Samsung Promotes ‘Smart and Green Experience’

Samsung Mobile Solutions Forum is one of the most exciting events in the IT industry. Since it first began in 2004, many prominent leaders of the industry have participated in the forum and exchanged exciting ideas and far-reaching insights on the future of mobile communications technology.

This year on September 29, Samsung Electronics held the eighth annual SMS Forum at the Westin Taipei Hotel (Taiwan), where it launched several technologies and devices which support the next wave of enhanced solutions for mobile applications. At the ‘Smart and Green Experience’ event, Samsung also discussed future technology and business opportunities with industry executives.  The president of Samsung Electronics’ Device Solutions started the conference with this commencement:

And now, a closer look at the products launched and featured at the event:

Exynos 4212 is a dual core ARM Cortex™-A9 application processor, designed with Samsung’s advanced 32nm High-K Metal Gate (HK/MG) low-power process. Samsung’s 32nm HKMG process node is specifically tuned to offer a competitive, cutting-edge platform with double the logic density and a 30 percent lower power-level than the previous processor generation.

In addition to the 25%increase in processing power, the new processor features an enhanced graphics processing unit (GPU) that is capable of delivering 50 percent higher 3D graphics performance over Samsung’s previous processor generation. Also it incorporates a rich portfolio of advanced codec accelerators that support digital still images, video recording and play-back at 1080p full-HD resolution, an image signal processor and an on-chip HDMI 1.4 interface. More information can be found at www.samsung.com/exynos

LP DDR3 supports faster processors, high resolution displays and 3D graphics in high-end next- generation mobile devices. According to a research report from IHS iSuppli, the market for LPDDR3 DRAM will expand sharply starting in 2013. Samsung will be readying for the market by mass producing more components in 2012.  This will thereby encourage faster adoption of premium mobile DRAM solutions throughout the mobile electronics industry.

The new 4Gb LPDDR3 DRAM can transfer data at up to 1,600 megabits per second (Mbps), which is approximately 1.5 times faster than the industry’s current highest performance LPDDR2, which operates at 1,066Mbps. The new component also consumes 20 percent less electrical power than its predecessor.

To accommodate the growing need for higher density mobile memory solutions to process large amounts of data, the maximum amount of mobile DRAM in high-end mobile devices will grow from 1GB (8Gb) up to 2GB (16Gb) by early next year. These densities will be available by stacking four 4Gb LPDDR3 chips. For more information about Samsung Green memory, visit www.samsung.com/GreenMemory

CMOS Image Sensors

A CMOS imaging chip is a type of active pixel sensor made using the CMOS semiconductor process. Extra circuitry next to each photo sensor converts the light energy to a voltage. CMOS can potentially be implemented with fewer components, use less power, and/or provide faster readout than CCDs. 

The S5K2P1, designed for advanced smartphones as well as digital still cameras and camcorders, is a new 1/2.3-inch 16 Megapixel (Mp) CMOS image sensor with Samsung’s advanced 1.34 micrometer (um) backside illumination (BSI) pixel technology. It supports a native 16:9 format video at up to 8.3Mp resolution at 60 frames per second and maximum 16 Megapixel-resolution for point-and-shoot images at 30 frames per second without any shutter lag effect.

Using Samsung’s advanced 1.34um BSI pixel technology; the S5K2P1 delivers excellent sensitivity and low-noise recording. It also provides brighter and more vivid pictures even at night or in dark indoor conditions.

The 5K8AA, mainly built for front-facing cameras on mobile devices, is a high resolution 1.2-Megapixel (Mp), 1/8.2-inch CMOS image sensor (CIS) system-on-chip (SoC).  These key feature requirements are supported while providing 1.2Mp resolution with outstanding low-light sensitivity, and they fit into a 5.5 x 5.5mm camera module with an extreme 2.8mm low profile. Also it allows for shots of 30 frames per second (fps) at HD (720p) video and 60fps at VGA resolution.  Finally, it achieves excellent low-light sensitivity during real-time video capture by utilizing Samsung’s enhanced 1.4 micrometer (um) backside illumination (BSI) pixel technology.

The S5K8AA imager is a SoC design with an integrated image signal processor for high-density, compact measurements and optimized ISP functionality. Raising the bar for user-facing cameras, the advanced performance and high-resolution of the S5K8AA imager provides users with high-quality, vivid images for video calls on smartphones and tablet devices.

eMMC embedded NAND solution – This new 64GB embedded multimedia card (e-MMC) provides the industry’s highest performance and thinnest profile available, utilizing Samsung’s leading-edge 64-gigabit (Gb) NAND with a toggle DDR 2.0 interface and the company’s latest 20 nanometer (nm) class* processor technology.

The 64GB e-MMC is being produced for high-end mobile devices in an extremely thin, eight-die stack, only 1.4 millimeters thick. It processes random write commands at 400 input/output operations per second (IOPS), which is quadruple the speed of many conventional e-MMC solutions made with 30nm-class NAND flash memory chips.

The component features sequential read speeds of up to 80 megabytes per second (MB/s) and sequential write speeds of 40MB/s, a more than 3X improvement over high-end external mobile memory cards that now offer sequential speeds of 24MB/s and 12MB/s, respectively.

Samsung Mobile Solution Forum 2011 lived up to its expectations, introducing top-class innovative technologies to make the next generation mobile devices smarter and greener. Samsung Electronics will continue to push the bar to make your smartphones, tablets, and what other smart devices there may be thinner, ligher, faster and more efficient.