Name: Samsung Unveils New Chipsets to Enhance Next Generation 5G RAN Portfolio
Uploaded: 2021-06-23T12:06:52+08:00
Channel: Ainur Naena Binti Jamaludin
Description: Samsung Electronics today unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC) and a Digital Front End (DFE)-RFIC integrated chip. The company’s

Samsung Unveils New Chipsets to Enhance Next Generation 5G RAN Portfolio

23-06-2021

Press Release
Samsung Unveils Next-Generation RF Chipsets for 5G Base Stations at MWC 2019

25-02-2019

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