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Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging

June 21, 2016

Samsung Electronics, a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP”, a line-up of LED packages which features chip-scale packaging* and flexible circuit board technology, for use in automotive lighting applications.

For more information, please see:
https://news.samsung.com/global/samsung-introduces-new-line-up-of-led-components-for-automotive-lighting-featuring-chip-scale-packaging

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