[Editorial] Packaging with a Punch

April 14, 2015

Samsung’s Semiconductor Series Part 3

Building state-of-the-art semiconductor chips is one thing but making them into the actual square chips we’re familiar with involves a lot of high-tech, too. This process is called packaging, or back-end manufacturing, where chips are essentially sliced off of the silicon wafer, wired up and encased in epoxy for protection.

For more information, please see :
https://news.samsung.com/global/packaging-with-a-punch-editorial