Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model.

Leveraging the chip’s limit-pushing computing power and power efficiency, Baidu can effectively support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

Through the first foundry cooperation between the two companies, Baidu will provide advanced AI platforms for maximizing AI performance, and Samsung will expand its foundry business into high performance computing (HPC) chips that are designed for cloud and edge computing.

“We are excited to lead the HPC industry together with Samsung Foundry,” said OuYang Jian, Distinguished Architect of Baidu. “Baidu KUNLUN is a very challenging project since it requires not only a high level of reliability and performance at the same time, but is also a compilation of the most advanced technologies in the semiconductor industry. Thanks to Samsung’s state of the art process technologies and competent foundry services, we were able to meet and surpass our goal to offer superior AI user experience. ”

“We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”

As higher performance is required in diverse applications such as AI and HPC, chip integration technology is becoming more and more important. Samsung’s I-Cube technology, which connects a logic chip and high bandwidth memory (HBM) 2 with an interposer, provides higher density/ bandwidth on minimum size by utilizing Samsung’s differentiated solutions.

Compared to previous technology, these solutions maximize product performance with more than 50% improved power/signal integrity. It is anticipated that I-Cube technology will mark a new epoch in the heterogeneous computing market. Samsung is also developing more advanced packaging technologies, such as redistribution layers (RDL) interposer and 4x, 8x HBM integrated package.

2.5D Package Structure

About Baidu

Baidu, Inc. is the leading Chinese language Internet search provider. Baidu aims to make the complicated world simpler through technology. Baidu’s ADSs trade on the NASDAQ Global Select Market under the symbol “BIDU”. Currently, ten ADSs represent one Class A ordinary share.

Kuala Lumpur, 4 June 2019 – AMD and Samsung Electronics Co., Ltd. today announced a multi-year strategic partnership in ultra-low power, high performance mobile graphics IP based on AMD Radeon graphics technologies. As part of the partnership, Samsung will license AMD graphics IP and will focus on advanced graphics technologies and solutions that are critical for enhancing innovation across mobile applications, including smartphones.

“As we prepare for disruptive changes in technology and discover new opportunities, our partnership with AMD will allow us to bring ground-breaking graphics products and solutions to market for tomorrow’s mobile applications,” said Inyup Kang, president of Samsung Electronics’ S.LSI Business. “We look forward to working with AMD to accelerate innovations in mobile graphics technologies that will help take future mobile computing to the next level.”

“Adoption of our Radeon graphics technologies across the PC, game console, cloud and HPC markets has grown significantly and we are thrilled to now partner with industry leader Samsung to accelerate graphics innovation in the mobile market,” said Dr. Lisa Su, AMD president and CEO. “This strategic partnership will extend the reach of our high-performance Radeon graphics into the mobile market, significantly expanding the Radeon user base and development ecosystem.”

Key terms of the partnership include:

• AMD will license custom graphics IP based on the recently announced, highly-scalable RDNA graphics architecture to Samsung for use in mobile devices, including smartphones, and other products that complement AMD product offerings.
• Samsung will pay AMD technology license fees and royalties.

*AMD, the AMD Arrow logo, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.