Mark Campbell, Product Executive at Tarsus Distribution, expressed enthusiasm about the partnership, stating, “We are excited to rejoin forces with Samsung to bring their world-class display and storage solutions to our channel partners. This partnership underscores our dedication to providing cutting-edge technology and exceptional service, empowering partners, businesses and individuals to thrive in today’s competitive landscape.”

Under this agreement, Tarsus Distribution partners will soon gain access to a comprehensive range of smart and gaming monitors, along with storage solutions, distributed in South Africa by Samsung. This strategic collaboration aims to streamline access to innovative technology solutions, empowering businesses to stay ahead in an increasingly dynamic marketplace.

“We are thrilled to announce our partnership with Tarsus Distribution. This collaboration will enable us to expand the reach of our Enterprise portfolio, delivering innovative solutions to our customers with speed and efficiency. Our partnership with Tarsus Distribution further enables us to meet the evolving demands of the modern marketplace, providing unparalleled value to our channel partners and customers alike,” said Mike van Lier, Vice President of Consumer Electronics at Samsung South Africa.

This strategic relationship with Tarsus Distribution aligns seamlessly with Samsung’s commitment to providing innovative solutions to its customer base. Leveraging Tarsus Distribution’s extensive investments in digital tools and logistics systems, this partnership will ensure the swift and efficient delivery of Samsung’s cutting-edge visual display and storage solutions to meet the evolving demands of today’s interconnected market.

Tarsus Distribution partners will soon have access to a range of Samsung Odyssey Gaming, Viewfinity high resolution and best-in-class smart monitors and Samsung storage solutions: solid state drives (SSD): SATA, NVMe, Samsung portable SSD, and Samsung MicroSD.

Two times faster than previous models, users can transfer a 4GB video in two seconds

Maximum capacity of up to 4TB offers ample storage for pro-grade content

Samsung Electronics, one of the global leaders in advanced memory technology, has announced the release of its latest lineup of the T- series, the Portable Solid State Drive (SSD) T9. With its stylish and portable design, the T9 is built to keep data safe while on-the-go, empowering users with fast transfer speeds and ample storage, and providing the reliability and convenience they need.

“With advances in high-resolution photos and the rising popularity of 4K videos, professional content creators now face the necessity of transferring large amounts of data on a frequent basis,” said Hangu Sohn, Vice President of Memory Brand Product Biz Team at Samsung Electronics.  “The T9 offers a solution for professionals to alleviate the challenges that come with managing their data, and Samsung will continue to provide optimised memory solutions that enable professionals to fully concentrate on achieving their creative potential.”

Higher Performance and Massive Storage Capacity

The T9 offers maximum sequential read/write speeds of 2,000 megabytes-per-second (MB/s) on the USB 3.2 Gen 2×2 interface. Approximately two times faster than the previous model T7, speeds of this level allow users to transfer a 4-gigabyte (GB) Full HD video in nearly two seconds.

The T9 comes in three different capacity options to fit the needs of every creator. With 1-terabyte (TB), 2TB and 4TB varieties, the T9 makes it possible to complete quick and frequent transfers while providing ample storage for large volumes of data. Its compact size, similar to that of a credit card, allows creators to carry their inspiration wherever they go with the least of limitations on their creative process.

Luxury Added to Ruggedness

The T9 delivers not only the functional advantages, but also unique design benefits under the concept of ‘luxury added to ruggedness’ based on the ‘rugged’ design concept of the T7 Shield. The curved diagonal lines and reverse carbon patterns on the surface of T9 gives the rubber a fabric-like feel for the user, like a luxurious wallet.

Great Reliability and Thermal Control

Professional creators push the boundaries of what’s possible, and their data is invaluable. Resistant to drops of up to three meters high and guaranteed with a five-year limited warranty, the Portable SSD T9’s sturdy design is built to keep data safe with the reliability that users need and empowers them to pursue their most ambitious projects.

For creators who require fast and efficient large file transfers without slowdowns, the T9 is the perfect companion. With Samsung’s Dynamic Thermal Guard, it efficiently minimises the performance drops that can be caused by overheating, ensuring consistent and fast transfer speeds. Moreover, the T9 is designed in compliance with the international safety standard IEC 62368-1, making it an ideal choice for a wide range of demanding tasks with minimal heat transfer.

Manage T9 with Samsung Magician Software 8.0

The Samsung Magician software provides an enhanced experience for users through features such as performance benchmark, security functions, firmware updates and real time health status check. Firmware update is a very important feature for memory products, and Magician software is ready to solve any field issues that might occur. With the new 8.0 version released in September 2023, all Samsung software such as Data migration, PSSD software, Card authentication tool, will be integrated to Magician software and the OS support range will be expanded, for Windows, Mac and Android user convenience.

Seamless Compatibility

With proven experience in Portable SSD compatibility, Samsung has designed the T9 to meet the USB Type-C power spec and to support the seamless workflow of professional creators. This has enhanced compatibility across operating systems such as Windows, macOS, smartphones and tablets, gaming consoles and professional high-resolution cameras. The T9 also comes with USB Type C-to-C and USB Type C-to-A cables.

