The evolution of mobile network technology has changed our lives gradually and dramatically. Such progress has seeped into our everyday lives and changed the way we communicate, spend our free time, and how we work.

Until the year 2010, communication was mostly voice and text-based. Over the past 13 years, we’ve seen consistent technology advancements from 4G to 5G and beyond, and we’re now able to enjoy ultra-high-definition, large-capacity multimedia content, anytime, anywhere.

Mobile network technology has redefined the cultural landscape of connections at all levels — between people to people, business to business and industry to industry.

Software Is at the Heart of Mobile Network Evolution, Moving Toward Virtualization

At Samsung, we have been focused on identifying the key technology that will drive mobile network transformation and we think the answer is software.

Venture capitalist Marc Andreessen once said, “software is eating the world.” Just like this famous phrase, global industries are being ‘eaten’ by software and this dynamic transition is called ‘virtualization’ in the network infrastructure world. Whereas hardware is the foundation for traditional networks, virtualization is all about shifting to software.

Virtualization lets you transform many hardware functions and features into software, allowing various services to run on a single hardware platform. Simply put, it works similar to downloading and regularly updating a range of apps on your smartphone.

vRAN Will Eat up the Network Infrastructure World

Samsung has been spearheading the shift toward network virtualization and openness. We introduced the first fully virtualized Radio Access Network also known as vRAN. Although vRAN currently accounts for just 3 percent¹ of the global RAN market, it is a pioneering technology that the industry is watching closely.

Samsung has been a forerunner in the innovative path to vRAN, proving our outstanding performance and wide-scale commercialization capabilities in the real-world, leading expansion in major 5G markets, including Asia, Europe and North America.

We supported the largest-scale commercial vRAN for the first time in the world with Verizon in 2020, and since then, have been providing stable and reliable 5G services to millions of customers. We also began our collaboration with DISH Wireless and Vodafone Group, actively expanding our vRAN footprint to new markets, including the U.K., Germany and beyond.

With the innovations that we are bringing to virtualization, we are creating the blueprint for next-generation networks. We are not only committed to advancing our technology, but more importantly, onboarding and growing the best software talents, which we believe is a central pillar to our achievements.

Samsung Networks Chipset: Packaging the Essence of Our Innovation and Technological Capabilities

The power of chipsets not only radiates through hardware-based networks, but also in software-centric virtualized architectures. While most functions and features are being turned into software, there are still integral parts of the network that remain as hardware. Therefore, the ability to pack advanced features into a tiny chipset is one of our invaluable asset.

Our competitive advantage stems from our unique combination of expertise in innovative software solutions and our comprehensive portfolio of hardware combined with our 5G network chipsets.

Samsung is the only major network vendor that has the capability to design, develop and manufacture 4G and 5G network chipsets in-house.

With the rising market demand for higher energy efficiency, as well as support for complex spectrum bands and reduced hardware footprint, there has been a stronger emphasis on chipset technologies.

Compared to previous generations, our latest 5G chipset reduces base station energy consumption by about 40 percent and antenna size by nearly half compared to previous products, and also includes support for multiple spectrum bands.

With a strong foundation built on over 40 years of experience in network technologies, we have managed to stay ahead of evolving market demands, introducing a compact and lightweight radio with high performance and energy efficiency.

Building a Better Tomorrow With Energy Savings Technology

The true value of innovation is not just about advancing technology, but it’s also about pursuing a better tomorrow. Ranging from software to AI and chipsets, sustainability has always been at the core of our product development strategy. Bringing our sustainability vision to life, we are introducing our newest energy saving features for vRAN at MWC this year.

As legendary hockey player Wayne Gretzky once said, “a good hockey player plays where the puck is. A great hockey player plays where the puck is going to be.”

As we continue along our exciting journey, Samsung will always think a step ahead, anticipating future needs of our customers. And, as a pioneer in the mobile network industry, Samsung will continue to drive this paradigm shift by jumpstarting the next wave of unforeseen innovation.

¹ Source: Dell’Oro (3Q, 2022)

The new chipsets were announced today at “Samsung Networks: Redefined,” the company’s virtual public event highlighting notable 5G accomplishments and new solutions for network transformation. At the event, Samsung emphasized its experience in developing in-house chipsets for more than two decades and reiterated the significant investments behind the launch of multiple generations of chipsets starting from 3G, leading to today’s cutting-edge 5G solutions.

The newly introduced chipsets are designed to take Samsung’s next generation 5G lineup to a new level, boosting performance, increasing power efficiency and reducing the size of the 5G solutions.

Samsung’s newly-introduced chips are:

• 3^rd Generation mmWave RFIC:
  This new chip follows prior generation RFICs from Samsung. The first generation, introduced in 2017, powered the company’s 5G FWA solutions supporting the world’s first 5G home broadband service in the U.S. Two years later, the second generation powered Samsung’s 5G Compact Macro, the industry’s first mmWave 5G NR radio, which has since been widely deployed in the U.S.
  
