Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity. Built on its in-house 5-nanometer (nm)-based controller and eighth-generation V-NAND (V8) technology, the PM9E1 will provide powerful performance and enhanced power efficiency, making it an optimal solution for on-device AI PCs. Key attributes in SSDs, including performance, storage capacity, power efficiency and security, have all been improved compared to its predecessor (PM9A1a).

“Our PM9E1 integrated with a 5nm controller delivers industry-leading power efficiency and utmost performance validated by our key partners,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “In the rapidly growing on-device AI era, Samsung’s PM9E1 will offer a robust foundation for global customers to effectively plan their AI portfolios.”

Thanks to the eight-channel PCIe 5.0 interface, the sequential read and write speeds of the new SSD have more than doubled compared to the previous generation, reaching up to 14.5 gigabytes-per-second (GB/s) and 13GB/s, respectively. This powerful performance enables faster data transfer even with data-intensive AI applications, allowing a 14GB large language model (LLM) to be transferred from the SSD to DRAM in less than a second.

The PM9E1 offers a range of storage options, including 512GB, 1 terabyte (TB), 2TB and the industry’s largest capacity of 4TB. The 4TB option is especially an optimum solution for PC users in need of high-capacity storage for large-sized files such as AI-generated contents, data-heavy programs and high-resolution videos, as well as tasks that require intensive workloads such as gaming.

Additionally, the significantly improved power efficiency of over 50% allows for longer battery life which is ideal for on-device AI applications.

For stronger security measures, Samsung has applied Security Protocol and Data Model (SPDM) v1.2 to the PM9E1. The SPDM specification provides ‘Secure Channel,’ ‘Device Authentication’ and ‘Firmware Tampering Attestation’ technologies that can help prevent supply chain attacks involving forgery or manipulation of stored data in the product during production or distribution processes.

Starting with PM9E1, Samsung plans to expand its advanced SSD offerings to global PC makers and expects to launch PCIe 5.0-based consumer products in the future to solidify its leadership in the on-device AI market.

For me, what is most exciting about this milestone is that it highlights how far the semiconductor industry innovations have come today and provides a glimpse into the evolutions that will shape the industry of tomorrow.

Consider that the 5nm process is here in just six months after last October’s unveiling of the first commercial application of EUV in our 7nm process. It’s a rapid progress made possible in large part by running thousands of wafer layers through EUV exposure systems each week. Hands-on experience is the only way to ascend the EUV learning curve, and that body of knowledge is growing daily.

In the learning process, we’re seeing one of the biggest and broadest benefits of EUV – the simplification of design by moving away from increasingly complex multi-patterning lithography strategies. While still early, it’s increasingly clear that the reduced number of mask steps and more straightforward process is nothing short of a revolution for silicon designers. Sighs of relief will be heard as EUV will be seamlessly incorporated into the existing design architectures.

Samsung’s 5nm is the next step in the evolution of EUV. 5nm will be more efficient and feature new innovations including Samsung’s proprietary Smart Diffusion Break (SDB) transistor architecture. One of the most important aspects of 5nm is that it supports 25 percent area reduction and 10 percent performance improvement or 20 percent power reduction than 7nm.

Also, it will be largely design-rule compatible with the existing design of 7nm. Therefore, it is essentially a recharacterization of the technology, not redesign, which will substantially reduce time and the cost of implementation. This combination of technological advance and economic advantage is very much in line with a grand tradition of the semiconductor industry.

This merging of technological advancement and economic benefits is very much in line with the grand tradition in the semiconductor industry as well as technologies including 5G, AI, Connected & Automotive, Robot, etc. – constantly serving as a catalyst for the fourth industrial revolution, while simultaneously driving costs down. That’s why the evolution-moment of 5nm is, in its own unique way, as important as the innovation-moment of 7LPP.

Bringing EUV into production has been a long, challenging process. It required substantial investment of time, money, and human resources. While there were certainly moments of doubt along the way, we had to pursue our vision. The 5nm announcement offers compelling evidence for the value of the investment. As businesses from diverse fields including Foundry, Fabless, the Design House, Packaging, Tests, etc., the semiconductor ecosystem will grow stronger. This is a new chapter for the semiconductor industry, and we are excited to be part of the continued journey in innovation.