Eight Major Steps to Semiconductor Fabrication, Part 7: The Metal Interconnect

June 3, 2015

In the last part of our series, we went over the thin-film process in which a semiconductor chip gets its electrical properties. But we need to ensure that these electronic elements are well-connected and “powered” so that the appropriate signals can reach where they need to. This is achieved during the metal interconnect process, which we will discuss in this part of our semiconductor series.

For more information, please see :
https://news.samsung.com/global/eight-major-steps-to-semiconductor-fabrication-part-7-the-metal-interconnect