With comprehensive process technology roadmap updates down to 3-nanometer (nm) at the annual ‘Samsung Foundry Forum (SFF) 2018 USA’, Samsung Foundry is focused on providing customers with the tools necessary to design and manufacture powerful, yet energy-efficient system-on-chips (SoC) for a wide range of applications.

“The trend toward a smarter, connected world has the industry demanding more from silicon providers,” said Charlie Bae, executive vice president and head of the Foundry Sales & Marketing Team at Samsung Electronics. “To meet that demand, Samsung Foundry is powering innovation at the silicon level that will ultimately give people access to data, analysis, and insight in new and previously unthought-of ways to make human lives better. It is imperative for us to accomplish the first-time silicon success for our customers’ next-generation chip designs.”

Process Technology Roadmap Updates

• 7LPP (7nm Low Power Plus): 7LPP, the first semiconductor process technology to use an EUV lithography solution, is scheduled to be ready for production in the second half of this year. Key IPs are under development, aiming to be completed by the first half of 2019.

• 5LPE (5nm Low Power Early): Through further smart innovation from the 7LPP process, 5LPE will allow greater area scaling and ultra-low power benefits.

• 4LPE/LPP (4nm Low Power Early/Plus): The use of highly mature and verified FinFET technology will be extended to the 4nm process. As the last generation of FinFET, 4nm provides a smaller cell size, improved performance, and faster ramp-up to the stable level of yield by adopting proven 5LPE, supporting easy migration.

• 3GAAE/GAAP (3nm Gate-All-Around Early/Plus): 3nm process nodes adopt GAA, the next-generation device architecture. To overcome the physical scaling and performance limitations of the FinFET architecture, Samsung is developing its unique GAA technology, MBCFET^TM (Multi-Bridge-Channel FET) that uses a nano-sheet device. By enhancing the gate control, the performance of 3nm nodes will be significantly improved.

HPC (High-Performance Computing) Solutions

Samsung Foundry delivers the technology solutions to drive the latest hyper-scale datacenters and accelerate the growth of Artificial Intelligence (AI) and Machine Learning capability. From the latest 7LPP technology and beyond with its EUV capability, to the differentiated high-speed IPs such as 100Gbps+ SerDes on top of the innovative 2.5D/3D heterogeneous packaging, Samsung delivers the total platform solutions to greatly increase computing power and accelerate AI revolution.

Connected Device Solutions

From low-power microcontroller units (MCU) and next-generation connected devices to the most sophisticated autonomous vehicles based on 5G and Vehicle to Everything (V2X) communication, Samsung Foundry offers full-featured turnkey platforms to enable compelling products. A broad technology portfolio from 28/18 FD-SOI with eMRAM and RF capability to advanced 10/8nm FinFET processes will enable a great end-user experience for connected devices.

Mr. Bae continued, “Over the past year, we have focused on strengthening our EUV process portfolio to provide each of our customers with the finest technologies. Applying GAA structure to our next generation process node will enable us to take the lead in opening a new smart, connected world, while also to reinforcing our technology leadership.”

Details regarding Samsung Foundry can be found at www.samsungfoundry.comand www.linkedin.com/company/samsungfoundry.

A recent vote, held at the European Telecommunications Standards Institute (ETSI) in Sophia Antipolis, France, saw Suresh Chitturi (front row, fifth from right) elected as the new Chairman of the 3GPP SA6 Working Group

Mr. Suresh Chitturi, Director for Standards at the Samsung Research Institute in Bangalore, was recently elected as new Chairman of the 3^rd Generation Partnership Project (3GPP) Service and System Aspect 6 (SA6) Working Group by acclamation in Sophia Antipolis, France.

The 3GPP is a collaborative project aimed at developing global standards for acceptable specifications of telecommunications networks. The project is comprised of three Technical Specification Groups (TSGs), under which 16 Working Groups oversee specifications for each sector. In addition to Mr. Chitturi, new Chairman of SA6, other Samsung officials currently serving in elected roles on the 3GPP include one TSG Chairman, two Chairman of Working Groups, and two Vice-Chairman. For his part, Mr. Chitturi will lead the SA6 Working Group for the next two years.

For its part, the SA6 is a key working group responsible for the development of application layer standards. Since its inception in 2014, SA6 has played a significant role in the development of Mission Critical Applications Standards across Long-Term Evolution (LTE), a global standard widely adopted by public safety agencies and other critical communication industry verticals. The Standards enable the use of push-to-talk voice, video and data communications for public protection and disaster relief (PPDR) operations over broadband networks.

“Providing leadership to 3GPP SA6 Working Group, especially in this era of new mobile communications, is a unique opportunity. We at Samsung value the importance of the activity of 3GPP and SA6 in creating a robust platform for future 5G services, leading up to the era of 5G commercialization,” said Mr. Chitturi.

Mr. Chitturi currently serves as the Director for Standards at the Samsung Research Institute in Bangalore, India

While there is a significant industry effort to develop the new 5G standard, which is scheduled to be ready by June this year, the focus on 5G services will be far more critical to the applications of 5G technology. Mission Critical Application Standards, which apply to the essential systems critical to the survival of a business or organization, will remain a key responsibility of SA6 Working Group particularly in the move towards diverse applications of 5G. For instance, Vehicle-to-Everything (V2X), smart factories, as well as 5G service application programming interface (API) frameworks will allow 3^rd party verticals to leverage the rich capabilities of the 5G core network and new radio.

“Samsung’s leadership in the 5G space has been a result of our technology innovation and strong collaboration with ecosystem players. We recognize the important role of 3GPP and SA6 in shaping the future of 5G services. The appointment of Suresh as the Chairman of 3GPP is testimony of Samsung India R&D team’s strength in defining global standards and the wealth of research talent that Samsung attracts in India,” said Dipesh Shah, Managing Director, SRI-B.

Prior to being elected Chairman, Mr. Chitturi served as Vice-Chairman of SA6 Working Group, providing key contribution to the timely completion of Mission Critical Standards to meet the needs of the Critical Communications industry. Mr. Chitturi also represents Samsung on the Governing Council of TSDSI, the India Telecom Standards Development Organization (SDO), and has previously held leadership positions in several other SDOs such as World Wide Web (W3C), Open Mobile Alliance (OMA), Java Community Process (JCP), and the GSM Association (GSMA).

In addition to the appointment of Mr. Chitturi, Mr. Aris Papasakellariou, Senior Director of Standards at Samsung Research America, received the 2017 3GPP Excellence Award earlier this month for his outstanding contributions in the field of radio access technology for 5G.

Samsung continues its significant contribution and progress in making 5G a reality, with advancements including introduction of the world’s first 5G Fixed Wireless Access (FWA) commercial solutions at MWC 2018, as well as being selected as supplier by many of the world’s leading carrier companies.