The event, held today in Santa Clara, California, features top Samsung executives and industry experts reviewing progress on semiconductor technologies and foundry platform solutions that enable developments in artificial intelligence (AI), machine learning, 5G networking, automotive, the Internet of Things (IoT), advanced data centers and many other domains.

“We stand at the verge of the Fourth Industrial Revolution, a new era of high-performance computing and connectivity that will advance the daily lives of everyone on the planet,” said Dr. ES Jung, President and head of Foundry Business at Samsung Electronics.

“Samsung Electronics fully understands that achieving powerful and reliable silicon solutions requires not only the most advanced manufacturing and packaging processes as well as design solutions, but also collaborative foundry-customer relationships grounded on trust and shared vision. This year’s Foundry Forum is filled with compelling evidence of our commitment to progress in all those areas, and we’re honored to host and converse with our industry’s best and brightest,” Dr. Jung added.

Highlights from the U.S. Foundry Forum include:

The New 3nm GAE PDK Version 0.1 is Ready

Samsung’s 3nm Gate-All-Around (GAA) process, 3GAE, development is on track. The company noted today that its Process Design Kit (PDK) version 0.1 for 3GAE has been released in April to help customers get an early start on the design work and enable improved design competitiveness along with reduced turnaround time (TAT).

Compared to 7nm technology, Samsung’s 3GAE process is designed to provide up to a 45 percent reduction in chip area with 50 percent lower power consumption or 35 percent higher performance. The GAA-based process node is expected to be widely adopted in next-generation applications, such as mobile, network, automotive, Artificial Intelligence (AI) and IoT.

Conventional GAA based on nanowire requires a larger number of stacks due to its small effective channel width. On the other hand, Samsung’s patented version of GAA, MBCFET (Multi-Bridge-Channel FET), uses a nanosheet architecture, enabling greater current per stack.

While FinFET structures must modulate the number of fins in a discrete way, MBCFET provides greater design flexibility by controlling the nanosheet width. In addition, MBCFET’s compatibility with FinFET processes means the two can share the same manufacturing technology and equipment, which accelerates process development and production ramp-up.

Samsung recently taped out the 3GAE test vehicle design and will focus on improving its performance and power efficiency going forward.

For more information, please refer to the Newsroom links for GAA infographic and video clip.

The Launching of a New SAFE–Cloud Program

As part of its ongoing efforts to support and enhance customers’ entire design workflow, Samsung Electronics launched the Samsung Advanced Foundry Ecosystem Cloud (SAFE-Cloud) program. It will provide customers with a more flexible design environment through collaboration with major public cloud service providers, such as Amazon Web Services (AWS) and Microsoft Azure, as well as leading Electronic Design Automation (EDA) companies, including Cadence and Synopsys.

To date, most foundry customers have built and managed design infrastructure on their own servers. The SAFE-Cloud program reduces this burden and supports easier, faster and more efficient design efforts by providing an excellent turnkey design environment with extensive process information (PDK, design methodologies), EDA tools, design assets (IP, library) and design services.

Customers can be assured of as much server and storage space as they need, as well as a safe environment optimized for chip design, due to Samsung Electronics’ verification of SAFE-Cloud’s security, applicability and expandability.

Utilizing the SAFE-Cloud platform, Samsung was able to accelerate the development of its 7nm and 5nm cell libraries in collaboration with Synopsys. In addition, Samsung, Gaonchips – a fabless design company in Korea – and Cadence have successfully completed design verification based on the platform.

“Making up-front investments in high-performance computing (HPC) servers and systems can be a challenge for a company like us,” said Kyu Dong Jung, CEO of Gaonchips. “SAFE-Cloud offers us a very flexible design environment without requiring investment in additional infrastructure, as well as reduced design TAT. I expect this program to provide more tangible business and technical benefits to us and the entire fabless industry.”

Process Technology Roadmap and Advanced Packaging Updates  

Samsung’s roadmap includes four FinFET-based processes from 7nm down to 4nm that leverage extreme ultraviolet (EUV) technology as well as 3nm GAA, or MBCFET.

In the second half of this year, Samsung is scheduled to start the mass production of 6nm process devices and complete the development of 4nm process.

The product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020.

Extensions of the company’s FD-SOI (FDS) process and eMRAM together with an expanded set of state-of-the-art package solutions were also unveiled at this year’s Foundry Forum. Development of the successor to the 28FDS process, 18FDS, and eMRAM with 1Gb capacity will be finished this year.

Samsung Electronics, the world leader in advanced semiconductor technology, today announced its latest Exynos 7 Series 7904, a mobile processor with enhanced multimedia support that allows high-end features in mid-range smartphones. Customized for the Indian consumer needs, the cost effective processor is optimized to deliver high-end multimedia capabilities in the mid-range smartphones.

Exynos 7904 delivers fast octa-core performance required for nimble web browsing and app launching on a smartphone. The cutting-edge technology enables enhanced user experience through excellent network speed and smooth multitasking while consuming less power.