  Samsung’s 3^rd generation RFIC chip supports both 28GHz and 39GHz spectrums, and will be embedded in Samsung’s next generation 5G Compact Macro. The chip incorporates advanced technology that reduces antenna size by nearly 50%, maximizing the 5G radio’s interior space. Moreover, the latest RFIC chip improves power consumption, resulting in a more compact-sized, lightweight 5G radio. Lastly, output power and coverage of the new RFIC chip have increased, doubling output power of the next generation 5G Compact Macro.

• 2^nd Generation 5G Modem SoC:
  Samsung’s first 5G modem SoCs, introduced in 2019, powered the company’s new 5G baseband unit and Compact Macro. To date, more than 200,000 of these 5G modem SoCs have been shipped.
  
  This new second generation chip will enable Samsung’s forthcoming baseband unit to have twice the capacity, while cutting power consumption in half per cell, in comparison to the previous generation. Moreover, supporting both below-6GHz and mmWave spectrums, it offers beamforming and increased power efficiency for Samsung’s next generation 5G Compact Macro and Massive MIMO radio, while reducing the size for both solutions.

• DFE-RFIC Integrated Chip:
  In 2019, the first Digital/Analog Front End (DAFE) chip was introduced by Samsung, serving as an essential component of 5G radios (including Samsung’s 5G Compact Macro), by converting analog-to-digital and vice versa, and supporting both 28GHz and 39GHz spectrums.
  
  This new chip combines RFIC and DFE functions for both below-6GHz and mmWave spectrums. By integrating these functions, the chip not only doubles frequency bandwidth, but also reduces the size and increases output power for Samsung’s next generation solutions, including 5G Compact Macro.

“This newly unveiled chipset is the fundamental component of our state-of-art 5G solutions, developed through a long-standing R&D effort that enables Samsung to be at the forefront of delivering cutting-edge 5G technologies,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “As one of the largest semiconductor companies in the world, we are committed to developing the most innovative chips for the next phase of 5G advancement, integrated with the features mobile operators seek to stay competitive.”

“5G chipsets are critical to achieving the performance capabilities required for next-generation network deployments,” stated Anshel Sag, Moor Insights & Strategy. “Samsung’s long-standing expertise in developing chipsets in-house is a key differentiator, positioning it as a leader in the delivery of 5G network solutions with the features and benefits operators seek to advance their 5G strategies.”

Samsung has pioneered the successful delivery of 5G end-to-end solutions including chipsets, radios, and core. This includes the creation and shipment of innovative chips from Samsung’s manufacturing facility in Austin, Texas. Through ongoing research and development, Samsung drives the industry to advance 5G networks with its market-leading product portfolio from fully virtualized RAN and Core to private network solutions and AI-powered automation tools. The company is currently providing network solutions to mobile operators that deliver connectivity to hundreds of millions of users around the world.

The new RFICs 5G chipset

Samsung Electronics today announced that it has successfully completed the development of its cutting-edge mmWave Radio Frequency Integrated Circuits (RFICs) and Digital/Analog Front End (DAFE) ASICs, supporting 28GHz and 39GHz bands.

Samsung’s new RFICs and DAFE ASICs, the core components in the 5G chipset, enable about 25 percent reduction in size, weight and power consumption for 5G base stations when compared to the previous iterations. 5G base stations using these new chipsets are more efficient in operation and roll-out.

“Our breakthroughs in 5G R&D have been the key driving forces behind the successful 5G commercial services across the U.S. and Korea in 2018, with over 36,000 5G base station shipments,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Networks Business at Samsung Electronics. “At the forefront of ushering in the wave of 4th Industrial Revolution, Samsung will continue to accelerate 5G commercialization ultimately impacting the overall industries and everyday lives by offering ultra-low latency, ultra-high speed, and massive connectivity.”

To achieve ultra-fast data speeds, 5G base stations use almost one thousand antenna element and several RFICs to utilize the mmWave spectrum. The adoption of RFICs plays a crucial role in supporting the reduction in the size and power consumption of base stations. Samsung’s new RFICs using cutting-edge 28nm CMOS semiconductor technology operate on bandwidths that have been expanded to a maximum 1.4GHz, compared to 800MHz for previous RFICs. The size of RFIC is reduced by 36 percent and the overall performance is enhanced by decreasing the noise level and improving the linearity characteristics of the RF power amplifier.

Samsung has developed RFIC solutions for 28GHz and 39GHz and plans to commercialize additional RFICs for 24GHz and 47GHz this year, allowing further expansions into markets that will utilize these higher frequency bands.

