{"id":37999,"date":"2020-03-24T19:02:38","date_gmt":"2020-03-24T23:02:38","guid":{"rendered":"https:\/\/news.samsung.com\/us\/?p=37999"},"modified":"2020-03-24T18:53:01","modified_gmt":"2020-03-24T22:53:01","slug":"samsung-announces-industrys-first-euv-dram-with-shipment-of-first-million-modules","status":"publish","type":"post","link":"https:\/\/news.samsung.com\/us\/samsung-industrys-first-euv-dram-shipment-first-million-modules\/","title":{"rendered":"Samsung Announces Industry&#8217;s First EUV DRAM with Shipment of First Million Modules"},"content":{"rendered":"<h3 style=\"text-align: center\"><strong><span style=\"color: #808080\"><em>EUV-based 1st-gen 10nm-class DRAM (D1x) has completed its customer evaluations;<\/em><em>\u00a0EUV to be fully deployed from 4th-gen 10nm-class DRAM (D1a) next year<\/em><\/span><\/strong><\/h3>\n<div id=\"attachment_38010\" style=\"width: 1210px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-38010\" class=\"size-full wp-image-38010\" src=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24185219\/Samsung-DDR4-Module.jpg\" alt=\"Samsung DDR4 Module\" width=\"1200\" height=\"849\" srcset=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24185219\/Samsung-DDR4-Module.jpg 1200w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24185219\/Samsung-DDR4-Module-600x425.jpg 600w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24185219\/Samsung-DDR4-Module-950x672.jpg 950w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><p id=\"caption-attachment-38010\" class=\"wp-caption-text\">Samsung DDR4 Module<\/p><\/div>\n<p>Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry&#8217;s first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.<\/p>\n<p>&#8220;With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers,\u201d<strong> said Jung-bae Lee, executive vice president of DRAM Product &amp; Technology at Samsung Electronics.<\/strong> &#8220;This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market.&#8221;<\/p>\n<div id=\"attachment_38006\" style=\"width: 3010px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-38006\" class=\"size-full wp-image-38006\" src=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124213\/Samsung-Electronics-V1-EUV-Line-Image-2.jpg\" alt=\"Samsung Electronics V1 EUV Line in Samsung Hwaseong Campus\" width=\"3000\" height=\"2000\" srcset=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124213\/Samsung-Electronics-V1-EUV-Line-Image-2.jpg 3000w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124213\/Samsung-Electronics-V1-EUV-Line-Image-2-600x400.jpg 600w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124213\/Samsung-Electronics-V1-EUV-Line-Image-2-950x633.jpg 950w\" sizes=\"auto, (max-width: 3000px) 100vw, 3000px\" \/><p id=\"caption-attachment-38006\" class=\"wp-caption-text\">Samsung Electronics V1 EUV Line in Samsung Hwaseong Campus<\/p><\/div>\n<p>Samsung is the first to adopt EUV in DRAM production to overcome challenges in DRAM scaling. EUV technology reduces repetitive steps in multi-patterning and improves patterning accuracy, enabling enhanced performance and greater yields as well as shortened development time.<\/p>\n\n\t\t<\/div>\n\t\t<\/div>\n\t\t<div class=\"embedded recommended recommended-post\">\n\t\t\t<div class=\"embedded-inner\">\n\t\t\t\t<div class=\"card-badge\">\n\t\t\t\t\t<p>Recommended News<\/p>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"recommended-card\">\n\t\t\t\t\t<a href=\"https:\/\/news.samsung.com\/us\/samsung-begins-mass-production-industrys-first-16gb-lpddr5-dram-next-generation-premium-smartphones\/\" class=\"recommended-news\">\n\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/02\/25085047\/LPDDR5_16GB_F.jpg\" alt=\"Samsung Begins Mass Production of Industry\u2019s First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones\">\n\t\t\t\t\t\t<div class=\"details\">\n\t\t\t\t\t\t\t<div class=\"details-inner\">\n\t\t\t\t\t\t\t\t<p class=\"post-category\">Memory<\/p>\n\t\t\t\t\t\t\t\t<h4>Samsung Begins Mass Production of Industry\u2019s First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones<\/h4>\n\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t<div class=\"article-content\">\n\t\t<div class=\"article-body\">\n<p>EUV will be fully deployed in Samsung&#8217;s future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.