Eight Major Steps to Semiconductor Fabrication, Part 9: Packaging and Package Testing

June 17, 2015

In the previous part of the series, we discussed electrical die sorting (EDS), one of the last stages of semiconductor fabrication. Today, we will cover the packaging and package testing processes as we wrap up our series and ship off our completed semiconductor.

For more information, please see :
https://news.samsung.com/global/eight-major-steps-to-semiconductor-fabrication-part-9-packaging-and-package-testing