“Samsung is committed to bringing world-class innovative technologies for the consumers. With smartphones driving the digital revolution, Indian market has great potential. The Exynos 7 Series 7904 will enable advanced mobile experiences in a broader range of devices with triple-camera support, powerful performance and connectivity,” said Rajeev Sethi, Senior Director and Head of Sales and Marketing, Device Solutions, Samsung India.

Exynos 7904’s image signal processor (ISP) supports single-camera resolution of up to 32-megapixels (MP) and an advanced triple-camera setup for high-resolution imaging and a number of new features. For instance, a third camera in a smartphone can take panoramic pictures with wide angles or add bokeh effects for aesthetic blur in portraits or scenery shots with more ease. The new mobile processor supports up to faster FHD at 120 frames-per-second (fps) or UHD at 30fps of video playback, and up to FHD+ display for vivid and near perfect mobile entertainment.

Built on a 14-nanometer (nm) process, the Exynos 7 Series 7904 is equipped with two Cortex^®-A73 cores that run at 1.8-gigahertz (GHz), and six Cortex^®-A53 cores at 1.6 GHz. With a powerful Cortex^®-A73 as a ‘big-core’ Exynos 7904 delivers fast single-core performance required for nimble web browsing, app launching and many other key operations on a smartphone. The embedded LTE modem supports Cat.12 3-carrier aggregation (CA) for 600-magbits-per-second (Mbps) downlink speed.

The Exynos 7 Series 7904 is currently in mass production. For more information about Samsung’s Exynos products, please visit www.samsung.com/exynos.

Samsung ISOCELL image sensors fall into four categories—Fast, Slim, Bright and Dual—depending on their key attributes. As market demand for sleeker smartphones with advanced features increases, ISOCELL Fast 2L9 and Slim 2X7 both offer high resolution image sensors in small chip packages, delivering detailed pictures in low-light environments without a camera bump.

ISOCELL Fast 2L9

With Dual Pixel technology, the ISOCELL Fast 2L9 delivers ultra-fast auto-focus at a reduced pixel size from the previous Dual Pixel sensor’s 1.4μm to 1.28μm. Dual Pixel technology employs two photodiodes in each and every pixel of the sensor instead of only one. With 12 million focus detecting pixels, the sensor is able to not only quickly focus on small still objects, but also lock on and track moving objects without losing focus, even in low-light environments. With smaller pixel size, the ISOCELL Fast 2L9 can fit into slimmer camera modules, enabling bump-less designs for smartphones. Dual Pixel technology especially allows depth-of-field effect for taking bokeh, or aesthetically out-of-focused photographs, through a traditional single lens camera.

ISOCELL Slim 2X7

At 0.9μm, the ISOCELL Slim 2X7 is the first sensor in the industry to have the pixel size below 1.0μm. Even with such a small pixel size, the Slim 2X7 is able to provide high color fidelity with less noise due to the improved ISOCELL technology’s deeper DTI (deep trench isolation) that reduces color crosstalk and expands the full-well capacity to hold more light information. In addition, the small 0.9μm pixel size enables a 24Mp image sensor to be fitted in a thinner camera module, allowing premium smartphones to offer high resolution cameras in a very slim and elegant design.

The ISOCELL Slim 2X7 is also packed with Tetrapixel technology, which lets the sensor take brighter photographs in the dark and more detailed ones in well-lit environments. Tetrapixel improves performance in low-light situations by merging four neighboring pixels to work as one to increase light sensitivity. In bright environments, Tetrapixel uses a re-mosaic algorithm to produce full resolution images. This enables consumers to use the same front camera to take photos in various lighting conditions.

“Samsung ISOCELL Fast 2L9 and ISOCELL Slim 2X7 are new image sensors that fully utilize Samsung’s advanced pixel technology, and are highly versatile as they can be placed in both front and rear of a smartphone,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics. “Samsung plans to further develop the Dual Pixel and 0.9μm-pixel product categories, and expand applicable devices for ISOCELL image sensors that can enhance photographing experiences for consumers.”

* Technological term of “Tetrapixel” was updated in July 2022

Samsung Electronics, a world leader in advanced digital component solutions, today announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-leading efficacy and reliability for spotlights and high-bay lighting applications.

The LM101B and the LH231B packages are based on Samsung’s state-of-the-art, fillet-enhanced CSP (FEC) technology, which forms TiO2 walls around the chip surface to reflect its light output toward the top, acting as a plastic mold in conventional EMC-based LEDs.

With their FEC design, the packages provide a higher light efficacy level compared to Samsung’s previous generation of CSP LEDs*. The more focused beam also helps to eliminate cross-talk between neighboring packages and enables the new packages to be placed in close proximity to one another, offering greater flexibility to luminaire designers.

“Our FEC line-up represents an outstanding set of highly advanced LED component solutions that accommodates a variety of luminaire designs from below 1,000lm to well over 10,000lm,” said Jacob Tarn, executive vice president of LED Business Team at Samsung Electronics. “Samsung will continue to pave the way for widespread adoption of CSP technology in the mainstream lighting market, bringing greater performance and cost benefits to a growing number of lighting manufacturers.”