<\/p>\n<p>In line with the expansion of the DDR5\/LPDDR5 market next year, the company will further strengthen its collaboration with leading IT customers and semiconductor vendors on optimizing standard specifications, as it accelerates the transition to DDR5\/LPDDR5 throughout the memory market.<\/p>\n<div id=\"attachment_38005\" style=\"width: 6018px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-38005\" class=\"size-full wp-image-38005\" src=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124209\/Samsung-Hwaseong-Campus-Image-3.jpg\" alt=\"Samsung Hwaseong Campus, one of Samsung's main chip manufacturing bases is located in Giheung, South Korea.\" width=\"6008\" height=\"4000\" srcset=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124209\/Samsung-Hwaseong-Campus-Image-3.jpg 6008w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124209\/Samsung-Hwaseong-Campus-Image-3-600x399.jpg 600w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124209\/Samsung-Hwaseong-Campus-Image-3-950x632.jpg 950w\" sizes=\"auto, (max-width: 6008px) 100vw, 6008px\" \/><p id=\"caption-attachment-38005\" class=\"wp-caption-text\">Samsung Hwaseong Campus, one of Samsung&#8217;s main chip manufacturing bases is located in Giheung, South Korea.<\/p><\/div>\n<p>To better address the growing demand for next-generation premium DRAM, Samsung will start the operation of a second semiconductor fabrication line in Pyeongtaek, South Korea, within the second half of this year.<\/p>\n<p><strong>Timeline of Samsung DRAM Milestones<\/strong><\/p>\n\n<table id=\"tablepress-211\" class=\"tablepress tablepress-id-211 tbody-has-connected-cells\">\n<thead>\n<tr class=\"row-1\">\n\t<th class=\"column-1\">Date<\/th><th class=\"column-2\">Samsung DRAM Milestones<\/th>\n<\/tr>\n<\/thead>\n<tbody class=\"row-striping row-hover\">\n<tr class=\"row-2\">\n\t<td rowspan=\"2\" class=\"column-1\">2021 (TBD)<\/td><td class=\"column-2\">4th-gen 10nm-class (1a) EUV-based <\/td>\n<\/tr>\n<tr class=\"row-3\">\n\t<td class=\"column-2\">16Gb DDR5\/LPDDR5 mass production<\/td>\n<\/tr>\n<tr class=\"row-4\">\n\t<td class=\"column-1\">03.01.20<\/td><td class=\"column-2\">4th-gen 10nm-class (1a) EUV-based DRAM development<\/td>\n<\/tr>\n<tr class=\"row-5\">\n\t<td class=\"column-1\">09.01.19<\/td><td class=\"column-2\">3rd-gen 10nm-class (1z) 8Gb DDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-6\">\n\t<td class=\"column-1\">06.01.19<\/td><td class=\"column-2\">2nd-gen 10nm-class (1y) 12Gb LPDDR5 mass production<\/td>\n<\/tr>\n<tr class=\"row-7\">\n\t<td class=\"column-1\">03.01.19<\/td><td class=\"column-2\">3rd-gen 10nm-class (1z) 8Gb DDR4 development<\/td>\n<\/tr>\n<tr class=\"row-8\">\n\t<td class=\"column-1\">11.01.17<\/td><td class=\"column-2\">2nd-gen 10nm-class (1y) 8Gb DDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-9\">\n\t<td class=\"column-1\">09.01.16<\/td><td class=\"column-2\">1st-gen 10nm-class (1x) 16Gb LPDDR4\/4X mass production<\/td>\n<\/tr>\n<tr class=\"row-10\">\n\t<td class=\"column-1\">02.01.16<\/td><td class=\"column-2\">1st-gen 10nm-class (1x) 8Gb DDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-11\">\n\t<td class=\"column-1\">10.01.15<\/td><td class=\"column-2\">20nm (2z) 12Gb LPDDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-12\">\n\t<td class=\"column-1\">12.01.14<\/td><td