solutions that take the performance and power efficiency of large-scale AI to a new level.

For years, Samsung has been introducing memory and storage that support high-speed data processing in AI applications, from computational storage (SmartSSD) and PIM-enabled high bandwidth memory (HBM-PIM) to next-generation memory supporting the Compute Express Link (CXL) interface. Samsung will now join with NAVER to optimize these memory technologies in advancing large-scale AI systems.

NAVER will continue to refine HyperCLOVA, a hyperscale language model with over 200 billion parameters, while improving its compression algorithms to create a more simplified model that significantly increases computation efficiency.

“Through our collaboration with NAVER, we will develop cutting-edge semiconductor solutions to solve the memory bottleneck in large-scale AI systems,” said Jinman Han, Executive Vice President of Memory Global Sales & Marketing at Samsung Electronics. “With tailored solutions that reflect the most pressing needs of AI service providers and users, we are committed to broadening our market-leading memory lineup including computational storage, PIM and more, to fully accommodate the ever-increasing scale of data.”

“Combining our acquired knowledge and know-how from HyperCLOVA with Samsung’s semiconductor manufacturing prowess, we believe we can create an entirely new class of solutions that can better tackle the challenges of today’s AI technologies,” said Suk Geun Chung, Head of NAVER CLOVA CIC. “We look forward to broadening our AI capabilities and bolstering our edge in AI competitiveness through this strategic partnership.”

The achievement was based on Samsung’s restored financial performance, which is now near pre-pandemic levels, and higher demand for memory due to an increase in data usage. In 2021, Samsung scored a brand value growth of 20% compared to 2020 and this year, continues the double-digit growth. Samsung first entered the top 10 list in 2012, placing in ninth position, and has managed to rise in the chart each year, reaching sixth place in 2017 and fifth place in 2020.

“Samsung Electronics was able to record two consecutive years of double-digit growth in brand value, all thanks to the support from our global customers,” said YH Lee, Executive Vice President and Chief Marketing Officer of Samsung Electronics. “In return, the entire company will work together as a team to provide a better and more satisfying customer experience.”

Various Factors Evaluated by Interbrand To Build the Samsung Brand Value

At the end of 2021, Samsung Electronics merged its SET Division and created the Device eXperience Division to increase synergy among its products and provide a next level of experience to customers. Furthermore, Samsung also launched the Customer eXperience-Multi Device Experience Center to strengthen its multi-device connection experience.

Along with these measures, Samsung has integrated the SmartThings across its product categories, creating an inclusive ecosystem and a multi-device experience. SmartThings also empowers consumers to get the most out of their Samsung devices, as well as third-party products they may already own.

In addition, Samsung’s Future Generation Lab has been created to foster authentic conversations around the activities of the next generation. The insights from the lab have been applied to the products and marketing activities.

As well as innovative products based on consumer experiences, the development of advanced technologies such as artificial intelligence (AI), 5G, automotive and robotics through consistent investment also played a role in Samsung’s growth.

Samsung’s Recognized Efforts in Each Product Division for a Better Customer Experience

Mobile

• Camera innovation of Galaxy S22 series based on customers’ insights, and Nightography campaign rollout Cementing leadership in the foldable mobile phone category
• Partnership with Google and Microsoft to strengthen users’ connected experience
• Respecting the value of user security and privacy through Samsung Knox

Network

• Pioneering network innovation path in virtualization and openness with large-scale commercial experiences
• Driving 5G industry with its market-leading 5G portfolio from RAN and Core to automation tools
• Realizing the ESG commitment through intelligent network solutions for energy efficiency

Visual Display

• Continuing innovation of premium TVs, including Micro LED, the Neo QLED 8K/4K
• Strengthening its product portfolio based on customers’ lifestyle, such as The Frame, The Freestyle
• Providing new gaming experiences to consumers, including the Samsung Gaming Hub and the Odyssey Ark

Home Appliances

• Expanding Bespoke product categories beyond kitchen to entire home including clothing care, floor care and air care
• Delivering sustainability values through its products (achieving high level of energy saving rate for major products, guaranteed warranties for digital inverter compressor, reduced microplastic emission from washing machines in collaboration with Patagonia)
• Creating excitement among Bespoke fans through participation-focused online and offline campaigns