LM101B: 1W-class mid-power FEC

The LM101B features the highest efficacy among currently available mid-power CSP LEDs with 200lm/W (Ra80 5000K, 65mA, 25˚C). Furthermore, with low thermal resistance (2K/W) and high reliability (0.5W, 105˚C, L90>50000 hours), the LM101B has been optimized for spotlights and high-bay applications where high efficacy and long lifespan are required.

LH231B: 5W-class high-power FEC

With an operating current of 2A (max. 6W), the LH231B offers an efficacy of 170lm/W (Ra70 5000K, 700mA, 85˚C). This is the same high efficacy level offered by ceramic-based high-power LEDs, one that can bring a high degree of cost-effectiveness when applied to high-bay applications that require an output between 5,000 and 10,000lm. Thanks to Samsung’s FEC structure, the 120-degree beam angle allows for simple optic designs, making it also suitable for outdoor applications, such as street and parking lot lighting.

The LM101B and LH231B complement the currently available 3W-class high-power LH181B CSP LED, and the entire FEC lineup is now in mass production.

*Editorial Note: Previous-generation CSP LEDs create a wider beam angle by emitting light through the top and side surfaces of a package that has been coated in phosphor film.

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its image sensor brand ‘ISOCELL^®’ as well as demonstrated leading-edge solutions at the 2017 Mobile World Congress (MWC) Shanghai.

Samsung’s brand for its image sensor lineup is named after the company’s own ISOCELL technology, which is the optimum solution for today’s devices that require ultra-slim designs with high quality cameras. First introduced in 2013, ISOCELL technology separates each pixel with a physical barrier that reduces color crosstalk among pixels. This allows high color fidelity, enabling excellent image quality even with smaller pixels.

Samsung ISOCELL is underlined by four technological sub-brands—Bright, Fast, Slim and Dual—that respond to specific market demands:

• ISOCELL Bright sensors deliver bright and sharp images with high color fidelity and reduced noise in low light environments
• ISOCELL Fast sensors provide fast autofocus onto still or moving objects even when dark
• ISOCELL Slim sensors adopt the smallest pixel sizes available in the market at 0.9-1.0um, yet produce high quality images for the slimmest devices
• ISOCELL Dual sensors can be mixed and matched in various combinations on consumer devices to bring about features demanded in the latest dual camera trend

“Samsung ISOCELL is a brand that represents the essence of our leading pixel technologies. We expect the ISOCELL brand to help consumers easily acknowledge and confide in camera performance as well as overall quality of the device,” said Ben Hur, Vice President of System LSI marketing at Samsung Electronics. “With our advanced image sensor technologies, Samsung will continue to bring innovation to cameras used in smartphones and other applications.”

At MWC Shanghai, Samsung will be featuring advanced logic solutions, including the Exynos 9 series with 10-nanometer FinFET process technology, for a wide range of platforms such as mobile, Virtual Reality (VR) and wearable devices.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10-nanometer (nm) FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology.

The new Exynos 9 Series 8895 is the first processor of its kind to embed a gigabit LTE modem that supports five carrier aggregation, or 5CA. It delivers fast and stable data throughput at max.1Gbps (Cat.16) downlink with 5CA and 150Mbps (Cat.13) uplink with 2CA.

The Exynos 8895 is an octa-core processor, comprising of four of Samsung’s 2^nd generation custom designed CPU cores for improved performance and power efficiency in addition to four Cortex®-A53 cores. With Samsung Coherent Interconnect (SCI) technology, the latest processor integrates a heterogeneous system architecture that allows faster computing for a wide range of applications such as artificial intelligence, and deep learning.

The Exynos 8895 also delivers unsurpassed multimedia experience with its powerful GPU and multi-format codec (MFC) as well as next level 3D graphic performance that minimizes latency for 4K UHD VR and gaming experience with ARM®’s latest Mali-G71 GPU.

In addition, with its advanced MFC, the processor supports video recording and playback at a maximum resolution of 4K UHD at 120fps. It also comes with video processing technology that enables a higher quality experience by enhancing the image quality; for example, for VR (Virtual Reality) applications, the Exynos 8895 delivers a realistic and immersive VR video experience at 4K resolution.

The Exynos 8895 has a separate processing unit for enhanced security solutions required for mobile payments that use iris or fingerprint recognition as well as an embedded Vision Processing Unit (VPU) that can recognize and analyze items or movements for improved video tracking, panoramic image processing, and machine vision technology.

“In addition to being built on the most advanced 10nm FinFET process technology, the new Exynos 9 Series 8895 incorporates Samsung’s cutting-edge technologies including a 2^nd generation custom CPU, gigabit LTE modem, and more” said Ben Hur, Vice President of System LSI marketing at Samsung Electronics. “With industry leading technologies like VPU, the Exynos 8895 will drive the innovation of next generation smartphones, VR headsets, and automotive infotainment system.”

The Exynos 9 Series 8895 is currently in mass production.

For more information about Samsung’s Exynos products, please visit www.samsung.com/exynos