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Semiconductors (711/748)

[Editorial] Packaging with a Punch

April 14, 2015

Samsung’s Semiconductor Series Part 3

Building state-of-the-art semiconductor chips is one thing but making them into the actual square chips we’re familiar with involves a lot of high-tech, too. This process is called packaging, or back-end manufacturing, where chips are essentially sliced off of the silicon wafer, wired up and encased in epoxy for protection.

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