Semiconductor

• Investing in next-generation technologies and production capabilities to ensure stable supplies for cutting-edge applications (constructing new $17B manufacturing line in Texas, KRW 20-trillion R&D complex in Giheung)
• Delivering industry-leading semiconductor innovations that enhance product performance and energy efficiency (industry’s first 3nm GAA mass production)
• Developing innovative memory solutions to address the explosive growth of data-intensive tasks in areas such as AI and ML (CXL memory, HBM-PIM, second-generation SmartSSD), and expanding strategic partnerships to tackle new industry challenges
• Pushing boundaries of logic solutions that can offer enhanced user experiences and new opportunities (5G Exynos Modem, Exynos 2200, 200MP ISOCELL HP3)

Interbrand’s Best Global Brands are listed according to the evaluation of each brand value, which is a result of comprehensive analysis of the financial performance of the company, the influence of the brand on customer purchases and brand competitiveness.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has successfully developed a second generation of its pioneering SmartSSD.

The new proprietary computational storage incorporates data processing functionality within a high-performance SSD. Unlike existing SSDs, Samsung’s SmartSSD can process data directly, thereby minimizing data transfers between the CPU, GPU and RAM. This technology can avoid the bottlenecks that often occur when moving data between storage devices and CPUs, resulting in markedly improved system performance and much higher energy efficiency.

The SmartSSD is playing an increasingly important role, especially with the growth of next-generation technologies such as AI, machine learning and 5G/6G, which require large amounts of data processing.

Leveraging software and intellectual property (IP) developed by customers, along with in-built Arm cores, Samsung’s second-generation SmartSSD enables much more efficient data processing. Compared to conventional data center solid-state drives, processing time for scan-heavy database queries can be slashed by over 50%, energy consumption by up to 70% and CPU utilization by up to 97%.

Since its development in 2020 through the joint efforts of Samsung and AMD, the first-generation SmartSSD is being supplied to global IT companies including video communications platform providers. The first-generation SmartSSD was recognized as an Innovation Awards Honoree at CES 2021 for its outstanding performance and energy efficiency.

“Commercialization of the first-generation SmartSSD, in collaboration with AMD, established that the computational storage market has great potential,” said Jin-Hyeok Choi, Executive Vice President and Head of Memory Solution Product & Development at Samsung Electronics. “With the upgraded processing functionality of the second-generation SmartSSD, Samsung will be able to easily address increasing customer needs in the database and video transcoding sectors, as we expand the boundaries of the next-generation storage market.”

“Powered by Xilinx Versal Adaptive SoCs from AMD, second-generation Samsung SmartSSDs enable improved CPU efficiency and greatly reduced energy consumption by efficiently integrating the computing and storage functions in data centers,” said Sina Soltani, Corporate Vice President of Sales, AECG, Data Center and Communication Group at AMD. “As data-intensive applications continue to grow, second-generation Samsung SmartSSDs will deliver the superior performance and efficiency required for this expanding market.”

Samsung Electronics is leading efforts to standardize SmartSSD technology through close collaboration with the Storage Networking Industry Association (SNIA) and with NVM Express, while seeking to expand the boundaries of SmartSSD devices through technological validation for a wide variety of applications.

Unveiled at its annual Samsung Tech Day include:

• 7nm EUV process node from Samsung’s Foundry Business, providing significant strides forward in power, performance and area.
• SmartSSD, a field programmable gate array (FPGA) SSD, that will offer accelerated data processing and the ability to bypass server CPU limits.
• QLC-SSD for enterprise and datacenters that offer 33-percent more storage per cell than TLC-SSD, consolidating of storage footprints and improving total cost of ownership (TCO).
• 256-gigabyte (GB) 3DS (3-dimensional stacking) RDIMM (registered dual in-line memory module), based on 10nm-class 16-gigabit (Gb) DDR4 DRAM that will double current maximum capacity to deliver higher performance and lower power consumption.

“Samsung’s technology leadership and product breadth are unparalleled,” said JS Choi, President, Samsung Semiconductor, Inc. “Bringing 7nm EUV into production is an incredible achievement. Also, the announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries. Together, these additions to Samsung’s comprehensive technology ecosystem will power the next generation of datacenters, high-performance computing (HPC), enterprise, artificial intelligence (AI) and emerging applications.”

Advanced Foundry Technology

Initial wafer production of Samsung’s 7nm LPP (Low Power Plus) EUV process node represents a major milestone in semiconductor fabrication. The 7LPP EUV process technology provides great advances, including a respective maximum of 40-percent area reduction, 50-percent dynamic power reduction and 20-percent performance increase over 10nm processes. The 7LPP process represents a clear demonstration of the foundry business’ technology roadmap evolution, providing Samsung’s customers a direct path forward to 3nm.

