The achievement was based on Samsung’s restored financial performance, which is now near pre-pandemic levels, and higher demand for memory due to an increase in data usage. In 2021, Samsung scored a brand value growth of 20% compared to 2020 and this year, continues the double-digit growth. Samsung first entered the top 10 list in 2012, placing in ninth position, and has managed to rise in the chart each year, reaching sixth place in 2017 and fifth place in 2020.

“Samsung Electronics was able to record two consecutive years of double-digit growth in brand value, all thanks to the support from our global customers,” said YH Lee, Executive Vice President and Chief Marketing Officer of Samsung Electronics. “In return, the entire company will work together as a team to provide a better and more satisfying customer experience.”

Various Factors Evaluated by Interbrand to Build the Samsung Brand Value

At the end of 2021, Samsung Electronics merged its SET Division and created the Device eXperience Division to increase synergy among its products and provide a next level of experience to customers. Furthermore, Samsung also launched the Customer eXperience-Multi Device Experience Center to strengthen its multi-device connection experience.

Along with these measures, Samsung has integrated the SmartThings across its product categories, creating an inclusive ecosystem and a multi-device experience. SmartThings also empowers consumers to get the most out of their Samsung devices, as well as third-party products they may already own.

In addition, Samsung’s Future Generation Lab has been created to foster authentic conversations around the activities of the next generation. The insights from the lab have been applied to the products and marketing activities.

As well as innovative products based on consumer experiences, the development of advanced technologies such as artificial intelligence (AI), 5G, automotive and robotics through consistent investment also played a role in Samsung’s growth.

Samsung’s Recognized Efforts in Each Product Division for a Better Customer Experience

Mobile

• Camera innovation of Galaxy S22 series based on customers’ insights, and Nightography campaign rollout Cementing leadership in the foldable mobile phone category
• Partnership with Google and Microsoft to strengthen users’ connected experience
• Respecting the value of user security and privacy through Samsung Knox

Network

• Pioneering network innovation path in virtualization and openness with large-scale commercial experiences
• Driving 5G industry with its market-leading 5G portfolio from RAN and Core to automation tools
• Realizing the ESG commitment through intelligent network solutions for energy efficiency

Visual Display

• Continuing innovation of premium TVs, including Micro LED, the Neo QLED 8K/4K
• Strengthening its product portfolio based on customers’ lifestyle, such as The Frame, The Freestyle
• Providing new gaming experiences to consumers, including the Samsung Gaming Hub and the Odyssey Ark

Home Appliances

• Expanding Bespoke product categories beyond kitchen to entire home including clothing care, floor care and air care
• Delivering sustainability values through its products (achieving high level of energy saving rate for major products, guaranteed warranties for digital inverter compressor, reduced microplastic emission from washing machines in collaboration with Patagonia)
• Creating excitement among Bespoke fans through participation-focused online and offline campaigns

Semiconductor

• Investing in next-generation technologies and production capabilities to ensure stable supplies for cutting-edge applications (constructing new $17B manufacturing line in Texas, KRW 20-trillion R&D complex in Giheung)
• Delivering industry-leading semiconductor innovations that enhance product performance and energy efficiency (industry’s first 3nm GAA mass production)
• Developing innovative memory solutions to address the explosive growth of data-intensive tasks in areas such as AI and ML (CXL memory, HBM-PIM, second-generation SmartSSD), and expanding strategic partnerships to tackle new industry challenges
• Pushing boundaries of logic solutions that can offer enhanced user experiences and new opportunities (5G Exynos Modem, Exynos 2200, 200MP ISOCELL HP3)

Interbrand’s Best Global Brands are listed according to the evaluation of each brand value, which is a result of comprehensive analysis of the financial performance of the company, the influence of the brand on customer purchases and brand competitiveness.

Samsung Electronics has rolled up its sleeves to tackle the marine pollution issue that is threatening the safety of humankind and the environment. The company’s eco-conscious efforts include recycling discarded ocean-bound plastic (OBP) located within 50km of the coast and using recycled materials to produce high-resolution monitors and Galaxy devices.

In addition, the eco-conscious water treatment technology that’s currently being used at the manufacturing sites of Samsung’s Device Solutions (DS) Division significantly reduces water usage, reusing an amount of water equivalent to the total usage of two million people over half a year. Efforts like these underline Samsung’s commitment to conserving water.

Check out the infographic below to learn more about how Samsung is reducing marine pollution by transforming OBP into parts for monitors and mobile devices including smartphones, and by purifying wastewater at its semiconductor plants.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it received the industry’s first Triple Standard for carbon, water and waste by Carbon Trust.

