Eight Major Steps to Semiconductor Fabrication, Part 8: Electrical Die Sorting (EDS)

June 10, 2015

In the previous part of our series, we explored the metal interconnect process which ensures a semiconductor’s electronic elements are well-connected so that the appropriate signals can reach where they need to.

It’s been a lengthy process, and we’ve just about completed the fabrication of our semiconductor, but in order to see if our hard work has paid off, we must look at the yield, or the percentage of functional chips out of the total chips designed on a single wafer.

For more information, please see :
https://news.samsung.com/global/eight-major-steps-to-semiconductor-fabrication-part-8-electrical-die-sorting-eds