Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications

August 13, 2020

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today’s most advanced process nodes. Leveraging Samsung’s through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable.

For more information, please see:
https://news.samsung.com/global/samsung-announces-availability-of-its-silicon-proven-3d-ic-technology-for-high-performance-applications