Samsung was awarded this certification by reducing the amount of carbon emissions, water use, and waste discharge over the past three years at five operations (Giheung, Hwaseong, Pyeongtaek, Onyang and Cheonan) in Korea and four global manufacturing sites in U.S. and China (Austin, Suzhou, Tianjin and Xi’an). This is a huge feat, considering that it is extremely challenging for semiconductor manufacturing companies to meet all three qualifications at once.

“For decades, Samsung has been striving to incorporate environmental sustainability into every aspect of the semiconductor manufacturing process,” said Seong-dai Jang, senior vice president and head of DS Corporate Sustainability Management Office at Samsung Electronics. “We’ll continue to pursue more environmentally sustainable policies across the entire production and supply chain.”

Samsung has been making various efforts in carbon reduction, water resource conservation and recycling, and has been managing these as important sustainability goals.

Samsung’s Efforts to Reduce Its Environmental Footprint

• Greenhouse Gas: Samsung has been sourcing 100-percent renewable energy for its overseas semiconductor operations in the United States and China since 2019, and the company’s continued efforts to reduce its carbon footprint also includes optimizing gas use for etching and deposition processes, as well as developing new catalysts for its greenhouse gas reduction equipment. Through these endeavors, Samsung was able to cut about 1.3-million tons¹ of carbon emissions in 2020—about 200 million pine trees would be required to absorb the same amount of carbon.²

• Water Management: Samsung has been recycling wastewater generated in the process of producing ultra-pure water for equipment such as wet scrubbers and cooling towers. The company has also reduced water usage utilizing its wastewater filtration technology—known as the ‘membrane process’ —to reuse water and optimize manufacturing processes. Equipment operation efficiency has also increased by consolidating wastewater reclamation and reuse systems. As a result, Samsung was able to reuse about 70 million tons of water in 2020, a 12-percent increase compared to 2018~2019, and reduce more than 10 million tons of water usage,³ which is the same amount used for two-million people per month in a metropolitan area in Korea.⁴

• Waste Discharge: Samsung has significantly reduced wastewater sludge,⁵ which accounts for more than 60-percent of total waste generation, by applying alternative materials and optimizing the amount of materials supplied to particular facilities. In addition, by establishing packaging standards for products brought into the line, the amount of waste from over-packaging has also been reduced. Through all these efforts, Samsung reduced a total of 35,752 tons⁶ of waste discharged in 2020.

Samsung Electronics strives to incorporate environmental sustainability into everything it does. Samsung’s products are thoughtfully designed to minimize the impact on the environment during their entire lifecycle – from planning and manufacturing to consumption and recycling.

¹ The amounts stated are converted measurements based on production levels

² A 30-year-old pine tree can absorb about 6.6 kilograms of carbon dioxide (CO2) per year (Korea Institute of Forest Science)

³ The amounts stated are converted measurements based on production levels

⁴ Korea Ministry of Environment (2019)

⁵ Wastewater sludge is a by-product generated in the treatment process of industrial wastewater or sewage.

⁶ The amounts stated are converted measurements based on production levels

The plan represents an increase of KRW 38 trillion from the previous commitment of KRW 133 trillion announced in April 2019 and is expected to help the Company reach its goal of becoming the world leader in logic chips by 2030. For the past two years, Samsung has been closely collaborating with various semiconductor design companies, component and equipment manufacturers, as well as academia in making progress towards that goal.

The expansion of the Company’s Foundry Business will help fuel entire new industries built on next-generation technologies like AI, 5G and autonomous driving.

The Company also announced that it has begun construction of a new production line in Pyeongtaek, Korea, which is expected to be completed in the second half of 2022. The state-of-the-art facility equipped with the latest technology, P3, will produce 14-nanometer DRAM and 5-nanometer logic semiconductors, both based on extreme ultraviolet (EUV) lithography technology.

“The entire semiconductor industry is facing a watershed moment and now is the time to chart out a plan for long-term strategy and investment,” said Dr. Kinam Kim, Vice Chairman and Head of Device Solutions Division at Samsung Electronics. “For the memory business, where Samsung has maintained its undisputed leadership position, the Company will continue to make preemptive investments to lead the industry.”

As one of the world’s largest semiconductor clusters, Pyeongtaek will serve as the leading hub for next-generation innovations.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.

Samsung’s I-Cube^TM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.

Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.

“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”

In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer become higher, which negatively impacts product quality.

With strong expertise and knowledge on semiconductors, Samsung has studied how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.

Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.

Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration technology has signaled a new era in the high-performance computing market. Samsung is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.

I-Cube4TM (Interposer Cube) Package Structure

A transistor is a semiconductor device used to transform the digital information coded in the binary system into electric signals. A transistor is composed of a ‘channel’ in which the electric current flows between the semiconductor’s source and its drain and a ‘gate’ for managing the electric current traveling through the channel. The gate generates binary system data by amplifying electric signals and also working as a switch. Because of this, the transistor is essentially the basic element of a semiconductor chip.

