Name: Samsung Unveils New Chipsets to Enhance Next Generation 5G RAN Portfolio
Uploaded: 2021-06-22T19:42:03+05:30
Channel: Malay anil
Description: Samsung Electronics today unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second-generation 5G modem System-on-Chip (SoC), and a Digital Front End (DFE)-RFIC integrated chip. The company’s latest

Samsung Unveils New Chipsets to Enhance Next Generation 5G RAN Portfolio

22-06-2021

Press Release
Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation

24-05-2018

Press Release

Press Release
Fast-Facts
Media Library
RSS