class=\"column-2\">20nm (2z) 8Gb GDDR5 mass production<\/td>\n<\/tr>\n<tr class=\"row-13\">\n\t<td class=\"column-1\">12.01.14<\/td><td class=\"column-2\">20nm (2z) 8Gb LPDDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-14\">\n\t<td class=\"column-1\">10.01.14<\/td><td class=\"column-2\">20nm (2z) 8Gb DDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-15\">\n\t<td class=\"column-1\">02.01.14<\/td><td class=\"column-2\">20nm (2z) 4Gb DDR3 mass production<\/td>\n<\/tr>\n<tr class=\"row-16\">\n\t<td class=\"column-1\">02.01.14<\/td><td class=\"column-2\">20nm-class (2y) 8Gb LPDDR4 mass production<\/td>\n<\/tr>\n<tr class=\"row-17\">\n\t<td class=\"column-1\">11.01.13<\/td><td class=\"column-2\">20nm-class (2y) 6Gb LPDDR3 mass production<\/td>\n<\/tr>\n<tr class=\"row-18\">\n\t<td class=\"column-1\">11.01.12<\/td><td class=\"column-2\">20nm-class (2y) 4Gb DDR3 mass production<\/td>\n<\/tr>\n<tr class=\"row-19\">\n\t<td class=\"column-1\">09.01.11<\/td><td class=\"column-2\">20nm-class (2x) 2Gb DDR3 mass production<\/td>\n<\/tr>\n<tr class=\"row-20\">\n\t<td class=\"column-1\">07.01.10<\/td><td class=\"column-2\">30nm-class 2Gb DDR3 mass production<\/td>\n<\/tr>\n<tr class=\"row-21\">\n\t<td class=\"column-1\">02.01.10<\/td><td class=\"column-2\">40nm-class 4Gb DDR3 mass production  <\/td>\n<\/tr>\n<tr class=\"row-22\">\n\t<td class=\"column-1\">07.01.09<\/td><td class=\"column-2\">40nm-class 2Gb DDR3 mass production<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<!-- #tablepress-211 from cache -->\n","protected":false},"excerpt":{"rendered":"<p>EUV-based 1st-gen 10nm-class DRAM (D1x) has completed its customer evaluations;\u00a0EUV to be fully deployed from 4th-gen 10nm-class DRAM (D1a) next year Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry&#8217;s first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based [&hellip;]<\/p>\n","protected":false},"author":84,"featured_media":38004,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[29740,29718,17557,29739],"tags":[757,24457,420,84],"blue-badge":[],"class_list":["post-37999","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-product-semiconductor-memory","category-product","category-semiconductor","category-product-semiconductor","tag-dram","tag-extreme-ultraviolet-euv-technology","tag-memory-storage","tag-semiconductor"],"acf":{"turn_off_retargeting":false},"fimg_mobile_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124206\/Samsung-DDR4-Module-sample.jpg","fimg_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2020\/03\/24124206\/Samsung-DDR4-Module-sample.jpg","primary_category":{"term_id":29740,"name":"Memory","slug":"product-semiconductor-memory","term_group":0,"term_taxonomy_id":29740,"taxonomy":"category","description":"","parent":29739,"count":44,"filter":"raw","term_link":"https:\/\/news.samsung.com\/us\/category\/product\/product-semiconductor\/product-semiconductor-memory\/","term_path":"product\/product-semiconductor\/product-semiconductor-memory"},"badge":"Press Release","_links":{"self":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts\/37999","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/users\/84"}],"replies":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/comments?post=37999"}],"version-history":[{"count":0,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/posts\/37999\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/media\/38004"}],"wp:attachment":[{"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/media?parent=37999"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/categories?post=37999"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/tags?post=37999"},{"taxonomy":"blue-badge","embeddable":true,"href":"https:\/\/news.samsung.com\/us\/wp-json\/wp\/v2\/blue-badge?post=37999"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}