Samsung has also developed its own DAFE as an ASIC, low in power consumption and small in size. The DAFE is essential for digital wireless telecommunications as it provides analog-to-digital conversions and vice versa. The 5G DAFE manages large bandwidths of many that are hundreds of MHz and developing an ASIC allows for the reduction in size and power consumption of 5G base stations. Without investing in ASICs, the DAFE on its own would be too big and power insufficient to meet the product needs of carriers.

“Samsung is building on its 5G leadership with its innovative solutions including low-power RFICs and DAFE ASICs to pioneer a new era of digital transformation,” said Jaeho Jeon, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “We’re pleased to announce our completion of development on these new chipsets, which will play vital roles in pushing the advancement of technologies to the next level.”

DAFE ASICs chipset

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Exynos Modem 5100, the industry’s first 5G modem that is fully compatible with 3rd Generation Partnership Project (3GPP) Release 15 (Rel.15), the most up-to-date standard specification for 5G New Radio (5G-NR). Built on power-efficient 10-nanometer (nm) process technology, the new modem also supports legacy radio access technologies designed into a single chip.

“Samsung’s leadership in communication technologies and market-proven knowledge allowed us to develop the industry’s first 5G modem, the Exynos Modem 5100, which fully complies with the latest 3GPP standards,” said Dr. Inyup Kang, president and head of System LSI Business at Samsung Electronics. “As the industry prepares the shift toward 5G, Samsung will continue to drive the growth of innovative ideas and new services in mobile applications and other emerging industries.”

Samsung successfully conducted an over-the-air (OTA) 5G-NR data call test under a wireless environment utilizing a 5G base station and 5G end-user equipment prototype embedded with Exynos Modem 5100. As the test simulated real-world cellular network conditions, this will ensure faster development and commercialization of 5G mobile devices that adopt this new modem. Samsung is also working closely with a number of global mobile carriers and partners to quickly bring 5G mobile communications to the market.

The Exynos Modem 5100 supports both sub-6GHz and mmWave spectrums specified in 3GPP’s 5G standard as well as legacy networks, including 2G GSM/CDMA, 3G WCDMA, TD-SCDMA, HSPA, and 4G LTE, with a single chip solution. As 5G is expected to be first deployed over existing network infrastructures, commercial implementation will benefit from the single-chip design that maximizes data transmission efficiency and reliability between other communication networks.

The modem delivers a maximum downlink speed of up to 2-gigabits per second (Gbps) in 5G’s sub-6-gigahertz (GHz) settings and 6Gbps in mmWave settings, which are about 1.7 and five times the data transfer speeds of its predecessor respectively. Fast and stable data communication can also be secured in 4G networks with the downlink speed of 1.6Gbps.

5G’s capability to transmit large-capacity data and real-time low-latency communication is expected to bring new user experiences not only in mobile but also in areas such as the Internet of Things (IoT), ultra-high resolution videos, holograms, real-time artificial intelligence (AI) and autonomous driving.

Exynos Modem 5100 is also offered with radio frequency IC (RFIC), Envelope Tracking (ET) and power management IC (PMIC) solutions, and will be available to customers by the end of 2018.
More information about Samsung’s Exynos products can be found at: http://www.samsung.com/exynos.

“Samsung has been hard at work for several years on the various foundation technologies that go into the 5G RFIC,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Next Generation Communications Business Team at Samsung Electronics. “We’re excited to finally bring all the pieces together and announce this important milestone on the path to commercial 5G. This will have a big role to play in the upcoming connectivity revolution.”

Samsung announced the new RFIC at a 5G mobile technologies workshop held at the Korean Institute of Communications and Information Sciences. The company presented details on the development and strengths of the chip and outlined its role on the roadmap to commercial 5G products.

The RFIC itself is designed to greatly strengthen the overall performance of 5G access units (the 5G ‘base station’) and Samsung has placed a strong emphasis on designing for low cost, high efficiency and compact form factors. Each of these criteria is expected to play a critical role in delivering on the promises of 5G.

The RFIC incorporates a high-gain/high-efficiency power amplifier, a technology Samsung announced in June last year. This means the chip can provide extended coverage in the millimeter wave (mmWave) band, overcoming one of the primary challenges of high frequency spectrum. At the same time, Samsung’s RFIC is capable of greatly improved transmission and reception performance. The RFIC’s ability to reduce phase noise in its operating band enables clearer radio signals even in noisy environments where signal quality loss would otherwise disrupt high-speed communications. Completing the chip is a compact chain of 16 low loss antennae, which further enhance overall efficiency and performance.

Samsung’s current RFIC is slated for use in the 28GHz mmWave spectrum band that has very quickly become a primary target for early 5G deployments in markets such as the U.S., Korea and Japan. With development on the chip complete, Samsung is now accelerating its plans for 5G commercial product readiness, with the first RFIC-equipped solutions expected to be announced early next year.

Expect more key announcements from Samsung at Mobile World Congress, Feb. 27 – March 2.