FiRa Consortium
Tag > FiRa Consortium
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Press Release Samsung Announces Ultra-Wideband Chipset With Centimeter-Level Accuracy for Mobile and Automotive Devices March 21, 2023
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[Q&A] Speakers From SDC22 Share Insights on Samsung’s Latest Updates October 13, 2022
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[Interview] Meet the Engineers Responsible for the Global Standardization of UWB November 6, 2020
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Key Industry Players The ASSA ABLOY Group, HID, NXP, Samsung, Bosch, Sony, LitePoint and TTA Establish FiRa Consortium to Drive Seamless User Experiences Using Ultra-Wideband Technology August 1, 2019