{"id":34554,"date":"2019-10-07T13:07:04","date_gmt":"2019-10-07T17:07:04","guid":{"rendered":"https:\/\/news.samsung.com\/us\/?p=34554"},"modified":"2019-10-07T13:07:57","modified_gmt":"2019-10-07T17:07:57","slug":"samsung-electronics-develops-industrys-first-12-layer-3d-tsv-chip-packaging-technology","status":"publish","type":"post","link":"https:\/\/news.samsung.com\/us\/samsung-12-layer-3d-tsv-chip-packaging-technology\/","title":{"rendered":"Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology"},"content":{"rendered":"

The new technology allows for the stacking of 12 DRAM chips using more than <\/em>60,000 TSV holes, while maintaining the same thickness as current 8-layer chips<\/em><\/span><\/h3>\n

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology.<\/p>\n

Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.<\/p>\n

The thickness of the package (720\u339b) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs.<\/p>\n

In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.<\/p>\n

\u201cPackaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC),” said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics<\/strong>. “As Moore’s law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology.”<\/p>\n

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.<\/p>\n

Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte (GB)* High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.<\/p>\n

Samsung will be able to meet the rapidly growing market demand for high-capacity HBM solutions with its cutting-edge 12-layer 3D TSV technology and it hopes to solidify its leadership in the premium semiconductor market.<\/p>\n

TSV PKG cross section structure<\/span><\/h3>\n

\"TSV<\/p>\n

Wire bonding vs TSV technology<\/span><\/h3>\n

\"Wire<\/p>\n

*8GB mass-production product = 8Gb x 8 layers, 24GB newly developed product = 16Gb x 12 layers<\/h6>\n","protected":false},"excerpt":{"rendered":"

The new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation […]<\/p>\n","protected":false},"author":84,"featured_media":34628,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[29722,17550,29718,17557,29739],"tags":[953,589,84],"blue-badge":[],"class_list":["post-34554","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-product-emerging-technology-artificial-intelligence","category-product-emerging-technology","category-product","category-semiconductor","category-product-semiconductor","tag-artificial-intelligence-ai","tag-chip","tag-semiconductor"],"acf":{"turn_off_retargeting":false},"fimg_mobile_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2019\/10\/07130505\/Wire-bonding-vs-TSV-technology1-e1570467918100.jpg","fimg_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2019\/10\/07130505\/Wire-bonding-vs-TSV-technology1-e1570467918100.jpg","primary_category":{"term_id":29722,"name":"Artificial Intelligence","slug":"product-emerging-technology-artificial-intelligence","term_group":0,"term_taxonomy_id":29722,"taxonomy":"category","description":"","parent":17550,"count":32,"filter":"raw","term_link":"https:\/\/news.samsung.com\/us\/category\/product\/product-emerging-technology\/product-emerging-technology-artificial-intelligence\/","term_path":"product\/product-emerging-technology\/product-emerging-technology-artificial-intelligence"},"badge":"Press Release","_links":{"self":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts\/34554","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/users\/84"}],"replies":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/comments?post=34554"}],"version-history":[{"count":0,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts\/34554\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/media\/34628"}],"wp:attachment":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/media?parent=34554"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/categories?post=34554"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/tags?post=34554"},{"taxonomy":"blue-badge","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/blue-badge?post=34554"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}