All digital information, be it in the form documents, photos or videos, is in fact a composed of the binary numeral system, which only uses two symbols, ‘0’ and ‘1’.

In order to increase the number of semiconductor chips mounted on the limited surface of a silicon (Si) substrate, the size of each semiconductor chip naturally needs to be decreased. Furthermore, in order to fit more new and complex functions into each semiconductor chip, the very basic element transistor must become smaller and its power consumption must be minimized to provide the longest possible battery lifespan, as well as reduced heat and electric charges. As electricity consumption is dependent on operating voltage, transistors have been developed so as to decrease operating voltage. Therefore, the history of the semiconductor is synonymous with the history of creating transistors that are smaller, faster and that consume less electricity.

The history of the development of the semiconductor is synonymous with the history of creating transistors that are smaller, faster and that consume less electricity. From the left, Planar Transistor, Fully Depleted (Fin) Transistor, and GAA Transistor

The most widely used transistor in the current semiconductor industry is the Metal-Oxide-Semiconductor (MOS). It consists of a metal electrode, an oxide insulator and a semiconductor channel. The first MOS transistor was of a planar architecture and was structured so that the gate and the channel made contact on one plane. But, as transistors become smaller, the distance between the source and the drain gets smaller, making it difficult for the transistor to work as a switch. This is called a ‘short-channel effect’, and along with limiting voltage reduction, it means that planar transistors can only be applied to 20 or above nanometer nodes (or generations)¹.

In order to overcome the short-channel effect, the Fully Depleted transistor emerged as the next generation of transistor. This transistor uses a thin silicon (Si) channel to avoid the short-channel effect by enhancing the ability of the gate to adjust the channel. Its structure format evolved out of that of the conventional transistor (a gate on a plane channel) to become a thin, rugged structure with a standing rectangular channel that interlocks with gates on three sides. As this thin, standing channel somewhat resembles a fish’s dorsal fin, it is also called the ‘fin transistor’. Samsung manufactures fin transistors in a range of sizes, starting at just 14 nanometers.

Whereas a planar transistor only allows the channel and the gate to contact in just one plane, a fin transistor has a 3-dimensional structure that allows three sides of a channel (excluding its bottom) to come into contact with the gates. This increased contact with the gates improves semiconductor performance as well as increasing the reduction of operating voltage, solving the problems brought about by the short-channel effect.

Nevertheless, the fin transistor is now facing limitations after several generations of developments and process transitions. Nowadays, the semiconductor industry is increasingly requiring transistors that can reduce operating voltage even further. Despite the fin transistor’s 3-dimensional structure, that only three of the four sides are in contact with gates is now becoming a limitation, as transistors themselves continue to progress and subsequently get smaller.

The evolution of semiconductor transistors

In order to mitigate the limitations of existing transistors solutions, Samsung has developed a new structure, the Gate-All-Around (GAA). As the name suggests, the GAA is a structure that maximizes gates’ channel-controlling function, as all channels, including the fourth bottom one, are covered by gates. The gates provide a 360-degree coverage of the entire channel area to eliminate the short-channel effect, resulting in reducing operating voltage further.

A typical GAA transistor takes the form of a thin and long nanowire². However, a channel needs to be as wide as possible in order to allow a large amount of current to flow through it, and the small diameter of the nanowire makes obtaining this higher current flow difficult. To overcome this, Samsung created and patented their proprietary MBCFET (Multi-Bridge Channel Field Effect Transistor), an optimized version of the GAA transistor. The MBCFET increases the areas that make contact with gates by aligning wire-formed channel structures as a 2-dimensional nanosheets, which enables simpler device integration as well as increasing the electric current. Samsung’s MBCFET is a competitive transistor structure in that it not only includes the means to mitigate the short-channel effect thanks to the GAA structure, but it also increases performance by expanding the channel area.

Compared to existing 7-nanometer fin transistor process technology, the MBCFET decreases power consumption by 50%, improves performance by 30%, and reduces the area that the transistor takes up by 45%.

The development of GAA transistors, tantamount to the Industrial Revolution of semiconductor technology, is such a difficult process that Samsung is the only company currently offering a future delivery plan. Furthermore, the successful creation of the MBCFET is indicative of Samsung’s global industry-leading technological prowess. It has laid the foundation for transforming the semiconductor industry that was set to stall at the 4-nanometer scale, along with providing core technologies necessary for bringing about the fourth industrial revolution.

With this latest market-leading development, Samsung is paving the way for the future of the industry thanks to its collaborative approach and trailblazing technologies.

As a semiconductor engineer working in an industry that is entering an era of transformation brought about by new technology, I am very excited to see what the future holds.

¹Nanometer is a measurement for a semiconductor. 1 nanometer is equal to one billionth of a meter.

²An ultra-tiny line that has one nanometer in section diameter