The Samsung Portable SSD T9 is available to consumers in the below specs and manufacturer’s suggested retail prices (MSRP).

Product:	Description:	Warranty	RRP* (incl. Vat)
MU-PG1T0B/WW	Samsung T9 Portable SSD 1 TB; Transfer speed up to 2000 MB/s; Write Speed to 1950 MB/s, USB 3.2 (Gen2x2, 20Gbps)  AES 256-bit hardware encryption, Windows®, macOS®, Android Compatible  Colour: Black	5 Years	2 999,00
MU-PG2T0B/WW	Samsung T9 Portable SSD 2 TB; Transfer speed up to 2000 MB/s; Write Speed to 1950 MB/s, USB 3.2 (Gen2x2, 20Gbps)  AES 256-bit hardware encryption, Windows®, macOS®, Android Compatible  Colour: Black	5 Years	4 999,00
MU-PG4T0B/WW	Samsung T9 Portable SSD 4 TB; Transfer speed up to 2000 MB/s; Write Speed to 1950 MB/s, USB 3.2 (Gen2x2, 20Gbps)  AES 256-bit hardware encryption, Windows®, macOS®, Android Compatible  Colour: Black	5 Years	9 499,00

Samsung Portable SSD T9 Product Specifications
Interface	USB 3.2 Gen 2×2 (20Gbps)
Hardware Information	Capacities 1)		1TB	2TB	4TB
	Dimensions 2)		88 x 60 x 14mm
	Weight 2)		122 grams
Performance	Sequential Read 3)		Up to 2,000 MB/sec	Up to 2,000 MB/sec	Up to 2,000 MB/sec
	Sequential Write 3)		Up to 1,950 MB/sec	Up to 1,950 MB/sec	Up to 2,000 MB/sec
Durability	Drop Resistant 4)		Up to 3m
Security	Encryption		AES 256-bit hardware encryption
	Software 5)		Samsung Magician Software
Compatibility	Operating System 6)		Windows®, macOS®, Android
	Device 6)		PCs, Laptops, Tablets, Smartphones
Reliability	Temperature 7)	Operating	0°C to 60°C
		Non-Operating	-40°C to 85°C
	Humidity		5% to 95% non-condensing
	Shock	Non-Operating	1,500G, duration: 0.5ms, 3 axis
	Vibration	Non-Operating	20~2,000Hz, 20G
Certifications			CE, BSMI, KC, VCCI, RCM, FCC, IC, UL, TUV, CB, EAC, UKCA, BIS
RoHS Compliance			RoHS 2
Warranty 8)			Five (5) Year Limited Warranty

¹1GB=1,000,000,000 bytes, 1TB=1,000,000,000,000 bytes. Lower capacity may be demonstrated by your computer due to use of a different measurement standard.

²The actual product weight and size may vary depending on the product’s capacity and measurement method.

³Performance may vary depending on host configuration, cable and user system environment. To reach maximum sequential read/write speeds of up to 2,000 MB/s, respectively, the host device and connection cables must support USB 3.2 Gen 2×2 and the UASP mode must be enabled.

*Test system configuration: ASUS ROG STRIX Z590-E GAMING WIFI, Intel i9-10900K CPU @ 3.70GHz, 3696 MHz, 10 Core(s), 20 Logical Processor(s) / DDR4 8GB DRAM frequency1132.3 MHz / Win 11 Pro

⁴Based on an internal free fall shock test conducted under controlled conditions. Drop resistance may vary depending on the actual environmental conditions. Damage caused by drop is not covered under warranty.

* Test condition: Device was dropped free-fall to a metal plate from 3-meter height.

** No warranty is provided for any physical damage.

⁵Samsung Magician software is available in Windows®, macOS® and Android. It requires Windows® 7 and higher, macOS® High Sierra (10.13.6) and higher, or Android 5.1 (Lollipop) and higher. Older versions of the Windows®, macOS®, and Android operating systems may not be supported.

⁶Compatibility with host devices may vary. Some operating systems may require T9 reformatting. T9 is backward compatible with USB 3.2, USB 3.1, USB 3.0 and USB 2.0.

⁷Tc is measured at the hottest point on the case. Sufficient airflow is recommended to be operated properly on heavier workload within device operating temperature.

⁸The LED component of the T9 is warranted for five (5) years of typical use, typical use for the purposes of this warranty defined as four (4) hours of operation per day at temperatures of 40℃ or below. For more information on the warranty, please visit https://semiconductor.samsung.com/consumer-storage/support/warranty

Samsung proudly supports Busan’s bid for the World Expo 2030.

AMD Radeon graphics technology to expanded portfolio of Samsung Exynos SoCs

Samsung Electronics Co., Ltd., one of the world’s leaders in advanced semiconductor technology, and AMD (NASDAQ: AMD) today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimised power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience.

