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Samsung Unveils New Chipsets to Enhance Next Generation 5G RAN Portfolio

June 22, 2021

Samsung Electronics today unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC) and a Digital Front End (DFE)-RFIC integrated chip. The company’s latest chips will power Samsung’s next-generation products for 5G build out, including the next generation 5G Compact Macro, Massive MIMO radios and baseband units, which will all be commercially available in 2022.

For more information, please see:
https://news.samsung.com/global/samsung-unveils-new-chipsets-to-enhance-next-generation-5g-ran-portfolio

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