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Semiconductors (486/515)

Samsung Electronics Mass Producing High-Density ePoP Memory for Smartphones

February 4, 2015

Samsung is now mass producing the industry’s first ePoP (embedded package on package) memory – a single memory package consisting of 3GB LPDDR3* DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the extremely thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space – a distinct improvement over existing two-package eMCP memory solutions.

For more information, please see:
https://news.samsung.com/global/samsung-electronics-mass-producing-high-density-epop-memory-for-smartphones

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