“Together with AMD, Samsung has been revolutionising mobile graphics, including our recent collaboration that brought ray tracing capability to mobile processors for the first time in the industry,” said Seogjun Lee, executive vice president of Application Processor (AP) Development at Samsung Electronics. “Drawing on our technological know-how in designing ultra-low-power solutions, we will continue to drive ongoing innovation in the mobile graphics space.”

“We are excited Samsung selected multiple generations of our leadership high-performance Radeon graphics to advance the next generation of Samsung Exynos solutions,” said David Wang, senior vice president of the Radeon Technologies Group at AMD. “The extension of our work with Samsung is a testament to our strong technology partnership and commitment to bring the best experiences possible to mobile users.”

Samsung and AMD first announced their partnership to license AMD RDNA graphics architecture in 2019, leading to the co-development of Samsung Xclipse, a mobile graphics processing unit (GPU) based on the AMD RDNA 2 architecture in 2022. Xclipse was among the industry’s first mobile GPU with hardware-accelerated ray tracing and variable rate shading features for console-like gameplay on mobile devices.

Samsung proudly supports Busan’s bid for the World Expo 2030.

JOHANNESBURG, South Africa – 9 November 2021 –  Samsung recently shared a new insight that takes the world a step closer to realising neuromorphic chips that can better mimic the brain.

Envisioned by the leading engineers and scholars from Samsung and Harvard University, the insight was published as a Perspective paper, titled ‘Neuromorphic electronics based on copying and pasting the brain’, by Nature Electronics. Donhee Ham, Fellow of Samsung Advanced Institute of Technology (SAIT) and Professor of Harvard University, Professor Hongkun Park of Harvard University, Sungwoo Hwang, President and CEO of Samsung SDS and former Head of SAIT, and Kinam Kim, Vice Chairman and CEO of Samsung Electronics are the co-corresponding authors.

Image of rat neurons on CNEA (CMOS nanoelectrode array).

The essence of the vision put forward by the authors is best summed up by the two words, ‘copy’ and ‘paste’. The paper suggests a way to copy the brain’s neuronal connection map using a breakthrough nanoelectrode array developed by Dr. Ham and Dr. Park, and to paste this map onto a high-density three-dimensional network of solid-state memories, the technology for which Samsung has been pioneering. Through this copy and paste approach, the authors envision to create a memory chip that approximates the unique computing traits of the brain – low power, facile learning, adaptation to environment, and even autonomy and cognition – that have been beyond the reach of current technology.

The brain is made up of a large number of neurons, and their wiring map is responsible for the brain’s functions. Thus the knowledge of the map is the key to reverse engineering the brain. While the original goal of neuromorphic engineering, launched in the 1980s, was to mimic such structure and function of the neuronal networks on a silicon chip, it proved difficult because, even until now, little is known of how the large number of neurons are wired together to create the brain’s higher functions. Thus, the goal of neuromorphic engineering has been eased to designing a chip ‘inspired’ by the brain rather than rigorously mimicking it.

This paper suggests a way to return to the original neuromorphic goal of the brain reverse engineering. The nanoelectrode array can effectively enter a large number of neurons so it can record their electrical signals with high sensitivity. These massively parallel intracellular recordings inform the neuronal wiring map, indicating where neurons connect with one another and how strong these connections are. Hence from these tell-tale recordings, the neuronal wiring map can be extracted, or ‘copied’. The copied neuronal map can then be ‘pasted’ to a network of non-volatile memories – such as commercial flash memories that are used in our everyday life in solid-state drives (SSD), or ‘new’ memories such as resistive random access memories (RRAM) – by programming each memory so that its conductance represents the strength of each neuronal connection in the copied map.

(From the left) Donhee Ham, Fellow of Samsung Advanced Institute of Technology (SAIT) and Professor of Harvard University, Hongkun Park, Professor of Harvard University, Sungwoo Hwang, President and CEO of Samsung SDS (former Head of SAIT) and Kinam Kim, Vice Chairman and CEO of Samsung Electronics, the co-corresponding authors.

The paper takes a step further and suggests a strategy to rapidly paste the neuronal wiring map onto a memory network. A network of specially-engineered non-volatile memories can learn and express the neuronal connection map, when directly driven by the intracellularly recorded signals. This is a scheme that directly downloads the brain’s neuronal connection map onto the memory chip. Since the human brain has an estimated 100 billion or so neurons, and a thousand or so times more synaptic connections, the ultimate neuromorphic chip will require 100 trillion or so memories. Integrating such vast number of memories on a single chip would be made possible by 3D integration of memories, the technology led by Samsung that opened up a new era for memory industry.

Leveraging its leading experience in chip manufacturing, Samsung is planning to continue its research into neuromorphic engineering, in order to extend Samsung’s leadership in the field of next generation AI semiconductors. “The vision we present is highly ambitious,” said Dr. Ham. “But working toward such a heroic goal will push the boundaries of machine intelligence, neuroscience, and semiconductor technology.”