Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

May 5, 2015

Samsung Electronics introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.

For more information, please see :
https://news.samsung.com/global/samsung-electronics-unveils-ultra-compact-led-chip-scale-packaging-technology-at-lightfair-international-2015