Powering Server-less Computing

Samsung enables the most advanced providers of server-less computing through products including the new SmartSSD, quad-level cell (QLC)-SSD, 256GB 3DS RDIMM as well as High Bandwidth Memory (HBM) 2 Aquabolt. By accelerating data processing, bypassing server CPU limits and reducing power demands, these products will enable datacenter operators to continue to scale at faster speeds while containing costs.

Samsung’s industry-leading flash memory products for future datacenters will also include Key Value (KV)-SSD and Z-SSD. KV-SSD eliminates block storage inefficiency, reducing latency and allowing datacenter performance to scale evenly when CPU architectures max out. The company’s next-generation Z-SSD will be the fastest flash memory ever introduced, with dual port high availability, ultra-low latency and a U.2 form factor, designed to meet the emerging needs of enterprise clients. Z-SSD will also feature a PCIe Gen 4 interface with a blazing-fast 12-gigabytes-per-second (GB/s) sequential read, which is 20 times faster than today’s SATA SSD drives.

Accelerating Application Learning

A range of revolutionary Samsung solutions will enable the development of upcoming machine learning and AI technologies. The Tech Day AI display highlighted astounding data transfer speeds of 16Gb GDDR6 (64GB/s), ultra-low latency of Z-SSD and industry-leading performance of Aquabolt, which is the highest of any DRAM-based memory solution currently in the market. Together, these solutions help Samsung’s enterprise and datacenter clients open new doors to application learning and create the next wave of AI advancements.

Streamlining Data Flow

Samsung’s new solutions will enable not just faster speeds and higher performance but also improved efficiency for its enterprise clients. Enterprise products on display at Tech Day included D1Y 8Gb DDR4 Server DRAM, which incorporates the most advanced DRAM process, resulting in lower power usage. Samsung’s 256GB 3DS RDIMM also helps to improve enterprise performance and enables memory-intensive servers capable up to 16-terabytes (TB).

Additionally, Samsung’s dual-port x4 PCIe Gen 4 32TB SSD offers 10GB/s performance. Samsung’s 1Tb QLC-SSD presents a cutting-edge storage option for enterprise clients with competitive efficiency when compared to hard disk drives (HDD), while KV-SSD allows server performance to scale even as CPU architectures max out, also providing a competitive TCO, write amplification factor (WAF) improvement and scalability.

Breaking Performance Barriers

With their leading-edge specs, Samsung’s QLC-SSD, Z-SSD and 8GB Aquabolt help high-performance computing clients blast through performance barriers and reach new heights. The 8GB Aquabolt provides the fastest data transmission speed and highest performance of any DRAM-based memory solution on the market today at 307GB/s per HBM cube. QLC-SSD and Z-SSD, both powerful on their own, are also offered in a tiered storage solution that results in a 53-percent increase in overall system performance.

Enabling Future Innovation

Emerging tech requires the most innovative and flexible components. Samsung’s SmartSSD will increase speed and efficiency, and lower operating costs by pushing intelligence to where data lives.  Movement of data for processing has traditionally caused increased latency and energy consumption while reducing efficiency. Samsung’s new SmartSSDs will overcome these issues by incorporating an FPGA accelerator into the SSD unit. This allows for faster data processing through bypassing server CPU limits. As a result, SmartSSDs will have higher processing performance, improved time-to-insight, more virtual machines (VM), scalable performance, better de-duplication and compression, lower power usage and fewer CPUs per system.

Unparalleled Product Ecosystem

Samsung’s comprehensive product portfolio with state-of-the-art solutions set new standards for data processing speed, capacity, bandwidth and energy conservation. By leveraging such solutions, data centers, enterprise companies, hyper-scalers and emerging tech platforms are able to configure product solutions based on their requirements and develop exciting new tech offerings such as 5G, AI, enterprise and hyperscale data centers, automotive, networking and beyond.

Samsung will continue to push boundaries in tomorrow’s semiconductor technologies through innovations such as its sixth-generation V-NAND built on a single structure, or with ‘1-stack technology,’ and sub-10nm DRAM with EUV for super-high density and performance.

Experts across the industry, including Apple co-founder, Steve Wozniak, were invited at Samsung Tech Day to address the advancements and challenges in today’s semiconductor market, and offer insights for the future of semiconductors. More than 400 customers, partners and industry influencers attended the event.