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Semiconductors (502/552)

Eight Major Steps to Semiconductor Fabrication, Part 3: The Integrated Circuit

May 6, 2015

In the previous part of this series, we explained how an oxide layer is formed and protects the wafer’s surface against impurities. Since the wafer is now protected with a silicon dioxide (SiO2) layer, it is ready to be imprinted with the circuit pattern, which contains the numerous densely packed electronic components such as transistors, diodes, resistors and capacitors. So, let’s take a look at how the designs for the microscopic structures are created.

For more information, please see :
https://news.samsung.com/global/eight-major-steps-to-semiconductor-fabrication-part-3-the-integrated-circuit

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