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Semiconductors (345/803)

Samsung to Advance High Performance Computing Systems with Launch of Industry’s First 3rd-generation (16GB) HBM2E

February 3, 2020

Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

For more information, please see:https://news.samsung.com/global/samsung-to-advance-high-performance-computing-systems-with-launch-of-industrys-first-3rd-generation-16gb-hbm2e

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