Samsung Memory 3DS TSV SDRAM Package

February 17, 2016

To meet the ever increasing demand for higher density server memory modules, Samsung offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology.

The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.

For more information, please see:
www.samsung.com/semiconductor/products/dram/